Temperature control device with a plurality of electrically conductive terminals, and an optical subassembly module implementing same
In general, a temperature control device for use in laser assemblies and optical subassemblies is disclosed that includes at least two electrically conductive terminals to enable flexible electrical coupling to associated components, e.g., monitor photodiodes and laser diodes, and accommodate a range of laser assembly configurations without the necessity of supplying a negative voltage rail. In more detail, a temperature control device consistent with the present disclosure includes a bottom plate, a top plate, and a plurality of semiconductor elements disposed therebetween. The top plate includes a component mounting surface that provides at least a first and second electrically conductive terminal/pad. The first and second electrically conductive terminals/pads can be electrically isolated, e.g., via a gap, and configured to provide first and second voltage potentials respectively.
1. A temperature control device for use in optical subassemblies, the temperature control device comprising:
a bottom plate to thermally couple to a heatsink;
a top plate coupled to the bottom plate via a plurality of semiconductor elements disposed therebetween, the top plate defining a component mounting surface for coupling to at least first and second optical components;
a first electrically conductive terminal disposed on the top plate to provide a first voltage potential; and
a second conductive terminal disposed on the top plate to provide a second voltage potential, the first and second conductive terminals being isolated by a gap extending therebetween;
wherein the first and second electrically conductive terminals are configured to thermally couple to the heatsink by way of at least the top plate, the plurality of semiconductor elements, and the bottom plate;
wherein a first thermal communication path extends from the first electrically conductive terminal to the heatsink, and a second thermal communication path extends from the second electrically conductive terminal to the heatsink.
2. The temperature control device of claim 1 , wherein the first and second electrically conductive terminals are substantially coplanar with each other.
3. The temperature control device of claim 1 , wherein the first and second electrically conductive terminals are electrically isolated from each other by the gap.
4. The temperature control device of claim 1 , wherein the first optical component comprises a monitor photodiode, and wherein the monitor photodiode includes an associated anode terminal or cathode terminal electrically coupled to the first electrically conductive terminal to receive a voltage having the first voltage potential.
5. The temperature control device of claim 1 , wherein the second optical component comprises a laser arrangement, the laser arrangement comprising a laser diode, and wherein the laser diode is electrically coupled to the second electrically conductive terminal.
6. The temperature control device of claim 1 , wherein the second electrically conductive terminal provides a ground plane.
7. The temperature control device of claim 1 , wherein the first and second electrically conductive terminal provide the same voltage potential.
8. The temperature control device of claim 7 , wherein the first and second electrically conductive terminals are electrically coupled together by a wire bond to provide the same voltage potential.
9. The temperature control device of claim 1 , wherein the first electrically conductive terminal has an overall surface area that is less than the overall surface area of the second electrically conductive terminal.
10. The temperature control device of claim 1 , wherein the first plate includes electrical terminals to receive an electrical signal to induce electrical current across the semiconductor elements.
11. The temperature control device of claim 1 , wherein the second electrically conductive terminal at least partially surrounds the first electrically conductive terminal.
12. A laser assembly for use in an optical subassembly, the laser assembly comprising:
a base having a mounting surface for coupling to at least one optical component;
at least first and second electrical interconnects disposed adjacent the mounting surface to provide first and second voltage potentials, respectively, the first and second electrical interconnects to electrically couple to circuitry of the optical subassembly;
a temperature control device coupled to the mounting surface and providing at least first and second electrically conductive terminals, the first and second electrically conductive terminals being electrically coupled to the first and second electrical interconnects, respectively; and
a monitor photodiode disposed on the first electrically conductive terminal, the monitor photodiode having an anode or cathode electrically disposed on the first electrically conductive terminal to provide the first voltage potential to the anode or cathode, and the monitor photodiode having the other of the anode or cathode electrically coupled to the second electrically conductive terminal to provide the second voltage potential.
13. The laser assembly of claim 12 , wherein the base comprises a TO can header, and the first and second electrical interconnects comprise pins that extend from the TO can header.
14. The laser assembly of claim 12 , wherein the first electrically conductive terminal of the temperature control device has an overall surface area that is less than the second electrically conductive terminal.
15. The laser assembly of claim 12 , wherein the first and second voltage potentials provided by the first and second electrically conductive terminals, respectively, are different.
16. The laser assembly of claim 12 , wherein the temperature control device includes a bottom plate to thermally couple to the mounting surface and a top plate coupled to the bottom plate via a plurality of semiconductor elements disposed therebetween.
17. The laser assembly of claim 16 , wherein the first and second electrically conductive terminals are configured to thermally couple to the mounting surface by way of at least the top plate, the plurality of semiconductor elements, and the bottom plate.
18. The laser assembly of claim 12 , wherein a first thermal communication path extends from the first electrically conductive terminal to the mounting surface, and a second thermal communication path extends from the second electrically conductive terminal to the mounting surface.