IP Library Granted Patent US 10,912,222
Granted Patent B2
US 10,912,222 · App. 16/559,688 · Granted Feb 2, 2021

Cooling system, cooling device, and electronic system

Inventors: Satoshi Inano (Minoh, JP); Hiroyuki Fukuda (Yokohama, JP); Minoru Ishinabe (Atsugi, JP); Yukiko Wakino (Sagamihara, JP)
Assignee: FUJITSU LIMITED
H05K7/20236H05K7/20272
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Quick Facts
Patent No.
US 10,912,222
App. No.
16/559,688
Granted
Feb 2, 2021
Kind
B2
Abstract

A cooling system includes: a cooling device; a pump coupled to the cooling device; and a waste heat device coupled to the cooling device, wherein the cooling device includes: a first refrigerant tank and a second refrigerant tank that each stores a first refrigerant that is output from the waste heat device and input to the waste heat device; and a liquid immersion tank sandwiched between the first refrigerant tank and the second refrigerant tank and configured to hold an electronic device in a second refrigerant that is output from the pump and input to the pump.

Claims (25)

1. A cooling system comprising:

a cooling device;

a pump coupled to the cooling device; and

a waste heat device coupled to the cooling device, wherein

the cooling device includes:

a first refrigerant tank and a second refrigerant tank that each stores a first refrigerant that is output from the waste heat device and input to the waste heat device; and

a liquid immersion tank sandwiched between the first refrigerant tank and the second refrigerant tank and configured to hold an electronic device in a second refrigerant that is output from the pump and input to the pump.

2. The cooling system according to claim 1 , wherein

a first sending refrigerant pipe that sends the first refrigerant flowing from the second refrigerant tank to the first refrigerant tank and a first returning refrigerant pipe that returns the first refrigerant which flows from the first refrigerant tank to the second refrigerant tank penetrate the liquid immersion tank.

3. The cooling system according to claim 1 , wherein

a second sending refrigerant pipe that sends the second refrigerant which flows to the liquid immersion tank and a second returning refrigerant pipe that returns the second refrigerant which flows to the liquid immersion tank penetrate the second refrigerant tank.

4. The cooling system according to claim 1 , further comprising:

a temperature sensor configured to detect a temperature of the second refrigerant which flows from the liquid immersion tank to the pump;

a flow regulator configured to regulate a flow rate of the first refrigerant output from the waste heat device; and

a controller configured to control the pump and the flow regulator based on an output of the temperature sensor.

5. The cooling system according to claim 1 , wherein the pump is disposed in the liquid immersion tank.

6. A cooling device comprising:

a first refrigerant tank and a second refrigerant tank configured to each store a first refrigerant that is output from a waste heat device coupled to the cooling device and input to the waste heat device, and

a liquid immersion tank sandwiched between the first refrigerant tank and the second refrigerant tank and configured to hold an electronic device in a second refrigerant that is output from the pump and input to the pump.

7. The cooling device according to claim 6 , wherein the pump is disposed in the liquid immersion tank.

8. An electronic system comprising:

an electronic device that generates heat;

a first refrigerant tank and a second refrigerant tank that each store a first refrigerant that is output from a waste heat device and input to the waste heat device, and

a liquid immersion tank that is sandwiched between the first refrigerant tank and the second refrigerant tank and that holds the electronic device in a second refrigerant output from the pump and input to the pump.

9. The electronic system according to claim 8 , wherein the pump is disposed in the liquid immersion tank.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2019
From: INANO, SATOSHI; FUKUDA, HIROYUKI; ISHINABE, MINORU; WAKINO, YUKIKO
To: FUJITSU LIMITED
Reel/Frame 050260/0238 →
Priority Claims (1)
JP 2017-074947 · Apr 5, 2017 · national
Continuity (2)
Continuation PCTJP2018008624 · Mar 6, 2018
Related Publication 20190394900A1 · Dec 26, 2019
Cited By (1)
US 12,520,455