IP Library Granted Patent US 10,535,976
Granted Patent B1
US 10,535,976 · App. 16/044,811 · Granted Jan 14, 2020

Optical device and system having thermal buffers

Inventors: Ramana M. V. Murty (Sunnyvale, CA); Tak Kui Wang (San Jose, CA)
Assignee: Avago Technologies International Sales Pte. Limited
H01S5/02438H01S5/125H01S5/187H01S5/18369
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Quick Facts
Patent No.
US 10,535,976
App. No.
16/044,811
Granted
Jan 14, 2020
Kind
B1
Abstract

A vertical-cavity surface-emitting laser (VCSEL) device includes a first distributed Bragg reflector (DBR) structure of a first conductivity type, and a second DBR structure of a second conductivity type. The second conductivity type is different than the first conductivity type. The VCSEL includes a cavity positioned between the first DBR structure and the second DBR structure. The cavity includes at least one quantum well structure to generate light. The VCSEL includes a first thermal buffer layer positioned between the cavity and the first DBR structure, and a second thermal buffer positioned between the cavity and the second DBR structure.

Claims (50)

1. A vertical-cavity surface-emitting laser (VCSEL) device, comprising:

a first distributed Bragg reflector (DBR) structure of a first conductivity type;

a second DBR structure of a second conductivity type, the second conductivity type being different than the first conductivity type;

at least one quantum well structure positioned between the first DBR structure and the second DBR structure to generate light; and

a first thermal buffer layer positioned between the at least one quantum well structure and the first DBR structure,

wherein a thickness ‘d’ of the first thermal buffer layer satisfies the following equation:

d >√{square root over ( D T Δt )},

where D T is a thermal diffusivity of the first thermal buffer layer, and Δt is a pulse width of a signal that generates a current received by the at least one quantum well structure.

2. The VCSEL device of claim 1 , further comprising:

a second thermal buffer layer positioned between the at least one quantum well structure and the second DBR structure.

3. The VCSEL device of claim 2 , wherein the first thermal buffer layer and the second thermal buffer layer are sufficiently thick to keep the heat generated in the first and second DBR structures from reaching the at least one quantum well structure for a duration of an electrical pulse of the signal.

4. The VCSEL device of claim 2 , wherein the first thermal buffer layer is the first conductivity type, and the second thermal buffer layer is the second conductivity type.

5. The VCSEL device of claim 4 , wherein the first thermal buffer layer has a substantially uniform impurity concentration, and the second thermal buffer layer has a substantially uniform impurity concentration.

6. The VCSEL device of claim 4 , wherein the first thermal buffer layer is compositionally graded in a first direction away from the at least one quantum well structure, and wherein the second thermal buffer layer is compositionally graded in a second direction away from the at least one quantum well structure.

7. The VCSEL device of claim 1 , wherein the first thermal buffer layer includes a current confinement region over at least a portion of the at least one quantum well structure.

8. The VCSEL device of claim 2 , wherein an electrical resistivity of the first thermal buffer layer is uniform and less than a vertical resistivity of the closest layers of the first DBR structure, and an electrical resistivity of the second thermal buffer layer is uniform and less than a vertical resistivity of closest layers of the second DBR structure.

9. The VCSEL device of claim 2 , wherein the first thermal buffer layer and the second thermal buffer layer comprise undoped semiconductor material.

10. The VCSEL device of claim 2 , wherein a thickness of the first thermal buffer layer and a thickness of the second thermal buffer layer are based on a thickness of the at least one quantum well structure, thermal diffusivities of the first and second thermal buffer layers, and a pulse width of a signal that generates a current received by the at least one quantum well structure.

11. The VCSEL device of claim 1 , further comprising:

a cladding layer between the at least one quantum well structure and the first thermal buffer layer.

12. An optical device, comprising:

a first structure including a first plurality of layers with different refractive indices, at least some of the first plurality of layers having a first conductivity type;

a second structure including a second plurality of layers with different refractive indices, at least some of the second plurality of layers having a second conductivity type, the second conductivity type being different than the first conductivity type;

at least one quantum well structure between the first structure and the second structure to generate light; and

a first thermal buffer layer of the first conductivity type positioned between the at least one quantum well structure and the first structure,

wherein a thickness ‘d’ of the first thermal buffer layer satisfies the following equation:

d >√{square root over ( D T Δt )},

where D T is a thermal diffusivity of the first thermal buffer layer, and Δt is a pulse width of a signal that generates a current received by the at least one quantum well structure.

13. The optical device of claim 12 , further comprising:

a second thermal buffer layer positioned between the at least one quantum well structure and the second structure.

14. The optical device of claim 13 , wherein the first thermal buffer layer and the second thermal buffer layer comprise a semiconductor material.

15. The optical device of claim 14 , wherein the first thermal buffer layer is the first conductivity type, and the second thermal buffer layer is the second conductivity type.

16. The optical device of claim 15 , wherein an electrical resistivity of the first thermal buffer layer is uniform and less than a vertical resistivity of the closest layers of the first plurality of layers, and an electrical resistivity of the second thermal buffer layer is uniform and less than a vertical resistivity of the closest layers of the second plurality of layers.

17. The optical device of claim 16 , wherein the electrical resistivity of the second thermal buffer layer is less than the electrical resistivity of the first thermal buffer layer.

18. The optical device of claim 12 , further comprising:

a cladding layer between the at least one quantum well structure and the first thermal buffer layer.

19. An optical system, comprising:

an optical device that emits light toward an object, the optical device including:

a first structure including a first plurality of layers with different refractive indices, at least some of the first plurality of layers having a first conductivity type;

a second structure including a second plurality of layers with different refractive indices, at least some of the second plurality of layers having a second conductivity type, the second conductivity type being different than the first conductivity type;

at least one quantum well structure between the first structure and the second structure to generate light;

a first thermal buffer layer positioned between the at least one quantum well structure and the first structure; and

a second thermal buffer layer positioned between the at least one quantum well structure and the second structure;

a sensor that receives light reflected from the object, the reflected light being a reflected version of the emitted light; and

at least one processor that determines a distance to the object based on output of the sensor,

wherein an electrical resistivity of the first thermal buffer layer is uniform and less than a vertical resistivity of the closest layers of the first plurality of layers, and

wherein an electrical resistivity of the second thermal buffer layer is uniform and less than a vertical resistivity of the closest layers of the second plurality of layers.

20. The optical system of claim 19 , wherein a thickness ‘d’ of the first thermal buffer layer satisfies the following equation:

d >√{square root over ( D T Δt )},

where D T is a thermal diffusivity of the first thermal buffer layer, and Δt is a pulse width of a signal that generates a current received by the at least one quantum well structure.

Assignments (5)
MERGER Recorded Mar 3, 2023
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; BROADCOM INTERNATIONAL PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 062952/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE MERGER AND APPLICATION NOS. 13/237,550 AND 16/103,107 FROM THE MERGER PREVIOUSLY RECORDED ON REEL 047231 FRAME 0369. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048549/0113 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047231/0369 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2018
From: MURTY, RAMANA M. V.; WANG, TAK KUI
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 046455/0502 →