IP Library Granted Patent US 10,656,482
Granted Patent B2
US 10,656,482 · App. 15/588,885 · Granted May 19, 2020

Thin-film transistor substrate and liquid crystal display

Inventors: Shinji Kawabuchi (Tokyo, JP); Naruhito Hoka (Tokyo, JP); Kazushi Yamayoshi (Tokyo, JP); Akihiko Hosono (Tokyo, JP); Kenichi Miyamoto (Kumamoto, JP)
Assignee: Mitsubishi Electric Corporation
G02F1/136209G02F1/13439G02F1/133345G02F1/133512G02F1/133788G02F1/134309G02F1/136227G02F1/136286H01L27/124H01L27/1225H01L29/78633G02F2001/13606G02F2001/134318G02F2001/134372G02F2001/136218G02F2201/121G02F2201/123H01L29/7869
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Quick Facts
Patent No.
US 10,656,482
App. No.
15/588,885
Granted
May 19, 2020
Kind
B2
Abstract

A channel layer is formed of an oxide semiconductor. A first insulating film is provided on the channel layer, a source line, and a drain electrode, and includes a drain contact hole which reaches the drain electrode. A pixel electrode is provided on the first insulating film, includes a connection conductive layer which is connected to the drain electrode by the drain contact hole, and is formed of a transparent conductive material. The pixel electrode is covered with a second insulating film. A common electrode is provided on the second insulating film, includes an opening which faces the pixel electrode in a thickness direction, and is formed of a transparent conductive material. A metal layer, in conjunction with a part of the common electrode, forms a laminated structure, and includes a light-shield part which overlaps the channel layer at least partially in plan view.

Claims (71)

1. A thin-film transistor substrate which includes a display area having a plurality of pixels which are arranged in a matrix, comprising:

a supporting substrate;

a gate line which is provided on said supporting substrate and includes a gate electrode placed in each of said pixels;

a gate insulating film with which said gate line is covered;

a channel layer which is provided on each of said gate electrodes via said gate insulating film and is formed of an oxide semiconductor;

a source line which is placed in each of said pixels and includes a source electrode which is in contact with said channel layer;

a drain electrode which is placed in each of said pixels, and is in contact with said channel layer, said drain electrode being distant from said source electrode;

a first insulating film which is provided on said channel layer, said source line, and said drain electrode, and includes a drain contact hole which reaches said drain electrode;

a pixel electrode which is provided on said first insulating film in each of said pixels, and includes a connection conductive layer electrically connected to said drain electrode by said drain contact hole, said pixel electrode being formed of a transparent conductive material;

a second insulating film with which said pixel electrode is covered;

a common electrode which is provided on said second insulating film, and includes an opening facing said pixel electrode in a thickness direction, said common electrode being formed of a transparent conductive material; and

a metal layer which forms a laminated structure in conjunction with a part of said common electrode, and includes a light-shield part which overlaps said channel layer at least partially in plan view, wherein

said metal layer is provided on a part of said first insulating film in a same layer as said pixel electrode, and

said metal layer is covered with said second insulating film.

2. The thin-film transistor substrate according to claim 1 , wherein

said metal layer extends along said gate line.

3. The thin-film transistor substrate according to claim 1 , wherein

said gate electrode overlaps said channel layer in plan view.

4. The thin-film transistor substrate according to claim 1 , wherein

said first insulating film includes an organic resin film.

5. The thin-film transistor substrate according to claim 1 , wherein

said second insulating film includes a spin-on-glass film.

6. The thin-film transistor substrate according to claim 1 , further comprising:

a first line which is provided on said supporting substrate and is formed of the same material that forms said gate line; and

a second line which is provided on said gate insulating film and is formed of the same material that forms said source line, wherein

said metal layer includes a connection metal layer, and

said connection metal layer is electrically connected to said first line by a first contact hole which passes through said first insulating film and said gate insulating film, and is electrically connected to said second line by a second contact hole which passes through said first insulating film, so that said first line and said second line are electrically connected to each other.

7. The thin-film transistor substrate according to claim 6 , wherein

said thin-film transistor substrate includes a frame area provided outside said display area, and

said connection metal layer is placed within said frame area.

8. A liquid crystal display comprising:

the thin-film transistor substrate according to claim 1 ;

a counter substrate placed at a distance from said thin-film transistor substrate; and

a liquid crystal layer held between said thin-film transistor substrate and said counter substrate.

