Photonic interface for electronic circuit

1. A photonic interface assembly for providing communication between at least one optical fiber and an electronic circuit, comprising:

a substrate including: at least one of a first and a second port, and at least one of a first and a second electrical connection electrically connected to the first and second ports, respectively, for electrically connecting to the electronic circuit;

a photonic integrated circuit mounted on the substrate comprising:

at least one optical port for optically coupling to the at least one optical fiber for outputting a first optical signal and/or for receiving a second optical signal;

a third electrical connection electrically connected to the first port for receiving a first electrical signal from the electronic circuit and/or a fourth electrical connection electrically connected to the second port for coupling a second electrical signal to the electronic circuit; and

at least one of a laser and an optical modulator for modulating an optical carrier wave with the first electrical signal to provide the first optical signal, and/or a photodetector for providing the second electrical signal in response to the second optical signal; and

a fiber support attached to the photonic integrated circuit for optically aligning the at least one optical fiber with the at least one optical port;

wherein the photonic integrated circuit comprises a silicon photonic chip.

2. The photonic interface assembly of claim 1 , wherein the fiber support includes at least one groove of holding each of the at least one optical fiber in a pre-defined location.

3. The photonic interface assembly of claim 2 , wherein at least one of the fiber support and the photonic integrated circuit comprises a first registration feature for alignment of the fiber support relative to the photonic integrated circuit.

4. The photonic interface assembly of claim 3 , wherein at least one of the fiber support and the photonic integrated circuit comprises a second registration feature comprising a dielectric or semiconductor hard stop extending between the fiber support and the photonic integrated circuit for alignment of the fiber support relative to the photonic integrated circuit in the z-direction.

5. The photonic interface assembly of claim 1 , further comprising an electrical preamplifier chip, electrically connected to the photodetector and the electronic circuit for amplifying the second electrical signal provided by the photodetector.

6. The photonic interface assembly of claim 1 , further comprising a modulator driver chip mounted on the photonic integrated circuit electrically connected to the optical modulator and the electronic circuit for driving the optical modulator.

7. The photonic interface assembly of claim 1 , further comprising an optical gain chip mounted on the substrate, and optically coupled to the optical modulator for providing the optical carrier wave.

8. The photonic interface assembly of claim 7 , wherein the optical gain chip is disposed between the substrate and the photonic integrated circuit.

9. An optical interconnect between first and second electronic circuits comprising:

a first photonic interface assembly in accordance with claim 1 ;

a second photonic interface assembly in accordance with claim 1 ; and

at least one optical fiber optically coupling the first and second photonic interface assemblies.

10. A photonic interface assembly for providing communication between at least one optical fiber and an electronic circuit, comprising:

a substrate including: a first port, and a first electrical connection electrically connected to the first port, for electrically connecting to the electronic circuit;

a photonic integrated circuit mounted on the substrate comprising:

an optical port for optically coupling to an optical fiber for outputting a first optical signal;

a second electrical connection electrically connected to the first port for receiving a first electrical signal from the electronic circuit; and

at least one of a laser and an optical modulator for modulating an optical carrier wave with the first electrical signal to provide the first optical signal; and

a fiber support attached to the photonic integrated circuit for optically aligning the optical fiber with the optical port; and

an optical gain chip mounted on the photonic integrated circuit, and optically coupled to the optical modulator for providing or amplifying the optical carrier wave.

11. The photonic interface assembly of claim 10 , wherein at least one of the optical gain chip and the photonic integrated circuit comprises a registration feature comprising a dielectric or semiconductor hard stop extending between the optical gain chip and the photonic integrated circuit for alignment of the optical gain chip relative to the photonic integrated circuit.

12. The photonic interface assembly of claim 10 , wherein the photonic integrated circuit comprises a silicon photonic chip.

13. A method for coupling a photonic interface assembly between at least one optical fiber and an electronic circuit, the method comprising:

providing a substrate including: a first and a second port, and a first and a second electrical connection electrically connected to the first and second ports, respectively, for electrically connecting to the electronic circuit;

mounting a photonic integrated circuit on the substrate, the photonic integrated circuit comprising:

a third and a fourth electrical connection for receiving a first electrical signal from the electronic circuit and for transmitting a second electrical signal to the electronic circuit, respectively;

at least one optical port optically coupled to the at least one optical fiber for outputting a first optical signal and for receiving a second optical signal;

at least one of a laser and an optical modulator for modulating an optical carrier wave with the first electrical signal to provide the first optical signal, and a photodetector for providing the second electric signal in response to the second optical signal;

wherein the third and fourth electrical connections are connected to the first and second ports, respectively;

optically aligning the at least one optical fiber in a fiber support to the at least one optical port on the photonic integrated circuit, wherein the at least one optical fiber is capable of outputting the first optical signal and/or receiving the second optical signal; and

mounting an electrical preamplifier chip on the substrate or the photonic integrated circuit; and electrically connecting the electrical preamplifier chip to the photodetector and the electronic circuit for amplifying the second electrical signal provided by the photodetector.

14. The method of claim 13 , wherein the optically aligning step comprises:

horizontally aligning the fiber support relative to the photonic integrated circuit,

wherein the horizontal alignment comprises aligning a first registration feature on the fiber support with a second registration feature on the photonic integrated circuit chip; and

vertically aligning the fiber support relative to the photonic integrated circuit to optically couple the at least one optical port to the at least one optical fiber;

wherein the vertical alignment comprises bringing a second dielectric or semiconductor hard stop lithographically defined in one of the fiber support and the photonic integrated circuit into physical contact with the other of the fiber support and the photonic integrated circuit in the z-direction; and

fixing the at least one optical fiber at a pre-defined location in a groove on the fiber support.

15. The method of claim 13 , further comprising

aligning an optical gain chip relative to the photonic integrated circuit to optically couple the optical gain chip to the optical modulator for providing or amplifying an optical carrier wave to the optical modulator,

wherein the alignment comprises bringing a dielectric or semiconductor hard stop lithographically defined in one of the optical gain chip and the photonic integrated circuit into contact with the other of the optical gain chip and the photonic integrated circuit.

16. The method of claim 15 , wherein the optical gain chip is disposed between the substrate and the photonic integrated circuit.

17. The method of claim 13 , further comprising mounting an electronic interposer chip, including the electrical preamplifier chip for amplifying the second electrical signal, and modular driver circuitry for driving the optical modulator between the substrate and the photonic integrated circuit.

18. The method of claim 13 , further comprising mounting a modulator driver chip for driving the optical modulator on the photonic integrated circuit, and electrically connecting the modulator driver chip to the optical modulator and the electronic circuit.

19. The method of claim 13 , further comprising coupling another photonic interface assembly to another end of the at least one optical fiber, thereby providing a coupling between the at least one optical fiber and another electronic circuit, and providing an optical interconnect between the electronic circuit and the other electronic circuit.