IP Library Granted Patent US 9,845,596
Granted Patent B2
US 9,845,596 · App. 14/868,485 · Granted Dec 19, 2017

Ceiling system

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Quick Facts
Patent No.
US 9,845,596
App. No.
14/868,485
Granted
Dec 19, 2017
Kind
B2
Abstract

A ceiling system includes a ceiling support structure supporting a plurality of ceiling panels, each ceiling panel including a core layer having a top surface facing a first interior space above the ceiling panels, a bottom surface facing a second interior space below the ceiling panels, and a plurality of peripheral edges extending between the top and bottom surfaces. A top frame layer extends from the top surface and a thermal layer is on the top frame layer opposite the top surface. The thermal layer has a first surface facing away from the top frame layer and a second surface facing toward the top frame layer. The top frame layer supports the second surface in a spaced-apart manner from the top surface to form one or more air gaps between the top surface and the second surface. The first and second surfaces have a thermal emissivity of 0.5 or less.

Claims (33)

1. An acoustic ceiling panel comprising:

a core layer having a top surface a bottom surface opposite the top surface, and a plurality of peripheral edges extending between the top and bottom surfaces, wherein the core layer comprises a sound absorption material having an NRC rating of at least 0.7;

a top frame layer extending from the top surface of the core layer; and

a thermal layer on the top frame layer, the thermal layer having a first surface and a second surface opposite the first surface, the first surface facing away from the top frame layer and the second surface facing toward the top frame layer,

wherein the top frame layer supports the second surface of the thermal layer in a spaced-apart manner from the top surface of the core layer to form one or more air gaps between the top surface of the core layer and the second surface of the thermal layer, and

wherein the first surface and the second surface of the thermal layer have a thermal emissivity of 0.5 or less.

2. The acoustic ceiling panel according to claim 1 , wherein the first surface and the second surface of the thermal layer have a thermal emissivity of 0.1 or less.

3. The acoustic ceiling panel according to claim 1 , wherein the top frame layer is formed by a plurality of ridges extending from the top surface of the core layer.

4. The acoustic ceiling panel according to claim 1 , wherein the top frame layer is affixed to the top surface of the core layer.

5. The acoustic ceiling panel according to claim 1 , wherein the top frame layer is formed integrally with the core layer.

6. The acoustic ceiling panel according to claim 1 , wherein the top frame layer is formed integrally with the thermal layer.

7. The acoustic ceiling panel according to claim 1 , wherein the first surface and the second surface of the thermal layer are formed from one of a metal foil, a paint, and a metal coated polymer film.

8. The acoustic ceiling panel according to claim 1 , wherein the sound absorption material comprises a fibrous material.

9. The acoustic ceiling panel according to claim 8 , wherein the fibrous material comprises mineral fiber.

10. An acoustic ceiling panel comprising

a core layer having a top surface, a bottom surface opposite the top surface, and a plurality of peripheral edges extending between the top and bottom surfaces, wherein the core layer comprises a sound absorption material;

a top frame layer extending from the top surface of the core layer; and

a thermal layer on the top frame layer, the thermal layer having a first surface and a second opposite the first surface, the first surface facing away from the top frame layer and the second surface facing toward the top frame layer, wherein the top frame layer supports the second surface of the thermal layer in a spaced-apart manner from the top surface of the core layer to form one or more air gaps between the top surface of the core layer and the second surface of the thermal layer, and wherein the first surface and the second surface of the thermal layer have a thermal emissivity of 0.5 or less;

wherein the top frame layer extends across the top surface of the core layer.

11. The acoustic ceiling panel according to claim 10 , wherein the top frame layer includes at least one medial support extending across the top surface of the core layer.

12. The acoustic ceiling panel according to claim 10 , wherein the thermal layer extends across the top frame layer to cover the top frame layer.

13. The acoustic ceiling panel according to claim 10 , wherein the first surface and the second surface of the thermal layer have a thermal emissivity of 0.1 or less.

14. The acoustic ceiling panel according to claim 10 , wherein the top frame layer is formed by a plurality of ridges extending from the top surface of the core layer.

15. The acoustic ceiling panel according to claim 10 , wherein the top frame layer is affixed to the top surface of the core layer.

16. The acoustic ceiling panel according to claim 10 , wherein the top frame layer is formed integrally with the core layer.

17. The acoustic ceiling panel according to claim 10 , wherein the top frame layer is formed integrally with the thermal layer.

18. The acoustic ceiling panel according to claim 10 , wherein the first surface and the second surface of the thermal layer are formed from one of a metal foil, a paint, and a metal coated polymer film.

19. An acoustic ceiling panel comprising:

a core layer having a top surface, a bottom surface opposite the top surface, and a plurality of peripheral edges extending between the top and bottom surfaces, wherein the core layer comprises a sound absorption material;

a top frame layer extending from the top surface of the core layer; and

a thermal layer on the top frame layer, the thermal layer having a first surface and a second opposite the first surface, the first surface facing away from the top frame layer and the second surface facing toward the top frame layer, wherein the top frame layer supports the second surface of the thermal layer in a spaced-apart manner from the top surface of the core layer to form one or more air gaps between the top surface of the core layer and the second surface of the thermal layer, and wherein the first surface and the second surface of the thermal layer have a thermal emissivity of 0.5 or less;

a bottom frame layer secured to the bottom surface of the core layer; and

a bottom layer secured to the bottom frame layer, wherein the bottom frame layer holds the bottom layer in a spaced-apart manner from the bottom surface of the core layer to form an air space between the bottom layer and the bottom surface of the core layer.

Assignments (4)
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Oct 11, 2019
From: AWI LICENSING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 050710/0101 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2017
From: ARMSTRONG WORLD INDUSTRIES, INC.
To: AWI LICENSING LLC
Reel/Frame 044120/0817 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Apr 11, 2016
From: ARMSTRONG WORLD INDUSTRIES, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 038403/0628 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2015
From: FRANTZ, WILLIAM H.; SIRDESHPANDE, GOURISH; OLESKE, PETER J.; MYERS, JERE W.; ROY, KENNETH P.; WIKER, ANTHONY L.; WEIR, SHANNON M.
To: ARMSTRONG WORLD INDUSTRIES, INC.
Reel/Frame 036677/0102 →