Antenna integrated amplifier and transmitter
An antenna integrated amplifier includes a board configured to include an antenna, a radiator that faces the board, a first supporter interposed between the board and the radiator to support the board with respect to the radiator, and configured to include an amplifier to amplify a signal communicated by the antenna, a first bump interposed between the board and the first supporter to be electrically coupled to the antenna and the amplifier, a second supporter interposed between the board and the radiator to support the board with respect to the radiator, and a second bump interposed between the board and the second supporter.
1. An antenna integrated amplifier comprising:
a board configured to include an antenna;
a radiator that faces the board;
a first supporter interposed between the board and the radiator to support the board with respect to the radiator, and configured to include an amplifier to amplify a signal communicated by the antenna;
a first bump interposed between the board and the first supporter to be electrically coupled to the antenna and the amplifier;
a second supporter interposed between the board and the radiator to support the board with respect to the radiator; and
a second bump interposed between the board and the second supporter.
2. The antenna integrated amplifier according to claim 1 , wherein the first supporter includes:
a first resin layer provided over a surface of the radiator that faces the board, the amplifier being embedded in the first resin layer; and
a first redistribution layer provided over the first resin layer and over a board side of the amplifier, and configured to include a first pad to be coupled to the first bump and a first conductor to be coupled to the first pad and the amplifier, and
wherein the second supporter includes:
a second resin layer provided over the surface of the radiator; and
a second redistribution layer provided over a board side of the second resin layer, and configured to include a second pad to be coupled to the second bump and a second conductor located over a radiator side of the second pad and coupled to the second pad.
3. The antenna integrated amplifier according to claim 2 , wherein, in the first supporter, a surface of the amplifier on a radiator side opposite to a first redistribution layer side is exposed from the first resin layer.
4. The antenna integrated amplifier according to claim 2 , wherein the second supporter includes a chip embedded in the second resin layer,
wherein the second redistribution layer is provided over the second resin layer and over a board side of the chip, and
wherein the second conductor is coupled to the second pad and the chip.
5. The antenna integrated amplifier according to claim 4 , wherein, the second supporter, a surface of the chip on a radiator side opposite to a second redistribution layer side is exposed from the second resin layer.
6. The antenna integrated amplifier according to claim 2 , further comprising:
a third bump interposed between the board and the second supporter,
wherein the second supporter includes:
a third conductor that penetrates the second resin layer;
a third pad provided over the second redistribution layer and to be coupled to the third bump; and
a fourth conductor provided in the second redistribution layer coupled to the third pad and the third conductor.
7. The antenna integrated amplifier according to claim 1 , wherein the first supporter and the second supporter are separated from each other.
8. The antenna integrated amplifier according to claim 1 , wherein the first supporter and the second supporter are continuous to each other.
9. The antenna integrated amplifier according to claim 1 , wherein a distance from a surface of the second supporter to a surface of the radiator is equivalent to a distance from a surface of the first supporter to the surface of the radiator.
10. The antenna integrated amplifier according to claim 1 , wherein
the first supporter faces a portion of the board, and
the second supporter faces another portion of the board different from the portion of the board.
11. A communication device comprising:
a converter configured to generate a baseband signal and to convert the baseband signal into a transmitted signal of a predetermined frequency;
a board configured to include an antenna;
a radiator that faces the board;
a first supporter interposed between the board and the radiator to support the board with respect to the radiator, and configured to include an amplifier to amplify the transmitted signal communicated by the antenna;
a first bump interposed between the board and the first supporter to be electrically coupled to the antenna and the amplifier;
a second supporter interposed between the board and the radiator to support the board with respect to the radiator; and
a second bump interposed between the board and the second supporter.