Heat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereof
A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.
1. An electronic device comprising:
a heating element;
a heat dissipation element; and
a heat dissipation material configured to be placed between the heating element and the heat dissipation element, and to include
a plurality of linearly-structured objects of carbon atoms including a first terminal part and a second terminal part,
a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects,
a coating film covering a side surface for the first diamond-like carbon layer and the plurality of linearly-structured objects, and
a filler layer configured to be permeated between the plurality of linearly-structured objects.
2. The electronic device as claimed in claim 1 , wherein the first terminal parts of the plurality of linearly-structured objects are connected with each other by the first diamond-like carbon layers.
3. The electronic device as claimed in claim 1 , further comprising:
a second diamond-like carbon layer configured to cover the second terminal part of each of the plurality of linearly-structured objects.
4. The electronic device as claimed in claim 3 , wherein the second terminal parts of the plurality of linearly-structured objects are connected with each other by the second diamond-like carbon layers.
5. The electronic device as claimed in claim 1 , wherein the first terminal part of each of the plurality of linearly-structured objects covered by the first diamond-like carbon layer is placed at a side close to the heating element.
6. The electronic device as claimed in claim 1 , wherein
the first diamond-like carbon layer covers, for each of the plurality of linearly-structured objects, the first terminal part and a portion being adjacent to the first terminal part; and
the coating film covers a surface of the first diamond-like carbon layer, and a side surface of each of the plurality of linearly-structured objects, which is not covered by the first diamond-like carbon layer.