High speed photosensitive devices and associated methods
High speed optoelectronic devices and associated methods are provided. In one aspect, for example, a high speed optoelectronic device can include a silicon material having an incident light surface, a first doped region and a second doped region forming a semiconductive junction in the silicon material, and a textured region coupled to the silicon material and positioned to interact with electromagnetic radiation. The optoelectronic device has a response time of from about 1 picosecond to about 5 nanoseconds and a responsivity of greater than or equal to about 0.4 A/W for electromagnetic radiation having at least one wavelength from about 800 nm to about 1200 nm.
1. A method for configuring an optoelectronic device for light detection and ranging, the method comprising:
doping at least two regions in a silicon optoelectronic device material to form at least one depletion region, wherein the silicon optoelectronic device material exhibits a thickness in a range of about 1 micron to about 100 microns and comprises a surface for receiving incident radiation;
providing an infrared optical band pass filter for reducing unwanted ambient light; and
texturing the silicon material to form a textured region positioned to interact with electromagnetic radiation so as to increase the quantum efficiency of the optoelectronic device,
wherein the optoelectronic device has a response time of from about 1 picosecond to about 5 nanoseconds and a quantum efficiency of greater than or equal to about 40% for electromagnetic radiation having a wavelength of about 940 nm.
2. A system for performing light detection and ranging, comprising:
a silicon optoelectronic device material exhibiting a thickness in a range of about 1 micron to about 100 microns and having a surface for receiving incident radiation;
a first doped region and a second doped region forming at least one depletion region in the silicon material;
an infrared optical bandpass filter for reducing unwanted ambient light; and
a textured region coupled to the silicon material and positioned to interact with electromagnetic radiation so as to increase the quantum efficiency of the optoelectronic device,
wherein the optoelectronic device has a response time of from about 1 picosecond to about 5 nanoseconds and a quantum efficiency of greater than or equal to about 40% for electromagnetic radiation having a wavelength of about 940 nm.
3. The system of claim 2 , wherein the silicon optoelectronic device material exhibits a thickness in a range of about 1 micron to about 10 microns.
4. The system of claim 2 , wherein the silicon optoelectronic device material exhibits a thickness in a range of about 1 micron to about 5 microns.
5. The system of claim 2 , wherein the textured region is formed via one of lasing, chemical etching, nanoimprinting, and reactive ion etching.
6. The system of claim 2 , wherein the textured region is associated with the surface of the silicon material nearest the impinging electromagnetic radiation.
7. The system of claim 2 , wherein the silicon optoelectronic device material comprises an array of photodetectors.
8. The system of claim 7 , further comprising an isolation structure disposed between each of the photodectectors.
9. The system of claim 8 , wherein the isolation structure comprises one of dielectric materials, reflective materials, conductive materials, and combinations thereof.
10. The system of claim 2 , wherein the array is operable to detect a phase delay between a reflected and an emitted optical signal.
11. The system of claim 10 , further comprising a light source configured to emit an optical signal.
12. The system of claim 11 , wherein the light source is configure to emit electromagnetic radiation at a wavelength of about 940 nm.