9. The liquid crystal display according to claim 8 , further comprising

an alignment layer which is provided on said thin-film transistor substrate and causes alignment of said liquid crystal layer, wherein

said alignment layer is formed of a material having a photo-alignment property.

10. The thin-film transistor substrate according to claim 1 , wherein

said gate insulating film includes a first gate contact hole which reaches said gate line,

said first insulating film includes a second gate contact hole which is joined to said first gate contact hole,

said metal layer is electrically connected to said gate line by said first gate contact hole and said second gate contact hole.

11. A thin-film transistor substrate which includes a display area having a plurality of pixels which are arranged in a matrix, comprising:

a supporting substrate;

a gate line which is provided on said supporting substrate and includes a gate electrode placed in each of said pixels;

a gate insulating film with which said gate line is covered;

a channel layer which is provided on each of said gate electrodes via said gate insulating film and is formed of an oxide semiconductor;

a source line which is placed in each of said pixels and includes a source electrode which is in contact with said channel layer;

a drain electrode which is placed in each of said pixels, and is in contact with said channel layer, said drain electrode being distant from said source electrode;

a first insulating film which is provided on said channel layer, said source line, and said drain electrode, and includes a drain contact hole which reaches said drain electrode;

a pixel electrode which is provided on said first insulating film in each of said pixels, and includes a connection conductive layer electrically connected to said drain electrode by said drain contact hole, said pixel electrode being formed of a transparent conductive material;

a second insulating film with which said pixel electrode is covered;

a common electrode which is provided on said second insulating film, and includes an opening facing said pixel electrode in a thickness direction, said common electrode being formed of a transparent conductive material; and

a metal layer which forms a laminated structure in conjunction with a part of said common electrode, wherein

said metal layer includes a light-shield part which overlaps said channel layer at least partially in plan view, and

said metal layer includes a connection metal layer stacked directly on said connection conductive layer.

12. A thin-film transistor substrate which includes a display area having a plurality of pixels which are arranged in a matrix, comprising:

a supporting substrate;

a gate line which is provided on said supporting substrate and includes a gate electrode placed in each of said pixels;

a gate insulating film with which said gate line is covered;

a channel layer which is provided on each of said gate electrodes via said gate insulating film and is formed of an oxide semiconductor;

a source line which is placed in each of said pixels and includes a source electrode which is in contact with said channel layer;

a drain electrode which is placed in each of said pixels, and is in contact with said channel layer, said drain electrode being distant from said source electrode;

a first insulating film which is provided on said channel layer, said source line, and said drain electrode, and includes a drain contact hole which reaches said drain electrode;

a pixel electrode which is provided on said first insulating film in each of said pixels, and includes a connection conductive layer electrically connected to said drain electrode by said drain contact hole, said pixel electrode being formed of a transparent conductive material;

a second insulating film with which said pixel electrode is covered;

a common electrode which is provided on said second insulating film, and includes an opening facing said pixel electrode in a thickness direction, said common electrode being formed of a transparent conductive material;

a metal layer which forms a laminated structure in conjunction with a part of said common electrode, and includes a light-shield part which overlaps said channel layer at least partially in plan view;

a first line which is provided on said supporting substrate and is formed of the same material that forms said gate line; and

a second line which is provided on said gate insulating film and is formed of the same material that forms said source line, wherein

said metal layer includes a connection metal layer, and

said connection metal layer is electrically connected to said first line by a first contact hole which passes through said first insulating film and said gate insulating film, and is electrically connected to said second line by a second contact hole which passes through said first insulating film, so that said first line and said second line are electrically connected to each other.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2021
From: MITSUBISHI ELECTRIC CORPORATION
To: TRIVALE TECHNOLOGIES
Reel/Frame 057651/0234 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2017
From: KAWABUCHI, SHINJI; HOKA, NARUHITO; YAMAYOSHI, KAZUSHI; HOSONO, AKIHIKO; MIYAMOTO, KENICHI
To: MITSUBISHI ELECTRIC CORPORATION
Reel/Frame 042272/0001 →
Priority Claims (1)
JP 2016-096767 · May 13, 2016 · national
Continuity (1)
Related Publication 20170329176A1 · Nov 16, 2017
Cited By (1)
US 12,379,637