Semiconductor device
In one semiconductor device, a semiconductor chip has first and second pad electrodes disposed on the main surface thereof, insulating films that cover the main surface of the semiconductor chip, a rewiring layer that is disposed between the insulating films, and a plurality of external terminals disposed on the top of the insulating film. The plane size of the first pad electrode and the second pad electrode differ from one another, and the first pad electrode and the second pad electrode are connected to any of the plurality of external terminals via the rewiring layer.
1. A semiconductor device comprising:
a semiconductor chip having a plurality of transistors, a plurality of first pad electrodes and a plurality of second pad electrodes; and
a wiring structure provided on the semiconductor chip, wherein the wiring structure includes a plurality of external terminals, a plurality of wiring patterns that electrically connect the plurality of external terminals and the plurality of first pad electrodes, and bridge wiring that is not electrically connected to any of the plurality of external terminals within the wiring structure, but that electrically connects the plurality of second pad electrodes in a shared fashion.
2. The semiconductor device according to claim 1 , wherein a same power supply voltage appears in the plurality of second pad electrodes.
3. The semiconductor device according to claim 2 , wherein the semiconductor chip further includes an internal voltage generation circuit that receives an external power supply voltage supplied via the plurality of first pad electrodes and generates an internal power supply voltage, and the internal power supply voltage appears on the plurality of second pad electrodes.
4. The semiconductor device according to claim 2 , wherein the same voltage as the external power supply voltage supplied via the plurality of first pad electrodes appears on the plurality of second pad electrodes.
5. The semiconductor device according to claim 1 , wherein the area of the plurality of first pad electrodes is greater than the area of the plurality of second pad electrodes.
6. The semiconductor device according to claim 1 , wherein the semiconductor chip further includes a plurality of first bump electrodes formed on the plurality of first pad electrodes, and a plurality of second bump electrodes formed on the plurality of second pad electrodes, the wiring structure further includes an insulating substrate, a plurality of first connecting electrodes connected to the plurality of first bump electrodes, and a plurality of second connecting electrodes connected to the plurality of second bump electrodes, the plurality of external terminals is formed on a first surface of the insulating substrate, and the plurality of first and second bump electrodes is formed on a second surface of the insulating substrate, the plurality of wiring patterns electrically connect the plurality of first connecting electrodes and the plurality of external terminals, and the bridge wiring electrically connects the plurality of second connecting electrodes in a shared fashion.
7. The semiconductor device according to claim 6 , wherein the plurality of first bump electrodes is disposed in the center region of a main surface of the semiconductor chip, and the plurality of second bump electrodes is disposed in the outer peripheral region of the main surface of the semiconductor chip.
8. The semiconductor device according to claim 7 , wherein the plan shape of the plurality of first bump electrodes is square, and the plan shape of the plurality of second bump electrodes is either circular or polygonal in which all the internal angles are obtuse angles.
9. The semiconductor device according to claim 6 , wherein each of the plurality of first and second bump electrodes includes a pillar portion standing on the corresponding first or second pad electrode, and a solder layer provided on the top end surface of the pillar portion, and the angle formed between the top end surface of the pillar portion and the side surface in contact with the top end surface is an acute angle.
10. The semiconductor device according to claim 1 , wherein the semiconductor chip further includes a plurality of first bump electrodes formed on the plurality of first pad electrodes, and a second bump electrode provided covering two or more of the second pad electrodes included in the plurality of second pad electrodes, and that connects in a shared fashion the two or more second pad electrodes.
11. The semiconductor device according to claim 10 , wherein one of the two or more second pad electrodes is provided on first wiring formed on a wiring layer of the uppermost layer of the semiconductor chip, and another one of the two or more second pad electrodes is provided on second wiring formed on the wiring layer of the uppermost layer and at least separated from the first wiring on the wiring layer of the uppermost layer.
12. The semiconductor device according to claim 11 , wherein the first wiring and the second wiring are short-circuited by a wiring layer that is different from the wiring layer of the uppermost layer.
13. The semiconductor device according to claim 1 , wherein the wiring structure further includes an insulating layer that covers the main surface of the semiconductor chip on which the plurality of first and second pad electrodes is formed, and the plurality of through holes provided penetrating the insulating layer, and in which the plurality of first and second pad electrodes is exposed, and the wiring patterns and the bridge wiring is made from conductors provided on the first insulating layer and within the plurality of through holes.