IP Library Granted Patent US 10,523,178
Granted Patent B2
US 10,523,178 · App. 14/866,394 · Granted Dec 31, 2019

Surface acoustic wave (SAW) resonator

Inventors: Stephen Roy Gilbert (San Francisco, CA); Richard C. Ruby (Menlo Park, CA)
Assignee: Avago Technologies International Sales Pte. Limited
H03H9/02574H03H9/02622H03H9/02866H03H9/6483H03H9/02614
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Quick Facts
Patent No.
US 10,523,178
App. No.
14/866,394
Granted
Dec 31, 2019
Kind
B2
Abstract

A surface acoustic wave (SAW) resonator includes a piezoelectric layer disposed over a substrate, and a plurality of electrodes disposed over the first surface of the piezoelectric layer. A layer is disposed between the substrate and the piezoelectric layer. A surface of the layer has a smoothness sufficient to foster atomic bonding between layer and the substrate. A plurality of features provided on a surface of the piezoelectric layer reflects acoustic waves and reduces the incidence of spurious modes in the piezoelectric layer.

Claims (40)

1. A surface acoustic wave (SAW) filter comprising a plurality of SAW resonator structures, one or more of the plurality of SAW resonator structures comprising:

a polycrystalline or monocrystalline silicon substrate having a first surface and a second surface;

a piezoelectric layer disposed over the polycrystalline or monocrystalline silicon substrate, the piezoelectric layer having a first surface, and a second surface comprising a plurality of features, wherein at least some of the plurality of features have a height of approximately one-fourth of a wavelength (¼ λ) of a spurious mode;

a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and

an oxide layer disposed between the first surface of the polycrystalline or monocrystalline silicon substrate and the second surface of the piezoelectric layer, a second surface of the oxide layer being atomically smooth to foster atomic bonding between a second surface of the oxide layer and the first surface of the polycrystalline or monocrystalline silicon substrate, wherein at least some of the plurality of features have a height in a range of approximately 0.1 μm to approximately 2.50 μm, and the plurality of features reflect acoustic waves and reduce an incidence of a plurality of spurious modes in the piezoelectric layer.

2. A SAW filter as claimed in claim 1 , wherein at least some of the plurality of features in the second surface of the piezoelectric layer have substantially slanted sides.

3. A SAW filter as claimed in claim 1 , wherein the plurality of features are substantially not in a regular pattern.

4. A SAW filter as claimed in claim 1 , wherein the SAW filter is a ladder filter, comprising the plurality of SAW resonators structures.

5. A SAW filter as claimed in claim 1 , wherein the oxide layer comprises silicon dioxide (SiO 2 ).

6. A SAW filter as claimed in claim 1 , wherein two or more of the plurality of SAW resonator structures are configured in a series and shunt configuration.

7. A SAW filter as claimed in claim 1 , wherein the oxide layer comprises phosphosilicate glass (PSG).

8. A SAW filter as claimed in claim 1 , wherein the oxide layer comprises borosilicate glass (BSG).

9. A surface acoustic wave (SAW) resonator structure, comprising:

a polycrystalline or monocrystalline silicon substrate having a first surface and a second surface;

a piezoelectric layer disposed over the polycrystalline or monocrystalline silicon substrate, the piezoelectric layer having a first surface, and a second surface comprising a plurality of features, wherein the plurality of features in the second surface of the piezoelectric layer are substantially pyramidal in shape;

a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and

an oxide layer disposed between the first surface of the polycrystalline or monocrystalline silicon substrate and the second surface of the piezoelectric layer, a second surface of the oxide layer being atomically smooth to foster atomic bonding between the second surface of the oxide layer and the first surface of the polycrystalline or monocrystalline silicon substrate, wherein the plurality of features each have a height of approximately one-fourth of a wavelength (¼ λ) of a spurious mode, and the plurality of features reflect acoustic waves and reduce an incidence of a plurality of spurious modes in the piezoelectric layer.

10. A SAW resonator structure as claimed in claim 9 , wherein the oxide layer comprises silicon dioxide (SiO 2 ).

11. A SAW resonator structure as claimed in claim 9 , wherein the acoustic waves reflected from the plurality of features destructively interfere with acoustic waves in the piezoelectric layer.

