CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.
1 . A circuit device comprising:
a circuit board;
encapsulating resin coating the surfaces of the circuit board;
leads fixed to the circuit board, each lead comprising an end extending from the encapsulating resin; and
one or more recesses formed into a thickness of the encapsulating resin between two of the surfaces of the circuit board.
2 . The circuit device of claim 1 , further comprising
a first side-edge of the circuit board, the first side-edge facing a second side-edge of the circuit board in a longer-side direction of the circuit board; and
a third side-edge of the circuit board, the third side-edge facing a fourth side-edge of the circuit board in a shorter-side direction of the circuit board;
wherein the leads are arranged along the first side-edge and the second side-edge; and
wherein the one or more recesses are provided at a side of each of the third side-edge and the fourth side-edge.
3 . The circuit device of claim 2 , further comprising one or more depressed areas, each depressed area provided at the side of each of the third side-edge and the fourth side-edge of the circuit board, each depressed area formed by depressing a portion of the encapsulating resin inwards in a planar view, wherein the one or more recesses are provided on both sides of the one or more depressed areas.
4 . The circuit device of claim 1 , wherein a circuit-board-side surface of each of the one or more recesses has a step-like shape.
5 . The circuit device of claim 1 , wherein a portion of each of the one or more recesses is located above the circuit board.
6 . The circuit device of claim 1 , wherein one or more cutaway portions are formed in corners of the encapsulating resin.
7 . A circuit device comprising:
a circuit board;
encapsulating resin coating the surfaces of the circuit board;
leads fixed to the circuit board, each lead comprising an end extending from the encapsulating resin;
one or more recesses formed into a thickness of the encapsulating resin between two of the largest planar surfaces of the circuit board; and
a first side-edge of the circuit board, the first side-edge facing a second side-edge of the circuit board in a longer-side direction of the circuit board.
8 . The circuit device of claim 7 , further comprising:
a third side-edge of the circuit board, the third side-edge facing a fourth side-edge of the circuit board in a shorter-side direction of the circuit board;
wherein the leads are arranged along the first side-edge and the second side-edge; and
wherein the one or more recesses are provided at a side of each of the third side-edge and the fourth side-edge.
9 . The circuit device of claim 8 , further comprising one or more depressed areas, each depressed area provided at the side of each of the third side-edge and the fourth side-edge of the circuit board, each depressed area formed by depressing a portion of the encapsulating resin inwards in a planar view, wherein the one or more recesses are provided on both sides of the one or more depressed areas.
10 . The circuit device of claim 7 , wherein a circuit-board-side surface of each of the one or more recesses has a step-like shape.
11 . The circuit device of claim 7 , wherein a portion of each of the one or more recesses is located above the circuit board.
12 . The circuit device of claim 7 , wherein one or more cutaway portions are formed in corners of the encapsulating resin.
13 . A circuit device comprising:
a circuit board;
encapsulating resin coating the surfaces of the circuit board;
leads fixed to the circuit board, each lead comprising an end extending from the encapsulating resin;
one or more recesses formed into the encapsulating resin between two of the largest planar surfaces of the circuit board; and
a third side-edge of the circuit board, the third side-edge facing a fourth side-edge of the circuit board in a shorter-side direction of the circuit board.
14 . The circuit device of claim 13 , further comprising:
a first side-edge of the circuit board, the first side-edge facing a second side-edge of the circuit board in a longer-side direction of the circuit board;
wherein the leads are arranged along the first side-edge and the second side-edge; and
wherein the one or more recesses are provided at a side of each of the third side-edge and the fourth side-edge.
15 . The circuit device of claim 14 , further comprising one or more depressed areas, each depressed area provided at the side of each of the third side-edge and the fourth side-edge of the circuit board, each depressed area formed by depressing a portion of the encapsulating resin inwards in a planar view, wherein the one or more recesses are provided on both sides of the one or more depressed areas.
16 . The circuit device of claim 13 , wherein a circuit-board-side surface of each of the one or more recesses has a step-like shape.
17 . The circuit device of claim 13 , wherein a portion of each of the one or more recesses is located above the circuit board.
18 . The circuit device of claim 13 , wherein one or more cutaway portions are formed in corners of the encapsulating resin.