IP Library Granted Patent US 10,090,822
Granted Patent B2
US 10,090,822 · App. 14/866,273 · Granted Oct 2, 2018

Surface acoustic wave (SAW) resonator

Inventors: Stephen Roy Gilbert (San Francisco, CA); Richard C. Ruby (Menlo Park, CA)
Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
H03H9/02574H03H9/02866H03H9/6483H03H9/02614
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Quick Facts
Patent No.
US 10,090,822
App. No.
14/866,273
Granted
Oct 2, 2018
Kind
B2
Abstract

A surface acoustic wave (SAW) resonator includes a piezoelectric layer disposed over a substrate, and a plurality of electrodes disposed over the first surface of the piezoelectric layer. A layer is disposed between the substrate and the piezoelectric layer. A surface of the layer has a smoothness sufficient to foster atomic bonding between layer and the piezoelectric layer. A plurality of features provided on a surface of the substrate reflects acoustic waves and reduce the incidence of spurious modes in the piezoelectric layer.

Claims (38)

1. A surface acoustic wave (SAW) resonator structure, comprising:

a substrate having a first surface and a second surface, the first surface having a plurality of features;

a piezoelectric layer disposed over the substrate, the piezoelectric layer having a first surface and a second surface;

a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and

a layer disposed between the first surface of the substrate and the second surface of the piezoelectric layer, a first surface of the layer being atomically smooth to foster atomic bonding between the first surface of the layer and the second surface of the piezoelectric layer, wherein the plurality of features reflect acoustic waves and reduce an incidence of a plurality of spurious modes in the piezoelectric layer, and the acoustic waves reflected from the plurality of features destructively interfere with acoustic waves in the piezoelectric layer.

2. A SAW resonator structure as claimed in claim 1 , wherein the features in the first surface of the substrate are substantially pyramidal in shape.

3. A SAW resonator structure as claimed in claim 1 , wherein the plurality of features each have a height of approximately one-fourth of a wavelength (¼ λ) of a spurious mode.

4. A SAW resonator structure as claimed in claim 1 , wherein the plurality of features each have a height in a range of approximately 0.25 μm to approximately 1.5 μm.

5. A SAW resonator structure as claimed in claim 1 , wherein the plurality of features each have a height in a range of approximately 0.1 μm to approximately 2.50 μm.

6. A SAW resonator structure as claimed in claim 1 , wherein the plurality of features have a plurality of heights, and each of the pluralities of heights is a height of approximately one-fourth of a wavelength (¼ λ) of one of the plurality of spurious modes.

7. A SAW resonator structure as claimed in claim 1 , wherein the layer comprises an oxide material.

8. A SAW resonator structure as claimed in claim 7 , wherein the oxide material comprises silicon dioxide (SiO 2 ).

9. A surface acoustic wave (SAW) filter comprising a plurality of SAW resonator structures, one or more of the plurality of SAW resonator structures comprising:

a substrate having a first surface and a second surface, the first surface having a plurality of features;

a piezoelectric layer disposed over the substrate, the piezoelectric layer having a first surface and a second surface;

a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and

a layer disposed between the first surface of the substrate and the second surface of the piezoelectric layer, a first surface of the layer being atomically smooth to foster atomic bonding between the first surface of the layer and the second surface of the piezoelectric layer, wherein the plurality of features reflect acoustic waves and reduce an incidence of a plurality of spurious modes in the piezoelectric layer, and the acoustic waves reflected from the plurality of features destructively interfere with acoustic waves in the piezoelectric layer.

10. A SAW filter as claimed in claim 9 , wherein the plurality of features in the first surface of the substrate are substantially pyramidal in shape.

11. A SAW filter as claimed in claim 9 , wherein each of the plurality of features have a height of approximately one-fourth of a wavelength (¼ λ) of a spurious mode.

12. A SAW filter as claimed in claim 11 , wherein each of the plurality of features have a height in a range of approximately 0.25 μm to approximately 1.5 μm.

13. A SAW filter as claimed in claim 11 , wherein each of the plurality of features have a height in a range of approximately 0.1 μm to approximately 2.50 μm.

14. A SAW filter as claimed in claim 11 , wherein the plurality of features have a plurality of heights, and each of the plurality of heights is height of approximately one-fourth of a wavelength (¼ λ) of one of the plurality of spurious modes.

15. A SAW filter as claimed in claim 9 , wherein the SAW filter is a ladder filter, comprising the plurality of SAW resonator structures.

16. A SAW filter as claimed in claim 9 , wherein the layer comprises an oxide material.

17. A SAW filter as claimed in claim 16 , wherein the oxide material comprises silicon dioxide (SiO 2 ).

18. A SAW filter as claimed in claim 16 , wherein the first surface of the layer has a root-mean-square (RMS) variation in height of approximately 1.0 Å to approximately 10.0 Å or less.

19. A SAW filter as claimed in claim 9 , wherein two or more of the plurality of SAW resonator structures are configured in a series and shunt configuration.

20. A surface acoustic wave (SAW) resonator structure, comprising:

a substrate having a first surface and a second surface, the first surface having a plurality of features;

a piezoelectric layer disposed over the substrate, the piezoelectric layer having a first surface and a second surface;

a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and

a layer comprising silicon dioxide, and disposed between the first surface of the substrate and the second surface of the piezoelectric layer, the plurality of features have a plurality of heights, and each of the plurality of heights is approximately one-fourth of a wavelength (¼ λ) of one of a plurality of spurious modes, wherein the plurality of features reflect acoustic waves and reduce an incidence of the plurality of spurious modes in the piezoelectric layer.

21. A SAW resonator structure as claimed in claim 20 , wherein, the acoustic waves reflected from the plurality of features destructively interfere with acoustic waves in the piezoelectric layer.

22. A SAW resonator structure as claimed in claim 20 , wherein the plurality of features in the first surface of the substrate are substantially pyramidal in shape.

23. A SAW resonator structure as claimed in claim 20 , wherein the plurality of features are substantially not in a regular pattern.

24. A SAW resonator structure as claimed in claim 20 , wherein each of the plurality of heights is in a range of approximately 0.25 μm to approximately 1.5 μm.

25. A SAW resonator structure as claimed in claim 20 , wherein each of the plurality of heights is in a range of approximately 0.1 μm to approximately 2.50 μm.

26. A SAW resonator structure as claimed in claim 20 , wherein a first surface of the layer has a root-mean-square (RMS) variation in height of approximately 0.1 Å to approximately 10.0 Å.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE MERGER AND APPLICATION NOS. 13/237,550 AND 16/103,107 FROM THE MERGER PREVIOUSLY RECORDED ON REEL 047231 FRAME 0369. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048549/0113 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047231/0369 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2015
From: GILBERT, STEPHEN ROY; RUBY, RICHARD C.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037291/0088 →
Continuity (2)
Continuation In Part 14835679 · Aug 25, 2015
Related Publication 20170063338A1 · Mar 2, 2017