Method for producing a printed circuit board structure
A method for producing a printed circuit board structure comprising at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layer are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.
1. A method for producing a printed circuit board structure comprising:
embedding a component having at least one connection and connection area within a printed circuit board wherein the at least one connection has a contact layer, an adhesion layer disposed on the contact layer, and an outer barrier layer disposed on the adhesion layer;
producing at least one via from a conductor path in an outer conductor layer, to the at least one connection of the component whereby the at least one via is produced by;
producing at least one opening in the outer conductor layer, in which the at least one opening extends to the outer barrier layer of the at least one connection;
chemically cleaning the at least one opening whereby a thickness of the outer barrier layer is reduced; and
contacting the component embedded in the printed circuit board with a conductor segment by way of the at least one via.
2. The method of claim 1 , wherein the printed circuit board structure further comprises a least one insulation layer and at least one conductor layer, and wherein the component has at least two connections, each of the at least two connections comprising a contact layer and an adhesion layer disposed on the contact layer and an outer barrier layer, wherein the outer barrier layer is disposed on an outer surface of the adhesion layer, and having at least two openings wherein the at least two openings are produced in areas of the at least two connections.
3. The method of claim 2 , wherein the adhesion layer of each of the at least two connections is selected from the group of titanium, titanium-tungsten, and chromium.
4. The method of claim 2 , further comprising applying a mask to the at least one side of the printed circuit board structure in areas that are not to be copper-plated;
applying at least one conductor layer of electrolytic copper-plating to portions not covered by the mask; and
removing the mask.
5. The method of claim 1 , further comprising forming a currentless copper-plating on at least one side of the printed circuit board structure to form a copper layer on an outer surface and in the at least one opening of the outer conductor layer.
6. The method of claim 1 , characterized in that the at least one opening is produced by laser cutting.
7. The method of claim 1 , wherein a material of the outer barrier layer is selected from a group consisting of: nickel, nickel-vanadium, platinum, and cobalt.
8. The method of claim 1 , wherein the at least one via comprises a copper layer disposed in the at least one via.
9. The method of claim 1 , wherein the component is a power component.
10. The method of claim 9 , wherein the power component is an IGBT-Chip/MOSFET.
11. The method of claim 9 , wherein the component is a power diode.