IP Library Granted Patent US 10,631,446
Granted Patent B2
US 10,631,446 · App. 15/939,558 · Granted Apr 21, 2020

Electromagnetic wave absorber and electronic device

Inventor: Tatsuya Hirose (Yokohama, JP)
Assignee: FUJITSU LIMITED
H05K9/0024H05K9/0081H05K9/0084H05K9/0086H05K9/0088
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Quick Facts
Patent No.
US 10,631,446
App. No.
15/939,558
Granted
Apr 21, 2020
Kind
B2
Abstract

An electromagnetic wave absorber includes: a first layer having a first enclosing layer that encloses an electromagnetic wave radiator, and a first metal film formed on the first enclosing layer.

Claims (22)

1. An electromagnetic wave absorber comprising:

a first layer having a first enclosing layer that encloses an electromagnetic wave radiator from all directions, and a first metal film formed over the first enclosing layer,

wherein the first metal film has one of a shape having a surface roughness, an uneven shape having a concave portion and a convex portion, and a gentle sloping shape, and

a slit is formed as an opening in the first metal film.

2. The electromagnetic wave absorber according to claim 1 , wherein the first layer includes a second enclosing layer formed over an opposite surface of the first metal film other than a surface of the first metal film where the first enclosing layer is formed.

3. The electromagnetic wave absorber according to claim 1 , further comprising: an electronic circuit mounted over the first metal film.

4. The electromagnetic wave absorber according to claim 1 , wherein the first metal film is electrically coupled to the electromagnetic wave radiator.

5. The electromagnetic wave absorber according to claim 1 , wherein the first metal film has a coiled pattern that is wound around the electromagnetic wave radiator.

6. The electromagnetic wave absorber according to claim 1 , wherein the first enclosing layer contains resin.

7. The electromagnetic wave absorber according to claim 1 , wherein the first enclosing layer contains a carbon material.

8. The electromagnetic wave absorber according to claim 1 , wherein a thickness of the first enclosing layer is (2m−1)/4 times (m is a natural number) a wavelength of electromagnetic waves propagating inside the first enclosing layer.

9. The electromagnetic wave absorber according to claim 1 , further comprising: a second layer having a third enclosing layer that encloses the first layer, and a second metal film formed on the third enclosing layer.

10. The electromagnetic wave absorber according to claim 1 , wherein one or more resistance elements is provided over the slit.

11. An electronic device comprising:

an electromagnetic wave radiator configured to radiate electromagnetic waves; and

an electromagnetic wave absorber configured to enclose the electromagnetic wave radiator;

wherein the electromagnetic wave absorber includes a first layer having a first enclosing layer that encloses the electromagnetic wave radiator from all directions, and a first metal film formed over a surface of the first enclosing layer,

the first metal film has one of a shape having a surface roughness, an uneven shape having a concave portion and a convex portion, and a gentle sloping shape, and

a slit is formed as an opening in the first metal film.

12. The electronic device according to claim 11 , wherein the first metal film has a lower resistivity than a resistivity of ferrite.

13. The electronic device according to claim 11 , wherein the first metal film has a lower resistivity than a resistivity of ferrite.

14. The electronic device according to claim 11 , wherein one or more resistance elements is provided over the slit.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2018
From: HIROSE, TATSUYA
To: FUJITSU LIMITED
Reel/Frame 045763/0162 →