MICRO-WIRE CONNECTION PAD
A connection-pad structure includes a substrate and a An electrical conductor including a plurality of micro-wires form an electrically continuous connection pad on or in the substrate. An electrical connector is electrically connected to the electrical conductor.
1 . A connection-pad structure, comprising:
a substrate;
an electrical conductor including a plurality of electrically connected micro-wires forming a connection pad physically associated with the substrate; and
an electrical connector electrically connected to the connection pad.
2 . The connection-pad structure of claim 1 , further including a conductive particle electrically connected to a micro-wire.
3 . The connection-pad structure of claim 2 , wherein the conductive particle is on or above the substrate.
4 . The connection-pad structure of claim 2 , further including a plurality of conductive particles electrically connected to one micro-wire.
5 . The connection-pad structure of claim 2 , wherein the conductive particle is in direct electrical contact with the electrical connector.
6 . The connection-pad structure of claim 2 , wherein at least one of the micro-wires has a width that is greater than a diameter of the conductive particle.
7 . The connection-pad structure of claim 1 , further including a conductive paste electrically connecting the electrical connector to wherein at least one of the micro-wires.
8 . The connection-pad structure of claim 1 , wherein the conductive paste is a solder.
9 . The connection-pad structure of claim 2 , wherein the conductive particle includes a metal, or a metal alloy.
10 . The connection-pad structure of claim 1 , further including:
a plurality of groups of micro-wires, wherein each group of electrically connected micro-wires is electrically connected and forms an electrically distinct connection pad;
and
a plurality of electrically distinct electrical connectors, each electrically distinct electrical connector electrically connected a corresponding connection pad.
11 . The connection-pad structure of claim 10 , wherein each of the micro-wires in a group has a micro-wire width and the connection pads are spatially separated by a distance greater than the micro-wire width.
12 . The connection-pad structure of claim 10 , wherein the plurality of electrically distinct electrical connectors is part of a common electrical connection cable.
13 . The connection-pad structure of claim 10 , wherein each electrically distinct electrical connector is aligned with a connection pad.
14 . The connection-pad structure of claim 10 , further including a plurality of conductive particles, wherein one or more conductive particles is in electrical contact with each connection pad and in electrical contact with the electrical connector corresponding to the connection pad.
15 . The connection-pad structure of claim 14 , further including at least one conductive particle electrically connected to the electrical connector that is not electrically connected to a micro-wire.
16 . The connection-pad structure of claim 15 , wherein the at least one conductive particle electrically connected to the electrical connector that is not electrically connected to a micro-wire is located on the substrate between the connection pads or between the micro-wires.
17 . The connection-pad structure of claim 14 , wherein the connection pads are spatially separated by a distance greater than a largest diameter of the conductive particles.
18 . The connection-pad structure of claim 10 , further including a conductive paste electrically connecting each electrical connector to the corresponding connection pad.
19 . The connection-pad structure of claim 1 , wherein the micro-wires in a connection pad form an array of parallel line segments and form an electrical connection between the micro-wires in the array at one end of the line segments.
20 . The connection-pad structure of claim 1 , wherein the micro-wires in a connection pad form an array of parallel line segments and form an electrical connection between the micro-wires in the array at both ends of the line segments.
21 . The connection-pad structure of claim 1 , wherein the micro-wires in a connection pad form an array of parallel line segments and form spatially offset electrical connections between the micro-wires in the array.
22 . The connection-pad structure of claim 1 , wherein the micro-wires in a connection pad form a grid.
23 . The connection-pad structure of claim 1 , wherein the micro-wires include first micro-wires having a first width extending in a first direction and second micro-wires having a second width different from the first width extending in a second direction different from the first direction.