Method of manufacturing semiconductor device and semiconductor device

1. A semiconductor device comprising:

a supporting substrate;

an insulating film formed in a first region over the supporting substrate;

a first semiconductor layer formed over the insulating film;

a first epitaxial layer formed in an opening of the insulating film in a second region over the supporting substrate;

an element isolation region formed between the first semiconductor layer and the first epitaxial layer; and

a semiconductor element formed over each of the first semiconductor layer in the first region and the first epitaxial layer in the second region,

wherein the first semiconductor layer and the first epitaxial layer are spaced apart from each other by 5 μm or more, and

wherein a second epitaxial layer reaching the upper surface of the supporting substrate is formed between the first semiconductor layer and the first epitaxial layer.

2. The semiconductor device according to claim 1 ,

wherein a digital circuit and an analog circuit are formed in the first region, and

wherein a high-frequency analog circuit of 10 kHz or more is formed in the second region.

3. The semiconductor device according to claim 1 ,

wherein a second semiconductor layer is in contact with the side wall of the first epitaxial layer, and

wherein the first semiconductor layer and the second semiconductor layer are spaced apart from each other by 5 μm or more.

4. The semiconductor device according to claim 1 , wherein the semiconductor element formed in the second region includes an LDMOSFET (Laterally Diffused Metal Oxide Semiconductor Field Effect Transistor) in which impurities are diffused in a direction along the upper surface of the first epitaxial layer.

5. The semiconductor device according to claim 1 , further comprising a digital circuit and an analog circuit formed in the first region.

6. The semiconductor device according to claim 1 , further comprising:

a second insulating layer formed over the first semiconductor layer; and

a third insulating film covering the semiconductor layer, the second insulating film, and the first insulating film.

7. A semiconductor device comprising:

a supporting substrate;

a first insulating film formed over the supporting substrate;

a semiconductor layer formed over the first insulating film, and that includes a first region and a second region over the upper surface of the semiconductor layer;

a second insulating film formed over the semiconductor layer;

a third insulating film covering the semiconductor layer, the second insulating film, and the first insulating film;

a first epitaxial layer formed in the opening of the first insulating film and the third insulating film; and

a semiconductor element formed over each of the semiconductor layer in the first region and the first epitaxial layer in the second region,

wherein a second epitaxial layer reaching the upper surface of the supporting substrate is formed between the first semiconductor layer and the first epitaxial layer, and

wherein the semiconductor layer and the first epitaxial layer are spaced apart from each other by 5 μm or more.

8. The semiconductor device according to claim 7 , further comprising a digital circuit and an analog circuit formed in the first region.

9. The semiconductor device according to claim 7 , further comprising a high-frequency analog circuit of 10 kHz or more formed in the second region.

10. The semiconductor device according to claim 7 ,

wherein a second semiconductor layer is in contact with the side wall of the first epitaxial layer.

11. The semiconductor device according to claim 10 ,

wherein the semiconductor layer and the second semiconductor layer are spaced apart from each other by 5 μm or more.

12. The semiconductor device according to claim 7 , further comprising a fourth insulating film formed over the third insulating film, and

wherein the semiconductor element formed in the second region includes an LDMOSFET (Laterally Diffused Metal Oxide Semiconductor Field Effect Transistor) in which impurities are diffused in a direction along the upper surface of the first epitaxial layer.

13. A semiconductor device comprising:

a supporting substrate;

an insulating film formed in a first region over the supporting substrate;

a first semiconductor layer formed over the insulating film;

a first epitaxial layer formed in an opening of the insulating film in a second region over the supporting substrate;

an element isolation region formed between the first semiconductor layer and the first epitaxial layer;

a semiconductor element formed over each of the first semiconductor layer in the first region and the first epitaxial layer in the second region,

wherein the first semiconductor layer and the first epitaxial layer are spaced apart from each other by a predetermined distance; and

a second epitaxial layer reaching the upper surface of the supporting substrate is formed between the first semiconductor layer and the first epitaxial layer.

14. The semiconductor device according to claim 13 , further comprising a digital circuit and an analog circuit formed in the first region.

15. The semiconductor device according to claim 13 , further comprising a high-frequency analog circuit of 10 kHz or more formed in the second region.

16. The semiconductor device according to claim 13 , further comprising a second semiconductor layer is in contact with the side wall of the first epitaxial layer.

17. The semiconductor device according to claim 16 , wherein the first semiconductor layer and the second semiconductor layer are spaced apart from each other by 5 μm or more.