Method for manufacturing semiconductor device
A sample semiconductor device is manufactured and the curvature of the sample is measured. An area is set to be removed from an encapsulation resin layer on the basis of the measurement value. After forming the encapsulation resin layer during the process of manufacturing the semiconductor device, the removal area is removed.
1. A method for manufacturing a semiconductor device, comprising:
manufacturing a sample semiconductor device;
taking a measurement value relating to curvature of the sample;
determining a removal region constituting a region for removal from a sealing resin layer covering one surface of the semiconductor device positioned on the opposite side of a substrate when the semiconductor device is mounted on said substrate in accordance with the measurement value, wherein the removal region includes a projecting region which is a region of the sealing resin layer whereof the height from the substrate exceeds a predetermined height when the sample is mounted on the substrate; and
manufacturing the semiconductor device, wherein manufacturing the semiconductor device comprises forming the sealing resin layer, after which the removal region is removed.
2. The method of claim 1 , wherein the sample and the semiconductor device are both provided with a wiring board, a semiconductor chip and a sealing resin layer, and the wiring board, semiconductor chip and sealing resin layer of the sample and the wiring board, semiconductor chip and sealing resin layer of the semiconductor device are both made of the same materials, or are made of materials which at least have the same thermal expansion coefficient.
3. The method of claim 1 , wherein manufacturing the semiconductor device comprises:
preparing a wiring board having a plurality of product areas defined by dicing lines;
mounting one or more semiconductor chips in each of the plurality of product areas;
forming a sealing resin layer on the wiring board in such a way as to cover the plurality of product areas all together;
removing the removal region from the sealing resin layer by means of laser marking; and
separating the product into individual product areas by cutting the wiring board and the sealing resin layer along the dicing lines.
4. The method of claim 3 , wherein a mark is formed by means of laser marking in each portion of the sealing resin layer corresponding to the plurality of product areas, before, after or concurrently with removing the removal region.
5. The method of claim 1 , wherein the curvature is concave, and the removal region includes an outer edge of the sealing resin layer.
6. The method of claim 1 , wherein the curvature is convex, and the removal region includes essentially the center of the sealing resin layer.