12. A SAW resonator structure as claimed in claim 9 , wherein each of the plurality of features have a height in a range of approximately 0.25 μm to approximately 1.5 μm.

13. A SAW resonator structure as claimed in claim 9 , wherein each of the plurality of features have a height in a range of approximately 0.1 μm to approximately 2.50 μm.

14. A surface acoustic wave (SAW) filter comprising a plurality of SAW resonator structures, one or more of the plurality of SAW resonator structures comprising:

a polycrystalline or monocrystalline silicon substrate having a first surface and a second surface;

a piezoelectric layer disposed over the polycrystalline or monocrystalline silicon substrate, the piezoelectric layer having a first surface, and a second surface comprising a plurality of features, wherein at least some of the plurality of features have a height of approximately one-fourth of a wavelength (¼ λ) of a spurious mode;

a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and

an oxide layer disposed between the first surface of the polycrystalline or monocrystalline silicon substrate and the second surface of the piezoelectric layer, a second surface of the oxide layer being atomically smooth to foster atomic bonding between a second surface of the oxide layer and the first surface of the polycrystalline or monocrystalline silicon substrate, wherein the at least some of the plurality of features have a height in a range of approximately 0.25 μm to approximately 1.5 μm, and the plurality of features reflect acoustic waves and reduce an incidence of a plurality of spurious modes in the piezoelectric layer.

15. A SAW filter as claimed in claim 14 , wherein at least some of the plurality of features in the second surface of the piezoelectric layer have substantially slanted sides.

16. A SAW filter as claimed in claim 14 , wherein the SAW filter is a ladder filter, comprising the plurality of SAW resonators structures.

17. A SAW filter as claimed in claim 14 , wherein the oxide layer comprises silicon dioxide (SiO 2 ).

18. A SAW filter as claimed in claim 14 , wherein two or more of the plurality of SAW resonator structures are configured in a series and shunt configuration.

19. A surface acoustic wave (SAW) resonator structure, comprising:

a polycrystalline or monocrystalline silicon substrate having a first surface and a second surface;

a piezoelectric layer disposed over the polycrystalline or monocrystalline silicon substrate, the piezoelectric layer having a first surface, and a second surface comprising a plurality of features, wherein the plurality of features in the second surface of the piezoelectric layer are substantially pyramidal in shape;

a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and

an oxide layer disposed between the first surface of the polycrystalline or monocrystalline silicon substrate and the second surface of the piezoelectric layer, a second surface of the oxide layer being atomically smooth to foster atomic bonding between the second surface of the oxide layer and the first surface of the polycrystalline or monocrystalline silicon substrate, wherein: the plurality of features have a plurality of heights, the plurality of features reflect acoustic waves and reduce an incidence of a plurality of spurious modes in the piezoelectric layer, and each of the plurality of heights is in a range of approximately one-fourth of a wavelength (¼ λ) of one of a plurality of spurious modes.

20. A SAW resonator structure as claimed in claim 19 , wherein the oxide layer comprises silicon dioxide (SiO 2 ).

21. A SAW resonator structure as claimed in claim 19 , wherein the acoustic waves reflected from the plurality of features destructively interfere with acoustic waves in the piezoelectric layer.

22. A SAW resonator structure as claimed in claim 19 , wherein the plurality of features are substantially not in a regular pattern.

23. A SAW resonator structure as claimed in claim 19 , wherein each of the plurality of features have a height in a range of approximately 0.25 μm to approximately 1.5 μm.

24. A SAW resonator structure as claimed in claim 19 , wherein each of the plurality of features have a height in a range of approximately 0.1 μm to approximately 2.50 μm.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE MERGER AND APPLICATION NOS. 13/237,550 AND 16/103,107 FROM THE MERGER PREVIOUSLY RECORDED ON REEL 047231 FRAME 0369. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048549/0113 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047231/0369 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2015
From: GILBERT, STEPHEN ROY; RUBY, RIHCARD C.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037291/0453 →
Continuity (2)
Continuation In Part 14835679 · Aug 25, 2015
Related Publication 20170063333A1 · Mar 2, 2017