Bulk acoustic wave resonators having doped piezoelectric material and an adhesion and diffusion barrier layer
Bulk acoustic wave (BAW) resonators, and electrical filters that incorporate the BAW resonators, are described. Generally, the BAW resonators comprise a substrate comprising an acoustic reflector; a first electrode disposed over the acoustic reflector; a piezoelectric layer disposed over the first electrode, the piezoelectric layer comprising scandium-doped aluminum nitride (ASN); a diffusion barrier layer disposed over the piezoelectric layer; and a second electrode disposed over the diffusion barrier layer. The diffusion barrier layer configured to prevent diffusion of material of the first electrode into the piezoelectric layer.
1. A bulk acoustic wave (BAW) resonator, comprising:
a substrate comprising an acoustic reflector;
a first electrode disposed over the acoustic reflector;
a piezoelectric layer disposed over the first electrode, the piezoelectric layer comprising scandium-doped aluminum nitride (ASN);
a diffusion barrier layer disposed over the piezoelectric layer, the diffusion barrier layer configured to prevent diffusion of material of the first electrode into the piezoelectric layer, wherein the diffusion barrier layer comprises an adhesive component; and
a second electrode disposed over the diffusion barrier layer.
2. The BAW resonator of claim 1 , wherein the diffusion barrier layer further comprises a diffusion barrier component.
3. The BAW resonator of claim 2 , wherein the adhesive component and the diffusion barrier component are a compound.
4. The BAW resonator of claim 2 , wherein the adhesive component and the diffusion barrier component are separate layers.
5. The BAW resonator of claim 3 , wherein the adhesive component is titanium (Ti).
6. The BAW resonator of claim 5 , wherein the diffusion barrier component comprises one of nitrogen (N), oxygen (O), and tungsten (W).
7. The BAW resonator of claim 1 , wherein the diffusion barrier layer is a binary metal layer comprising titanium (Ti) and tungsten (W).
8. The BAW resonator of claim 3 , wherein the adhesive component is titanium (Ti).
9. The BAW resonator of claim 8 , wherein the diffusion barrier component is platinum (Pt).
10. The BAW resonator of claim 9 , wherein the diffusion barrier layer is disposed directly one an upper surface of the piezoelectric layer.
11. The BAW resonator of claim 9 , wherein the diffusion barrier layer is disposed directly one an upper surface of the piezoelectric layer.
12. The BAW resonator of claim 1 , wherein the scandium-doped aluminum nitride (ASN) has a doping concentration in a range of approximately 3 atomic percent to approximately 40 atomic percent.
13. The BAW resonator of claim 1 , wherein the diffusion barrier layer has a thickness in a range of approximately 50 A to approximately 500 A.
14. The BAW resonator of claim 1 , wherein the first electrode and the second electrode comprise one of molybdenum (Mo) and tungsten (W).
15. A bulk acoustic wave (BAW) resonator, comprising:
a substrate comprising an acoustic reflector;
a first electrode disposed over the acoustic reflector;
a piezoelectric layer disposed over the first electrode, the piezoelectric layer comprising scandium-doped aluminum nitride (ASN);
a first diffusion barrier layer disposed over the piezoelectric layer, the first diffusion barrier layer configured to prevent diffusion of material of the first electrode into the piezoelectric layer;
a second diffusion barrier layer disposed over the first electrode and beneath the piezoelectric layer; and
a second electrode disposed over the second diffusion barrier layer;
wherein the first diffusion barrier layer and the second diffusion barrier layer each comprise an adhesive component.
16. The BAW resonator of claim 15 , wherein the first diffusion barrier layer and the second diffusion barrier layer each comprises a diffusion barrier component.
17. The BAW resonator of claim 16 , wherein the adhesive component and the diffusion barrier component are a compound.
18. The BAW resonator of claim 16 , wherein the adhesive component and the diffusion barrier component are separate layers.
19. The BAW resonator of claim 16 , wherein the adhesive component is titanium (Ti).
20. The BAW resonator of claim 19 , wherein the diffusion barrier component comprises one of nitrogen (N), oxygen (O), and tungsten (W).
21. The BAW resonator of claim 16 , wherein the adhesive component is titanium (Ti).
22. The BAW resonator of claim 21 , wherein the diffusion barrier component is platinum (Pt).
23. An electronic device, comprising:
a substrate comprising an acoustic reflector;
a first electrode disposed over the acoustic reflector;
a piezoelectric layer disposed over a side of the first electrode;
a diffusion barrier layer disposed over a side of the piezoelectric layer, the diffusion barrier layer configured to prevent diffusion of material of the first electrode into the piezoelectric layer, wherein the diffusion barrier layer comprises an adhesive component; and
a second electrode.
24. The electronic device of claim 23 , wherein the diffusion barrier layer is a binary metal layer comprising titanium (Ti) and tungsten (W).