Granted Patent
Utility
US 11,437,426
· Confirmation No. 1717
IMAGE SENSOR CHIP SCALE PACKAGES AND RELATED METHODS
Inventor:
Swarnal BORTHAKUR
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2022-08-17 | ISSUE.NTF |
Issue Notification | 1 | View | |
| 2022-07-29 | IFEE |
Issue Fee Payment (PTO-85B) | 1 | View | |
| 2022-07-29 | N427 |
Post Allowance Communication - Incoming | 2 | View | |
| 2022-07-29 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2022-07-29 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2022-05-10 | NOA |
Notice of Allowance and Fees Due (PTOL-85) | 8 | View | |
| 2022-05-10 | IIFW |
Issue Information including classification, examiner, name, claim, renumbering, etc. | 3 | View | |
| 2022-05-10 | SRFW |
Search information including classification, databases and other search related notes | 4 | View | |
| 2022-05-10 | SRNT |
Examiner's search strategy and results | 19 | View | |
| 2022-05-10 | ANE.I |
Amendment After Final or under 37CFR 1.312, initialed by the examiner. | 1 | View | |
| 2022-05-10 | BIB |
Bibliographic Data Sheet | 1 | View | |
| 2022-04-25 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2022-04-22 | A.NE |
Response After Final Action | 1 | View | |
| 2022-04-22 | CLM |
Claims | 5 | View | |
| 2022-04-22 | REM |
Applicant Arguments/Remarks Made in an Amendment | 4 | View | |
| 2022-04-22 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2022-04-22 | A.NE |
Response After Final Action | — | View | |
| 2022-03-02 | CTFR |
Final Rejection | 13 | View | |
| 2022-03-02 | 892 |
List of references cited by examiner | 1 | View | |
| 2022-03-02 | SRFW |
Search information including classification, databases and other search related notes | 3 | View | |
| 2022-03-02 | SRNT |
Examiner's search strategy and results | 17 | View | |
| 2021-11-26 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2021-11-26 | A... |
Amendment/Request for Reconsideration-After Non-Final Rejection | 1 | View | |
| 2021-11-26 | CLM |
Claims | 5 | View | |
| 2021-11-26 | REM |
Applicant Arguments/Remarks Made in an Amendment | 4 | View | |
| 2021-11-26 | DIST.E.FILE |
Terminal Disclaimer-Filed (Electronic) | 2 | View | |
| 2021-11-26 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2021-11-26 | DISQ.E.FILE |
Terminal Disclaimer-Electronic-Approved | 1 | View | |
| 2021-11-26 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2021-11-26 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2021-08-25 | CTNF |
Non-Final Rejection | 13 | View | |
| 2021-08-25 | 892 |
List of references cited by examiner | 1 | View | |
| 2021-08-25 | SRFW |
Search information including classification, databases and other search related notes | 3 | View | |
| 2021-08-25 | SRNT |
Examiner's search strategy and results | 16 | View | |
| 2021-08-25 | 1449 |
List of References cited by applicant and considered by examiner | 4 | View | |
| 2020-02-27 | NTC.PUB |
Notice of Publication | 1 | View | |
| 2019-11-22 | APP.FILE.REC |
Filing Receipt | 4 | View | |
| 2019-11-22 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2019-11-04 | IDS |
Information Disclosure Statement (IDS) Form (SB08) | 4 | View | |
| 2019-11-04 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2019-11-04 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2019-11-04 | ADS |
Application Data Sheet | 8 | View | |
| 2019-11-04 | SPEC |
Specification | 30 | View | |
| 2019-11-04 | CLM |
Claims | 5 | View | |
| 2019-11-04 | ABST |
Abstract | 1 | View | |
| 2019-11-04 | DRW |
Drawings-only black and white line drawings | 22 | View | |
| 2019-11-04 | OATH |
Oath or Declaration filed | 1 | View | |
| 2019-11-04 | PA.. |
Power of Attorney | 2 | View |
Inventors
Swarnal BORTHAKUR
Boise, ID
Attorneys & Agents of Record
Classification
USPC
438/65
H10F39/024
H10F39/809
H10F39/014
H10W74/137
H10W72/90
H10P74/273
Prosecution
- Examiner
- LEE, CHEUNG
- Art Unit
- 2826
- Customer No.
- 132194
- Docket No.
- ONS02111CCC01US
- Confirmation No.
- 1717
Publication
- Pub. No.
- US20200066783A1
- Pub. Date
- 2020-02-27
Patent Term Adjustment
0days
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 054090, FRAME 0617
Recorded 2023-06-23
from
FAIRCHILD SEMICONDUCTOR CORPORATION,
ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.,
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
SECURITY INTEREST
Recorded 2020-10-16
from
BORTHAKUR, SWARNAL
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2019-11-04
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Quick Facts
- Patent No.
- US 11,437,426
- App. No.
- 16/672,639
- Filed
- 2019-11-04
- Granted
- 2022-09-06
- Pub. No.
- US20200066783A1
- Examiner
- LEE, CHEUNG
- Art Unit
- 2826
- PTA
- 0 days
External Links