Apparatus and methods for enhancing signaling bandwidth in an integrated circuit package
Embodiments described herein provide an electronic device having an integrated circuit disposed in a surface mount package. The surface mount integrated circuit package comprises a first pin and a second pin of the integrated circuit configured to couple the integrated circuit to a first terminal and a second terminal disposed on a circuit board. The first pin and second pin define a first connector and a second connector of a differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board. The surface mount integrated circuit package comprises an isolation stud disposed between the first pin and the second pin. The isolation stud is disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board.
1. An electronic device having an integrated circuit disposed in a surface mount package, comprising:
a first pin of the integrated circuit configured to couple the integrated circuit to a first terminal disposed on a circuit board, the first pin defining a first connector of a first differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board;
a second pin of the integrated circuit configured to couple the integrated circuit to a second terminal disposed on the circuit board, the second pin defining a second connector of the first differential connector pair in the surface mount integrated circuit package, wherein the second pin is disposed adjacent to the first pin; and
an isolation stud disposed between respective distal ends of the first pin and the second pin, relative to the integrated circuit, the isolation stud being disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board.
2. The device of claim 1 , wherein the surface mount integrated circuit package is a low profile Quad Flat Package.
3. The device of claim 1 , wherein the isolation stud is part of or coupled to a third terminal of the circuit board between the first terminal and the second terminal.
4. The device of claim 1 , further comprising:
a first ground pin adjacent to the first pin configured to couple the integrated circuit to a ground terminal disposed on the circuit board, and a second ground pin adjacent to the second pin configured to couple the integrated circuit to the ground terminal disposed on the circuit board.
5. The device of claim 1 , wherein the first differential connector pair is configured to transmit a pair of differential signals from the integrated circuit to the circuit board.
6. The device of claim 1 , wherein the first differential connector pair is configured to transfer a pair of differential signals received at the circuit board to the integrated circuit.
7. The device of claim 1 , wherein the isolation stud is disposed between the respective distal ends of the first pin and the second pin to enlarge the gap between the respective distal ends of the first pin and the second pin to reduce a level of interference caused by the first connector on the second connector and to reduce a level of interference caused by the second connector on the first connector.
8. The device of claim 1 , wherein the first connector and the second connector that are separated by an isolation stud transfer differential signals at an increased bandwidth relative to pairs of connectors not separated by a corresponding isolation stud.