Photodetector and imaging device
A photodetector includes: a photoelectric conversion layer including a first principal surface from which light enters and a second principal surface on the opposite side from the first principal surface and configured to perform photoelectric conversion on the light; a first diffraction grating formed on a side of the second principal surface and including a configuration where first surfaces which extend in a stripe state in a first direction and second surfaces which extend in a stripe state in the first direction and have a height difference with respect to the first surfaces are alternately arranged; metal wires provided at intervals over the first surfaces and the second surfaces and which extend in the first direction or a second direction perpendicular to the first direction; and a second diffraction grating formed over the first diffraction grating and including grooves which are formed at intervals and extend in the second direction.
1. A photodetector, comprising:
a photoelectric conversion layer including a first principal surface from which light enters and a second principal surface on the opposite side from the first principal surface and configured to perform photoelectric conversion on the light;
a first diffraction grating formed on a side of the second principal surface and including a configuration where a plurality of first surfaces which extend in a stripe state in a first direction and a plurality of second surfaces which extend in a stripe state in the first direction and have a height difference with respect to the first surfaces are alternately arranged;
a plurality of metal wires provided at intervals over each of the first surfaces and the second surfaces and which extend in the first direction or a second direction perpendicular to the first direction; and
a second diffraction grating formed over the first diffraction grating and including a plurality of grooves which are formed at intervals and extend in the second direction.
2. The photodetector according to claim 1 , wherein the photoelectric conversion layer includes quantum well layers and barrier layers that are alternately stacked, and
the metal wires extend in the second direction.
3. The photodetector according to claim 1 , wherein
the photoelectric conversion layer includes quantum dots and intermediate layers that are alternately stacked, and
the metal wires extend in the first direction.
4. The photodetector according to claim 2 , further comprising:
a first semiconductor layer formed over the second principal surface of the photoelectric conversion layer and including the first surfaces and the second surfaces; and
a second semiconductor layer formed over the first semiconductor layer,
wherein the second diffraction grating is formed over the second semiconductor layer.
5. The photodetector according to claim 4 , further comprising
a silicon oxide layer formed over the metal wires,
wherein the second semiconductor layer is formed over the silicon oxide layer.
6. The photodetector according to claim 1 , wherein
the photoelectric conversion layer includes a semiconductor substrate of a first conductivity type, and a semiconductor layer of a second conductivity type formed over the semiconductor substrate, and
the metal wires extend in the first direction.
7. An imaging device comprising:
a plurality of pixels that are arranged in an array in a plane, and output photocurrent corresponding to intensity of received light; and
a readout circuit that reads out the photocurrent,
wherein the pixels each includes:
a photoelectric conversion layer including a first principal surface from which light enters and a second principal surface on the opposite side from the first principal surface and configured to perform photoelectric conversion on the light;
a first diffraction grating formed on a side of the second principal surface and including a configuration where a plurality of first surfaces which extend in a stripe state in a first direction and a plurality of second surfaces which extend in a stripe state in the first direction and have a height difference with respect to the first surfaces are alternately arranged;
a plurality of metal wires provided at intervals over each of the first surfaces and the second surfaces and which extend in the first direction or a second direction perpendicular to the first direction; and
a second diffraction grating formed over the first diffraction grating and including a plurality of grooves which are formed at intervals and extend in the second direction.
8. The imaging device according to claim 7 , wherein the photoelectric conversion layer includes quantum well layers and barrier layers that are alternately stacked, and
the metal wires extend in the second direction.
9. The imaging device according to claim 7 , wherein
the photoelectric conversion layer includes quantum dots and intermediate layers that are alternately stacked, and
the metal wires extend in the first direction.
10. The imaging device according to claim 8 , wherein the pixels each further includes:
a first semiconductor layer formed over the second principal surface of the photoelectric conversion layer and including the first surfaces and the second surfaces; and
a second semiconductor layer formed over the first semiconductor layer,
wherein the second diffraction grating is formed over the second semiconductor layer.
11. The imaging device according to claim 10 , wherein the pixels each further includes:
a silicon oxide layer formed over the metal wires,
wherein the second semiconductor layer is formed over the silicon oxide layer.
12. The imaging device according to claim 7 , wherein
the photoelectric conversion layer includes a semiconductor substrate of a first conductivity type, and a semiconductor layer of a second conductivity type formed over the semiconductor substrate, and
the metal wires extend in the first direction.