IP Library Patent Application 16455046
Patent Application
App. No. 16/455,046

SEMICONDUCTOR SENSORS WITH CHARGE DISSIPATION LAYER AND RELATED METHODS

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Quick Facts
Patent No.
US None
App. No.
16/455,046
Filed
Jun 27, 2019
Art Unit
2892
USPC
257/432
Abstract

Implementations of image sensors may include a passivation layer coupled over a silicon layer, a color-filter-array coupled over the passivation layer, a lens coupled over the color-filter-array, and at least two optically transmissive charge dissipation layers coupled over the silicon layer.

Claims (33)

1 . An image sensor comprising:

a passivation layer coupled over a silicon layer;

a color-filter-array coupled over the passivation layer;

a lens coupled over the color-filter-array; and

at least two optically transmissive charge dissipation layers coupled over the silicon layer.

2 . The image sensor of claim 1 , wherein one of the at least two optically transmissive charge dissipation layers is coupled between the lens and the color-filter array.

3 . The image sensor of claim 1 , wherein one of the at least two optically transmissive charge dissipation layers is coupled between the passivation layer and the color-filter array.

4 . The image sensor of claim 1 , wherein the at least two optically transmissive charge dissipation layers comprise a first optically transmissive charge dissipation layer coupled to a first side of the color-filter array and a second optically transmissive charge dissipation layer coupled to a second side of the color-filter-array opposite the first side of the color-filter-array.

5 . The image sensor of claim 1 , wherein each of the at least two optically transmissive charge dissipation layers comprise a thickness less than 0.5 microns.

6 . The image sensor of claim 1 , wherein at least one optically transmissive charge dissipation layer of the at least two optically transmissive charge dissipation layers comprise a conductive organic material.

7 . The image sensor of claim 1 , wherein the at least two optically transmissive charge dissipation layers comprise one of metallic carbon nanotubes or poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate).

8 . An image sensor comprising:

an antireflective coating layer coupled over a silicon layer;

a passivation layer coupled over the antireflective coating layer;

a color-filter-array coupled over the passivation layer;

a lens coupled over the color-filter-array; and

one or more optically transmissive charge dissipation layers coupled between the passivation layer and the lens.

9 . The image sensor of claim 8 , wherein the one or more optically transmissive charge dissipation layers are coupled to a ground.

10 . The image sensor of claim 8 , wherein the one or more optically transmissive charge dissipation layers are electrically floating.

11 . The image sensor of claim 8 , wherein the one or more optically transmissive charge dissipation layers comprise a conductive grid aligned with a perimeter of each pixel or a conductive grid aligned with a perimeter of each filter of a plurality of filters of the color-filter array.

12 . The image sensor of claim 8 , wherein the image sensor is comprised in a gapless chip-scale package.

13 . The image sensor of claim 8 , wherein the one or more optically transmissive charge dissipation layers is between the passivation layer and the color-filter-array.

14 . The image sensor of claim 8 , wherein the one or more optically transmissive charge dissipation layers comprise a thickness less than 100 angstroms.

15 . An image sensor comprising:

a passivation layer coupled over a silicon layer;

an optically transmissive charge dissipation layer coupled between the passivation layer and the silicon layer;

a color-filter-array coupled over the passivation layer; and

a lens coupled over the color-filter-array.

16 . The image sensor of claim 15 , wherein the one or more optically transmissive charge dissipation layers comprise a conductive grid.

17 . The image sensor of claim 15 , wherein the one or more optically transmissive charge dissipation layers comprise a thickness less than 100 angstroms.

18 . The image sensor of claim 15 , wherein the one or more optically transmissive charge dissipation layers are grounded.

19 . The image sensor of claim 15 , wherein the one or more optically transmissive charge dissipation layers are electrically floating.

20 . The image sensor of claim 15 , further comprising a second passivation layer, wherein the optically transmissive charge dissipation layer is coupled between the passivation layer and the second passivation layer.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 050156, FRAME 0421 Recorded Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0639 →
SECURITY INTEREST Recorded Aug 23, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 050156/0421 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 27, 2019
From: MAURITZSON, RICHARD; BANACHOWICZ, BARTOSZ PIOTR; DALEY, JON; VAARTSTRA, BRIAN ANTHONY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049614/0512 →