In-body power source having high surface area electrode
Power sources that enable in-body devices, such as implantable and ingestible devices, are provided. Aspects of the in-body power sources of the invention include a solid support, a first high surface area electrode and a second electrode. Embodiments of the in-power sources are configured to emit a detectable signal upon contact with a target physiological site. Also provided are methods of making and using the power sources of the invention.
1. An in-body medical device comprising:
an integrated circuit substrate comprising a surface and a circuitry element;
a first electrode coupled to the circuitry element and comprising:
a first active electrode material;
a first surface; and
a second surface;
a second electrode connected to the surface of the integrated circuit substrate and coupled to the circuitry element, wherein the second electrode is electrically isolated from the first electrode and comprises a second active electrode material that is different from the first active electrode material; and
an electrically conductive porous under-layer interposed between the first surface of the first electrode and the surface of the integrated circuit substrate, the electrically conductive porous under-layer comprising an inert metal or an oxidizable metal; wherein the electrically conductive porous under-layer is configured to provide a surface area enhancement to the first electrode, wherein the electrically conductive porous under-layer is configured to improve adhesion, and wherein the electrically conductive porous under-layer is a layer that is contiguous to and mechanically supports the first electrode; and
wherein the in-body medical device is suitable for human ingestion or implantation.
2. The in-body medical device according to claim 1 , wherein the device is dimensioned to be ingestible.
3. The in-body medical device according to claim 1 , wherein the electrically conductive porous under-layer comprises an element selected from the group consisting of: Au, Cu, Pt, Ir, Pd, Rh and Ru and alloys thereof.
4. The in-body medical device according to claim 1 , wherein the electrically conductive porous under-layer comprises an element selected from the group consisting of: Ti and W and alloys thereof.
5. The in-body medical device according to claim 1 , wherein the electrically conductive porous under-layer has a thickness ranging from 0.1 to 100 μm.
6. The in-body medical device according to claim 1 , wherein the first electrode is formed on the same surface of the integrated circuit substrate as the second electrode.
7. The in-body medical device according to claim 1 , wherein:
the surface of the integrated circuit substrate comprises a first substrate surface to which the first electrode is connected via the electrically conductive porous under-layer and a second substrate surface to which the second electrode is connected; and
the first substrate surface is arranged opposite to the second substrate surface.
8. The in-body medical device according to claim 1 , wherein the device comprises a pharmaceutically acceptable carrier composition.
9. The in-body medical device according to claim 8 , wherein the pharmaceutically acceptable carrier composition is in the form of a tablet.
10. The in-body medical device according to claim 8 , wherein the pharmaceutically acceptable carrier composition is in the form of a capsule.
11. The in-body medical device according to claim 8 , wherein the pharmaceutically acceptable carrier composition comprises an active agent.
12. The device of claim 1 , wherein the second surface is uncovered by the electrically conductive porous under-layer.
13. A system comprising:
a receiver; and
an in-body medical device suitable for human ingestion or implantation, wherein the in- body medical device is configured to communicate with the receiver, the in-body medical device comprising:
an integrated circuit substrate comprising a surface and a circuitry element;
a first electrode coupled to the circuitry element and comprising:
a first active electrode material;
a first surface; and
a second surface;
a second electrode connected to the surface of the integrated circuit substrate and coupled to the circuitry element, wherein the second electrode is electrically isolated from the first electrode and comprises a second active electrode material that is different from the first active electrode material; and
an electrically conductive porous under-layer interposed between the first surface of the first electrode and the surface of the integrated circuit substrate, the electrically conductive porous under-layer comprising an inert metal or an oxidizable metal; wherein the electrically conductive porous under-layer is configured to provide a surface area enhancement to the first electrode, wherein the electrically conductive porous under-layer is configured to improve adhesion, and wherein the electrically conductive porous under-layer is a layer that is contiguous to and mechanically supports the first electrode.
14. The system according to claim 13 , wherein said receiver is an in vivo receiver.
15. The system according claim 13 , wherein said receiver is an ex vivo receiver.
16. The system according to claim 13 , wherein the electrically conductive porous under-layer is provided by electrodeposition.
17. The system according to claim 13 , wherein the electrically conductive porous under-layer is provided by cathodic arc deposition.
18. The system according to claim 13 , wherein the electrically conductive porous under-layer is provided by electrophoretic deposition.
19. The system of claim 13 , wherein the second surface is uncovered by the electrically conductive porous under-layer.