IP Library Patent Application 15817706
Patent Application
App. No. 15/817,706

ANTIMICROBIAL AGENT FOR COATING COMPOSITION

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Quick Facts
Patent No.
US None
App. No.
15/817,706
Filed
Nov 20, 2017
Art Unit
1616
USPC
424/405
Abstract

A microbe-resistant coating composition or paint including an antimicrobial agent is described. The antimicrobial agent is an inorganic bismuth-containing compound, and may be used in conjunction with other bismuth-containing compounds or other biocidal agents or methods. A method of treating an electrodeposition system for bacterial and/or fungal contamination is also described by adding an antimicrobial agent to at least a portion of the electrodeposition system.

Claims (35)

1 . A method of treating an electrodeposition system, comprising:

a) providing an effective amount of at least one antimicrobial agent comprising at least an inorganic bismuth-containing compound; and

b) adding the antimicrobial agent to at least a part of the electrodeposition system.

2 . A method of maintaining an electrodeposition system free of microbial contamination, comprising:

a) providing an effective amount of at least one antimicrobial agent comprising at least an inorganic bismuth-containing compound;

b) adding the antimicrobial agent to at least a part of the electrodeposition system;

c) monitoring bacterial and fungal growth in the electrodeposition system at regular intervals; and

d) adding an additional amount of the antimicrobial agent to the electrodeposition system if bacterial or fungal growth is observed.

3 . A treating composition for electrodeposition systems comprising a binder resin and at least one antimicrobial agent including at least an inorganic bismuth-containing compound, wherein the antimicrobial agent is present in an amount effective to eliminate microbial contamination in the electrodeposition system.

4 . The composition or method of any of the above claims, wherein the inorganic bismuth-containing compound is a bismuth salt of a metal oxyanion.

5 . The composition or method of any of the above claims, wherein the inorganic bismuth-containing compound is bismuth aluminate.

6 . The composition or method of any of the above claims, wherein the antimicrobial agent further comprises an organic bismuth-containing compound.

7 . The composition or method of any of the above claims, wherein the antimicrobial agent comprises the inorganic bismuth-containing compound in combination with bismuth citrate.

8 . The composition or method of any of the above claims, wherein the antimicrobial agent comprises bismuth aluminate in combination with bismuth citrate.

9 . The composition or method of any of the above claims, wherein the electrodeposition system is a cathodic system.

10 . The composition or method of any of the above claims, wherein the electrodeposition system is an anodic system.

11 . The composition or method of any of the above claims, wherein the at least one antimicrobial agent is present as at least part of a pigment paste for the electrodeposition system.

12 . The composition or method of any of the above claims, wherein the electrodeposition system exhibits no growth of microbial colonies.

13 . The composition or method of any of the above claims, wherein the electrodeposition system initially exhibits microbial colonies and the antimicrobial agent reduces the microbial population by at least 5% after seven days.

14 . The composition or method of any of the above claims, wherein the antimicrobial agent includes about 0.1% to 10% by weight of bismuth, based on the total weight of resin solids in the electrodeposition system.

15 . The composition or method of any of the above claims, wherein the antimicrobial agent is used as part of a continuous electrocoating process control microorganisms in an electrodeposition system.

16 . The composition or method of any of the above claims, wherein the antimicrobial agent is included in an electrodeposition coating composition.

17 . The composition or method of any of claim 16 , wherein the electrodeposition coating composition comprises:

a) at least one binder resin component;

b) at least one pigment component; and

c) an effective amount of the antimicrobial agent.

18 . The composition or method of claim 17 , wherein the antimicrobial agent is included in the at least one pigment component.

19 . A coating composition for electrodeposition, comprising:

a) at least one binder resin component;

b) at least one pigment component, wherein the pigment component includes an inorganic bismuth-containing compound.

20 . A microbe-resistant coating composition, comprising:

a) a vehicle;

b) at least one binder resin component;

c) optionally, at least one pigment component; and

d) at least about 0.1% by weight of an inorganic bismuth-containing compound, based on the total weight of resin solids in the composition.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2023
From: THE SHERWIN-WILLIAMS HEADQUARTERS COMPANY
To: SWIMC LLC
Reel/Frame 063275/0494 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2022
From: THE SHERWIN-WILLIAMS COMPANY
To: THE SHERWIN-WILLIAMS HEADQUARTERS COMPANY
Reel/Frame 060366/0979 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2021
From: THE VALSPAR CORPORATION
To: THE SHERWIN-WILLIAMS COMPANY
Reel/Frame 057204/0946 →
MERGER Recorded Oct 29, 2020
From: ENGINEERED POLYMER SOLUTIONS, INC.
To: THE VALSPAR CORPORATION
Reel/Frame 054443/0772 →
MERGER Recorded Sep 2, 2020
From: VALSPAR SOURCING, INC.
To: ENGINEERED POLYMER SOLUTIONS, INC.
Reel/Frame 053826/0606 →
NUNC PRO TUNC ASSIGNMENT Recorded Mar 24, 2020
From: THE SHERWIN-WILLIAMS COMPANY
To: VALSPAR SOURCING, INC.
Reel/Frame 052217/0640 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NO. 8465946 PREVIOUSLY RECORDED AT REEL: 045281 FRAME: 0529. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded May 4, 2018
From: VALSPAR SOURCING, INC.
To: THE SHERWIN-WILLIAMS COMPANY
Reel/Frame 046087/0150 →
MERGER Recorded Feb 8, 2018
From: VALSPAR SOURCING. INC
To: THE SHERWIN-WILLIAMS COMPANY
Reel/Frame 045281/0529 →