Multi-die MEMS package

1. An apparatus comprising:

a controller integrated circuit (IC) configured to couple to a circuit board;

a via layer mounted to a first side of the controller IC;

a device layer having multiple moveable portions and a single anchor, the device layer configured to allow in-plane movement and out-of-plane movement of one or more of the moveable portions, and the single anchor configured to support the multiple moveable portions; and

wherein the via layer is coupled to the device layer at a perimeter of the device layer and at the anchor, the via layer including electrically isolated regions configured to provide electrodes for out-of-plane movement of one or more of the multiple moveable portions.

2. The apparatus of claim 1 , including a plurality of solder interconnects coupled to the circuit board and the control IC.

3. The apparatus of claim 1 , wherein the apparatus includes an inertial sensor.

4. The apparatus of claim 3 , wherein the inertial sensor includes an inertial sensor having six degrees of freedom.

5. The apparatus of claim 1 , including

a cap layer couple to the device layer opposite the controller IC.

6. The apparatus of claim 5 , wherein the device layer is coupled directly to the controller IC at a perimeter of the device layer and at the single anchor.

7. The apparatus of claim 1 , wherein the controller IC includes an application specific IC (ASIC).

8. The apparatus of claim 1 , including a high voltage controller IC configured to supply voltage to drive the device layer into resonance.

9. The apparatus of claim 8 , wherein the high voltage controller IC is mounted to the controller IC.

10. The apparatus of claim 8 , wherein the controller IC includes a first application specific IC (ASIC); and

wherein the high voltage controller IC includes a second ASIC.

11. An apparatus comprising:

a controller integrated circuit (IC) configured to couple to a circuit board;

a microelectromechanical system (MEMS) IC mounted to a first side of the controller IC;

a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side;

wherein the MEMS IC is coupled to the through silicon via; and

a high voltage controller IC configured to supply voltage to drive the MEMS IC into resonance.

12. The apparatus of claim 8 , wherein the high voltage controller IC is mounted to the controller IC.

13. The apparatus of claim 8 , wherein the controller IC includes a first application specific IC (ASIC); and

wherein the high voltage controller IC includes a second ASIC.

14. The apparatus of claim 11 , wherein the MEMS IC includes an inertial sensor.

15. The apparatus of claim 14 , wherein the inertial sensor includes an inertial sensor having six degrees of freedom.

16. The apparatus of claim 11 , wherein the MEMS IC includes:

a device layer having multiple moveable portions and a single anchor, the device layer configured to allow in-plane movement and out-of-plane movement of one or more of the moveable portions, and the single anchor configured to support the multiple moveable portions; and

a cap layer couple to the device layer opposite the controller IC.

17. The apparatus of claim 16 , wherein the inertial sensor includes a via layer coupled to the device layer at a perimeter of the device layer and at the anchor, the via layer including electrically isolated regions configured to provide out-of-plane electrodes of the inertial sensor.

18. The apparatus of claim 16 , wherein the device layer is coupled directly to the controller IC at a perimeter of the device layer and at the single anchor.

19. The apparatus of claim 11 , wherein the controller IC includes an application specific IC (ASIC).