IP Library Granted Patent US 11,146,039
Granted Patent B2
US 11,146,039 · App. 16/419,379 · Granted Oct 12, 2021

Temperature controlled multi-channel transmitter optical subassembly and transceiver module including same

Inventors: Kai-Sheng Lin (Sugar Land, TX); Hsiu-Che Wang (Rosenberg, TX); Ziliang Cai (Richmond, TX)
Assignee: Applied Optoelectronics, Inc.
H01S5/06804H01S5/02453H01S5/06837H01S5/4087H04B10/40H04B10/506H01S5/005
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Quick Facts
Patent No.
US 11,146,039
App. No.
16/419,379
Granted
Oct 12, 2021
Kind
B2
Abstract

A temperature controlled multi-channel transmitter optical subassembly (TOSA), consistent with embodiments described herein, may be used in a multi-channel optical transceiver. The temperature controlled multi-channel TOSA generally includes an array of lasers to emit a plurality of different channel wavelengths. The lasers may be thermally tuned to the channel wavelengths by establishing a global temperature for the array of lasers such that the amount of heat communicated to each laser is substantially the same. The global temperature may be established, at least in part, by monitoring the shortest channel wavelength and/or a temperature of the lasers. The temperature of the lasers may then get increased via a shared heating device in thermal communication with the lasers until the shortest monitored wavelength substantially reaches the nominal shortest wavelength or the measured temperature substantially equals the global temperature.

Claims (18)

1. An optical subassembly module comprising:

a substrate providing at least one mounting surface for coupling to at least one optical component, the substrate being defined by a first end that extends to a second end;

an array of laser assemblies coupled proximate the first end of the substrate, the array of laser assemblies being configured to emit a plurality of channel wavelengths; and

a resistive heating device thermally coupled to each laser assembly of the array of laser assemblies to establish a global temperature for the array of laser assemblies,

wherein each laser assembly of the array of laser assemblies includes a base that defines a mating surface to couple to the substrate, each base having first and second mounting surfaces disposed opposite each other such that the first and second mounting surfaces face in opposite directions, and wherein the first and second mounting surfaces include first and second laser arrangements, respectively, disposed thereon, the first and second laser arrangements being configured to emit different channel wavelengths relative to each other.

2. The optical subassembly module of claim 1 , further comprising a temperature wavelength controller electrically coupled to the resistive heating device, the temperature wavelength controller to determine an electrical current to apply to the resistive heating device to cause the resistive heating device to establish the global temperature for the array of laser assemblies.

3. The optical subassembly module of claim 2 , wherein the temperature wavelength controller determines the electrical current based on a temperature signal from a temperature sensor associated with the optical subassembly module.

4. The optical subassembly module of claim 2 , wherein the temperature wavelength controller determines the electrical current based on an output of a wavelength meter that monitors at least one channel wavelength emitted by the optical subassembly module.

5. The optical subassembly module of claim 4 , wherein the at least one channel wavelength is the shortest channel wavelength of the emitted plurality of channel wavelengths.

6. The optical subassembly module of claim 1 , wherein the resistive heating device comprises a coil that extends across the array of laser assemblies.

7. The optical subassembly module of claim 1 , wherein the array of laser assemblies include two 1×4 arrays of lasers configured to output eight different channel wavelengths.

8. The optical subassembly module of claim 1 , wherein the substrate further comprises a receiver optical subassembly (ROSA) arrangement coupled to the first end of the substrate proximate to the array of laser assemblies.

9. The optical subassembly module of claim 1 , wherein each laser arrangement of the first and second laser arrangements includes a laser diode driver (LDD), monitor photodiode (PD), and a laser diode (LD).

10. The optical subassembly module of claim 1 , wherein the base includes a mounting section defined at least in part by first and second tapered sidewalls.

11. The optical subassembly module of claim 10 , wherein the mounting section is configured to couple to a corresponding notch provided by the first end of the substrate, and wherein the mounting section and notch form a tongue and groove arrangement to provide mechanical alignment of the base with the substrate.

12. The optical subassembly module of claim 1 , wherein the optical subassembly module is configured to transmit local area network (LAN) wavelength division multiplexed (WDM) channel wavelengths.

13. The optical subassembly module of claim 1 , wherein the mating surface of each base is disposed between the first and second laser assemblies.

14. The optical subassembly of claim 1 , wherein each base of the plurality of laser arrangements is configured to edge mount to the substrate.

Assignments (4)
SECURITY INTEREST Recorded Aug 1, 2025
From: APPLIED OPTOELECTRONICS, INC.
To: BOKF, NA D/B/A BOK FINANCIAL
Reel/Frame 072338/0695 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Nov 20, 2023
From: CIT NORTHBRIDGE CREDIT LLC
To: APPLIED OPTOELECTRONICS, INC.
Reel/Frame 065630/0906 →
PATENT SECURITY AGREEMENT Recorded Nov 28, 2022
From: APPLIED OPTOELECTRONICS, INC.
To: CIT NORTHBRIDGE CREDIT LLC
Reel/Frame 062003/0523 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2019
From: LIN, KAI-SHENG; WANG, HSIU-CHE; CAI, ZILIANG
To: APPLIED OPTOELECTRONICS, INC.
Reel/Frame 049254/0522 →
Continuity (1)
Related Publication 20200373737A1 · Nov 26, 2020