Liquid immersion transfer of electronics
A liquid immersion transfer process for applying electronics on a 3D object and a system is disclosed. In one embodiment, the process comprises providing a foil on a solid carrier in a foil provision stage, providing electronic wiring and an electronic component to the foil in an electronics provision stage, to provide said electronics, removing the solid carrier and arranging the foil on or in a liquid in a liquid application stage, and transferring the electronics to the 3D object in a transfer stage, as well as a 3D object obtainable by such process.
1. A liquid immersion transfer process for applying electronics on a 3D object, the process comprising:
providing a foil on a solid carrier in a foil provision stage;
providing electronic wiring and an electronic component to the foil in an electronics provision stage, to provide said electronics;
removing the solid carrier and arranging the foil on or in a liquid in a liquid application stage;
transferring the electronics to the 3D object in a transfer stage.
2. The liquid immersion transfer process according to claim 1 , wherein the liquid comprises an aqueous liquid, and wherein the foil comprises a liquid soluble material.
3. The liquid immersion transfer process according to claim 1 , wherein one or more of the foil provision stage and the electronics provision stage also include providing a printed design to the foil.
4. The liquid immersion transfer process according to claim 3 , wherein the printed design comprises an acrylic ink.
5. The liquid immersion transfer process according to claim 1 , wherein the electronics provision stage comprises printing or coating said electronic wiring on said foil.
6. The liquid immersion transfer process according to claim 5 , comprising applying one or more of a paste, an ink, and a foil strip, wherein the one or more of the paste, the ink and the foil strip comprise one or more of silver comprising curable material and copper comprising curable material.
7. The liquid immersion transfer process according to claim 1 , wherein the electronics provision stage comprises dispensing or printing locally an electrically conductive connector material to said foil and arranging said electronic component to said foil, wherein the electrically conductive connector material is configured to functionally connect the electric component and the electronic wiring, and wherein the electrically conductive material comprises an electrically conductive adhesive.
8. The liquid immersion transfer process according to claim 1 , wherein one or more of the liquid application stage and the transfer stage further comprise one or more of (i) softening an ink comprising printed design and (ii) pretreating at least part of the 3D object.
9. The liquid immersion transfer process according to claim 1 , wherein in the transfer stage the 3D object is at least partially submerged in the liquid before transfer.
10. The liquid immersion transfer process according to claim 1 , wherein subsequent to the transfer stage, the process further comprises one or more of (i) a curing stage, wherein the curing stage comprises curing the electronic wiring, and (ii) a coating stage, wherein the coating stage comprises applying a top coating to at least part of the 3D object comprising said electronics.
11. The liquid immersion transfer process according to claim 1 , wherein the electronic component comprises one or more of a solid state light source, a sensor, an electronic solar cell, and an electronic touch button.
12. The liquid immersion transfer process according to claim 1 , the process further comprising deriving from a surface of a virtual 3D model of the final 3D object a 2D design of the electronics on the foil and executing the liquid immersion transfer process in conformance with the 2D design.
13. The liquid immersion transfer process according to claim 2 , wherein the liquid soluble material comprises polyvinyl alcohol (PVA).