IP Library Granted Patent US 10,128,812
Granted Patent B2
US 10,128,812 · App. 14/815,157 · Granted Nov 13, 2018

Electrical resonator

Inventors: Kevin J. Grannen (Thornton, CO); Carrie A. Rogers (Fort Collins, CO); John Choy (Westminster, CO)
Assignee: Avago Technologies International Sales Pte. Limited
H03H9/02102H01L41/18H03H3/04H03H9/173H03H9/583H03H9/587H03H2003/021H03H2003/0407H03H2003/0442Y10T29/42
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,128,812
App. No.
14/815,157
Granted
Nov 13, 2018
Kind
B2
Abstract

An acoustic resonator comprises a substrate comprising a cavity. The electrical resonator comprises a resonator stack suspended over the cavity. The resonator stack comprises a first electrode; a second electrode; a piezoelectric layer; and a temperature compensating layer comprising borosilicate glass (BSG).

Claims (20)

1. An acoustic resonator, comprising:

a substrate;

a cavity in the substrate; and

a resonator stack suspended over the cavity and comprising:

a first electrode; a second electrode; a piezoelectric layer; and a temperature compensation layer comprising borosilicate glass (BSG) wherein a concentration of boron in the temperature compensation layer is in a range of approximately 0.1% to approximately 5.0% by weight percent, or by atomic percent.

2. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer is disposed between the first electrode and the piezoelectric layer.

3. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer is disposed between the second electrode and the piezoelectric layer.

4. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer is disposed over the substrate and beneath the first electrode.

5. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer is disposed over the second electrode.

6. An acoustic resonator as claimed in claim 1 , wherein the resonator stack is a first resonator stack, and the temperature compensation layer is a first temperature compensation layer, and the acoustic resonator further comprises a second resonator stack disposed over the first resonator stack, the second resonator stack comprising: a third electrode; a fourth electrode; a second piezoelectric layer; and a second temperature compensation layer comprising borosilicate glass (BSG).

7. An acoustic resonator as claimed in claim 6 , wherein the second temperature compensation layer is disposed between the fourth electrode and the second piezoelectric layer.

8. An acoustic resonator as claimed in claim 6 , wherein the second temperature compensation layer is disposed over the second electrode and beneath the third electrode.

9. An acoustic resonator as claimed in claim 6 , wherein the second temperature compensation layer is disposed over the fourth electrode.

10. An acoustic resonator as claimed in claim 6 , wherein a concentration of boron in the second temperature compensation layer is in a range of approximately 0.1% to approximately 5.0% by weight percent, or by atomic percent.

11. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer has a thickness in the range of approximately 500 Å to approximately 2000 Å.

12. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer has a thickness in the range of approximately 200Å to approximately 10000 Å.

13. An acoustic resonator as claimed in claim 6 , wherein the first temperature compensation layer and the second temperature compensation layer each have a thickness in the range of approximately 500 Å to approximately 2000 Å.

14. An acoustic resonator as claimed in claim 6 , wherein the first temperature compensation layer and the second temperature compensation layer each have a thickness in the range of approximately 200Å to approximately 10000 Å.

15. An acoustic resonator as claimed in claim 1 , wherein a concentration of boron in the BSG in the temperature compensation layer is low enough to prevent reflow of the piezoelectric layer, but high enough to enable adequate temperature compensation of the acoustic resonator.

16. An acoustic resonator as claimed in claim 6 , wherein a concentration of boron in the BSG in each of the first and second temperature compensation layers is low enough to prevent reflow of the piezoelectric layer, but high enough to enable adequate temperature compensation of the acoustic resonator.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE MERGER AND APPLICATION NOS. 13/237,550 AND 16/103,107 FROM THE MERGER PREVIOUSLY RECORDED ON REEL 047231 FRAME 0369. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048549/0113 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047231/0369 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2015
From: GRANNEN, KEVIN J.; ROGERS, CARRIE A.; CHOY, JOHN
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 036736/0077 →
Continuity (2)
Division 12494886 · Jun 30, 2009
Related Publication 20150341015A1 · Nov 26, 2015