IP Library Granted Patent US 10,327,063
Granted Patent B1
US 10,327,063 · App. 15/934,399 · Granted Jun 18, 2019

Systems and methods for minimizing vibration sensitivity for protected microphones

Inventors: Joyce Gorny (Mountain View, CA); Erich Tisch (San Francisco, CA); Mark Hardin (Guerneville, CA); Per Magnus Fredrik Hansson (Los Altos, CA)
Assignee: GoPro, Inc.
H04R1/2876G03B31/06H04R1/08B06B1/06B06B3/00G02B27/0006G03B17/08G03B17/24G03B17/56G03B2217/243G03B2217/244G03B2217/246H04N5/2254H04N5/22521
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Quick Facts
Patent No.
US 10,327,063
App. No.
15/934,399
Granted
Jun 18, 2019
Kind
B1
Abstract

Protected microphone systems may include one or more dampeners, one or more protective layers, or a combination thereof to minimize the vibration sensitivity of a microphone of the protected microphone systems. The dampeners, when present, may be constructed of a foam material or a thin metal material. The protective layer may be a membrane, a mesh, or any suitable material. The protective layer may be air permeable or non-air permeable.

Claims (31)

1. An image capture device comprising:

a housing that includes a first port that is fluidly connected to a first cavity of the image capture device and an external environment relative to the image capture device;

an audio capture device configured to obtain an audible sound;

a printed circuit board (PCB) electrically coupled to the audio capture device, wherein the PCB includes a second port that is fluidly connected to a second cavity and the audio capture device;

a protective layer that separates the first cavity and the second cavity, wherein the first cavity is defined by a portion of the housing and a portion of the protective layer, and wherein the second cavity is defined by a portion of the PCB and the portion of the protective layer; and

a support structure that is in contact with an edge portion of the protective layer and configured to provide structural support to the protective layer.

2. The image capture device of claim 1 , wherein the PCB is directly coupled to the housing.

3. The image capture device of claim 1 , wherein the support structure is adhered to a portion of the PCB and a portion of the housing.

4. The image capture device of claim 1 , wherein the protective layer is a mesh.

5. The image capture device of claim 4 , wherein the mesh is a polyester monofilament.

6. The image capture device of claim 4 , wherein the mesh has an acoustic resistance below 700 Rayls.

7. The image capture device of claim 4 , wherein the mesh has a stiffness of above 1×10 6 N/m.

8. The image capture device of claim 1 , wherein the protective layer is a membrane.

9. The image capture device of claim 8 , wherein the membrane is a silicone material or a polytetrafluoroethylene (PTFE) material.

10. The image capture device of claim 8 , wherein the membrane is air permeable or non-air permeable.

11. An image capture device comprising:

a housing that includes a first port that is fluidly connected to a first cavity of the image capture device and an external environment relative to the image capture device;

an audio capture device configured to obtain an audible sound;

a printed circuit board (PCB) electrically coupled to the audio capture device, wherein the PCB includes a second port that is fluidly connected to a second cavity and the audio capture device;

a dampener coupled to the PCB and the housing;

a protective layer that separates the first cavity and the second cavity, wherein the first cavity is defined by a portion of the housing and a portion of the protective layer, and wherein the second cavity is defined by a portion of the PCB and the portion of the protective layer; and

a support structure that is in contact with an edge portion of the protective layer and configured to provide structural support to the protective layer.

12. The image capture device of claim 11 , wherein a portion of the dampener is coupled to the housing.

13. The image capture device of claim 11 , wherein the support structure is adhered to a portion of the dampener and a portion of the PCB.

14. The image capture device of claim 11 , wherein the dampener is a foam material or a thin metal.

15. The image capture device of claim 11 , wherein the protective layer is a mesh.

16. The image capture device of claim 15 , wherein the mesh is a polyester monofilament.

17. The image capture device of claim 15 , wherein the mesh has an acoustic resistance below 700 Rayls.

18. The image capture device of claim 15 , wherein the mesh has a stiffness of above 1×10 6 N/m.

19. The image capture device of claim 11 , wherein the protective layer is a membrane.

20. The image capture device of claim 19 , wherein the membrane is a silicone material or a polytetrafluoroethylene (PTFE) material.

Assignments (6)
SECURITY INTEREST Recorded Aug 4, 2025
From: GOPRO, INC.
To: FARALLON CAPITAL MANAGEMENT, L.L.C., AS AGENT
Reel/Frame 072340/0676 →
SECURITY INTEREST Recorded Aug 4, 2025
From: GOPRO, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 072358/0001 →
RELEASE OF PATENT SECURITY INTEREST Recorded Jan 25, 2021
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: GOPRO, INC.
Reel/Frame 055106/0434 →
SECURITY INTEREST Recorded Oct 19, 2020
From: GOPRO, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 054113/0594 →
SECURITY INTEREST Recorded Sep 5, 2018
From: GOPRO, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 047016/0417 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2018
From: GORNY, JOYCE; TISCH, ERICH; HARDIN, MARK; HANSSON, PER MAGNUS FREDRIK
To: GOPRO, INC.
Reel/Frame 045373/0939 →