Circuit board and packaged chip
A circuit board includes an upper circuit and a lower surface that are opposite to each other, a plurality of heat sink bonding pads, and a plurality of heat sink conductive pads. The heat sink bonding pads are disposed on the upper surface and electrically insulated from one another, and are used to electrically connect to a heat sink. The heat sink conductive pads are disposed on the lower surface, electrically insulated from one another, and electrically connected to the heat sink bonding pads, respectively.
1. A circuit board, comprising:
an upper surface and a lower surface that are opposite to each other;
a plurality of heat sink bonding pads, disposed on the upper surface, and electrically insulated from one another, for electrically connecting to a heat sink;
a plurality of heat sink conductive pads, disposed on the lower surface, electrically insulated from one another, and electrically connected to the heat sink bonding pads, respectively; and
a circuit layer, comprising a plurality of heat sink traces, wherein the heat sink conductive pads are electrically connected to the heat sink bonding pads through the heat sink traces, respectively, and the heat sink traces are electrically insulated from one another.
2. The circuit board according to claim 1 , further comprising:
a plurality of chip bonding pads, disposed on the upper surface, and electrically insulated from the chip bonding pads, for electrically connecting to an electronic device.
3. The circuit board according to claim 2 , further comprising:
a plurality of chip conductive pads, disposed on the lower surface, and electrically insulated from the heat sink conductive pads.
4. The circuit board according to claim 3 , wherein the circuit layer further comprises:
a plurality of chip traces;
wherein, at least one of the chip conductive pads is connected to at least one of the chip bonding pads through at least one of the chip traces, and the heat sink traces are electrically insulated from the chip traces.
5. A packaged chip, comprising:
a circuit board, comprising:
an upper surface and a lower surface that are opposite to each other;
a plurality of heat sink bonding pads, disposed on the upper surface, and electrically insulated from one another, for electrically connecting to a heat sink;
a plurality of heat sink conductive pads, disposed on the lower surface, electrically insulated from one another, and electrically connected to the heat sink bonding pads, respectively;
a heat sink, adhered on the heat sink pads of the circuit board, and electrically connected to the heat sink bonding pads, the heat sink bonding pads being electrically connected to one another through the heat sink; and
a circuit layer, comprising a plurality of heat sink traces, wherein the heat sink conductive pads are electrically connected to the heat sink bonding pads through the heat sink traces, respectively.
6. The packaged chip according to claim 5 , further comprising:
an electronic device, disposed between the circuit board and the heat sink;
wherein, the circuit board further comprises a plurality of chip bonding pads, the chip bonding pads are disposed on the upper surface and electrically connected to the electronic device, and the heat sink bonding pads are electrically insulated from the chip bonding pads.
7. The packaged chip according to claim 6 , wherein the circuit board further comprises a plurality of chip conductive pads disposed on the lower surface of the circuit board, and the heat sink conductive pads are electrically insulated from the chip conductive pads.
8. The packaged chip according to claim 7 , wherein the circuit layer further comprises a plurality of chip traces, at least one of the chip conductive pads is electrically connected to at least one of the chip bonding pads through at least one of the chip traces, and the heat sink traces are electrically insulated from the chip traces.
9. The packaged chip according to claim 5 , further comprising:
a packaging glue, disposed on the circuit board.
10. The packaged chip according to claim 5 , further comprising:
a plurality of solder balls, connected to the heat sink conductive pads, respectively.