SUPER-JUNCTION MOSFET WITH INTEGRATED SNUBBER CIRCUIT

1 . A semiconductor device, comprising:

an N-doped pillar comprising a gate structure configured to control a signal between a drain and a source in response to a gate voltage signal; and

a P-doped pillar comprising a capacitive structure, wherein the capacitive structure capacitively couples the P-doped pillar to the gate structure to reduce ringing in the gate voltage signal.

2 . The device of claim 1 , wherein the gate structure comprises a gate oxide surrounding a conductive material and the capacitive structure comprises an oxide surrounding a conductive material.

3 . The device of claim 1 , wherein the gate oxide and the oxide comprise different thicknesses.

4 . The device of claim 1 , comprising a pillar contact between the P-doped pillar and a source plate, and a source contact between the N-doped pillar and the source plate.

5 . The device of claim 4 , wherein the pillar contact comprises a length that is less than a length of the P-doped pillar.

6 . The device of claim 4 , comprising a second P-doped pillar comprising a pillar contact between the second P-doped pillar and the source plate, wherein the second P-doped pillar consists of doped layers of semiconductor material.

7 . The device of claim 1 , comprising an isolation structure, wherein the isolation structure separates the P-doped pillar from the N-doped pillar.

8 . The device of claim 1 , wherein the capacitive structure comprises a length that is the same as a length of the gate structure.

9 . The device of claim 1 , wherein the capacitive structure comprises a length that is different from a length of the gate structure.

10 . The device of claim 1 , wherein the gate structure comprises a vertical trench super-junction MOSFET.

11 . The device of claim 1 , wherein the gate structure comprises a planar super-junction MOSFET.

12 . A method, comprising:

disposing an N-doped pillar and a P-doped pillar on a substrate, the N-doped pillar and the P-doped pillar being separated by an isolation structure;

disposing a source and a gate on the N-doped pillar; and

disposing a capacitive structure on the P-doped pillar, wherein the capacitive structure couples the P-doped pillar to the gate.

13 . The method of claim 12 , wherein disposing the capacitive structure comprises selecting a length for the capacitive structure that produces a chosen capacitance between the P-doped pillar and the gate.

14 . The method of claim 12 , wherein disposing the capacitive structure comprises selecting a length for a pillar contact that produces a chosen resistance in series with the chosen capacitance between the P-doped pillar and the gate.

15 . The method of claim 12 , comprising disposing a pillar contact between the P-doped pillar and a source plate.

16 . A semiconductor device, comprising:

a substrate comprising N-doped pillars and P-doped pillars, wherein in at least one of the N-doped pillars comprises a gate structure;

a common gate bus electrically coupled to the gate structure; and

a gate capacitive structure electrically coupled to the common gate bus, wherein the capacitive structure is disposed within a capacitive P-doped pillar selected from the P-doped pillars.

17 . The device of claim 16 , comprising a P-doped pillar contact between the capacitive P-doped pillar and a source contact.

18 . The device of claim 17 , wherein the P-doped pillar contact comprises a length that is less than a length of the capacitive P-doped pillar.

19 . The device of claim 16 , wherein the N-doped pillars comprise a vertical trench MOSFET, a planar gate MOSFET, or combination thereof.

20 . The device of claim 16 comprising isolation structures between the N-doped pillars and the P-doped pillars.