Method for manufacturing a lighting arrangement
View Patent ↗Disclosed is method of manufacturing a lighting arrangement ( 100 ) comprising a plurality of conductive wires ( 110 ) organized in a flexible grid comprising a plurality of grid nodes ( 115 ), each grid node comprising a first one of said conductive wires and a second one of said conductive wires, at least some of the grid nodes further comprising a solid state lighting element ( 120 ) conductively coupled to the first one of said conductive wires and the second one of said conductive wires, wherein each grid node comprises a mechanical support member ( 130, 134 ) including a polymer portion ( 130 ) embedding the first one of said conductive wires and the second one of said conductive wires.
1. A method of manufacturing a lighting arrangement, the method comprising:
winding a plurality of conductive wires in parallel on a support;
defining a plurality of grid nodes by conductively coupling a plurality of solid state elements to said plurality of conductive wires such that each solid state element is conductively coupled to a first one of said conductive wires and a second one of said conductive wires;
forming a mechanical support member at each grid node by embedding a portion of the first one of said conductive wires and a portion of the second one of said conductive wires in a polymer portion, wherein the mechanical support member comprises a support body;
dicing the mechanical support member to form a resultant structure; and
removing the support from the resultant structure;
wherein said forming step comprises immobilizing the portion of the first one of said conductive wires and the portion of the second one of said conductive wires on the support body using said polymer portion.
2. The method of claim 1 , wherein the support body comprises a mesh structure.
3. The method of claim 1 , wherein said immobilizing step comprises encapsulating the portion of the first one of said conductive wires and the portion of the second one of said conductive wires in said polymer portion.
4. The method of claim 3 , wherein the polymer portion is reinforced with a plurality of fibers or wires.
5. The method of claim 1 , wherein said embedding step comprises encapsulating at least the plurality of grid nodes in the polymer portion.
6. The method of claim 5 , wherein the step of encapsulating at least the plurality of grid nodes further comprises encapsulating sections of the conductive wires that interconnect grid nodes in said polymer portion.
7. The method of claim 1 , wherein forming the mechanical support member comprises embedding said portion of the first one of said conductive wires and said portion of the second one of said conductive wires in the polymer portion comprising an elastomer or a resin.