Neckband headset with noise rejection
A communication headset includes a neckband with a horseshoe-shaped footprint and two microphone tips disposed at two ends of the neckband, the two ends establishing an aperture of the horseshoe-shaped footprint. Each of the two microphone tips includes a slanted base. The communication headset further includes a microphone array including two sets of microphones in a spatial configuration in which the two sets of microphones are disposed on the slanted bases of the two microphone tips. An effective acoustic spacing between the microphones in the microphone array is at least 15 mm.
1. A communication headset comprising:
a neckband with a horseshoe-shaped footprint, comprising surfaces extending along a length of the horseshoe-shaped footprint and having at least one width perpendicular to the length;
two microphone tips disposed at two ends of the neckband, wherein each of the two microphone tips comprises a support structure having a slanted base, the support structure having a first side extending along the length, a second side extending along the at least one width, and a third side forming the slanted base, the slanted base forming a slant angle greater than ten degrees with the second side and being defined by the first side and the second side; and
a microphone array comprising two sets of microphones in a spatial configuration in which the two sets of microphones are disposed on the slanted bases of the two microphone tips, and each comprising at least two microphones disposed at two endpoints of the slanted bases with an effective acoustic spacing of at least 15 mm between the at least two microphones.
2. The communication headset of claim 1 , wherein the microphone array is a quad-microphone array, and wherein each of the two sets of microphones comprises two microphones.
3. The communication headset of claim 1 , wherein a mechanical spacing of the microphones in a set of microphones is maximized on the slanted base.
4. The communication headset of claim 3 , wherein the mechanical spacing exceeds a separation achievable on a non-slanted base.
5. The communication headset of claim 3 , wherein the mechanical spacing is 18 millimeters.
6. The communication headset of claim 3 , wherein the slant angle of the slanted base is selected to maximize the effective acoustic spacing of the microphones in the set of microphones.
7. The communication headset of claim 1 , further comprising a printed circuit board flatly disposed on the slanted base,
wherein one of the two sets of microphones is disposed on the printed circuit board.
8. The communication headset of claim 7 , further comprising a microphone boot, wherein the microphone boot comprises a set of microphone ports for the set of microphones, configured to conduct audio signals toward the set of microphones.
9. The communication headset of claim 8 , wherein the set of microphone ports flare from a printed circuit board-facing side of the microphone boot to an outward-facing side of the microphone boot.
10. The communication headset of claim 8 , wherein the set of microphone ports diverge from a printed circuit board-facing side of the microphone boot to an outward-facing side of the microphone boot.
11. The communication headset of claim 8 , further comprising a windscreen forming a cap enclosing the printed circuit board and the microphone boot, the windscreen comprising a hole pattern aligned with the set of microphone ports.
12. The communication headset of claim 11 , further comprising an acoustic mesh disposed between the microphone boot and the windscreen.
13. The communication headset of claim 1 , further comprising a digital signal processor (DSP) configured to receive audio signals from the microphone array.
14. The communication headset of claim 13 , wherein the DSP is configured to isolate a user's voice from voices of other surrounding speakers, using the audio signals from the microphone array.
15. The communication headset of claim 13 , wherein the DSP is configured to establish a voice pick-up zone around a user's head based on the spatial configuration of the microphone array,
wherein the DSP passes audio signals originating from inside the voice pick-up zone, and
wherein the DSP suppresses audio signals originating from outside the voice pick-up zone.
16. The communication headset of claim 1 , further comprising an audio pod configured to accommodate electronics of the communication headset, wherein the audio pod is a widened section of the neckband.
17. The communication headset of claim 16 , further comprising control elements disposed on the surface of the audio pod.
18. The communication headset of claim 1 , further comprising earbuds.
19. A method for manufacturing a communication headset, the method comprising:
manufacturing a neckband with a horseshoe-shaped footprint, comprising surfaces extending along a length of the horseshoe-shaped footprint and having at least one width perpendicular to the length; and
appending two microphone tips disposed at two ends of the neckband, wherein each of the two microphone tips comprises a support structure having a slanted base, the support structure having a first side extending along the length, a second side extending along the at least one width, and a third side forming the slanted base, the slanted base forming a slant angle greater than ten degrees with the second side and being defined by the first side and the second side,
wherein the two microphone tips comprise a microphone array comprising two sets of microphones in a spatial configuration in which the two sets of microphones are disposed on the slanted bases of the two microphone tips and each comprising at least two microphones disposed at two endpoints of the slanted bases with an effective acoustic spacing of at least 15 mm between the at least two microphones.