Semiconductor devices with single-photon avalanche diodes and rectangular microlenses
An imaging device may include single-photon avalanche diodes (SPADs). The single-photon avalanche diodes may be arranged in an array of microcells (such as a silicon photomultiplier). Each microcell may have an aspect ratio that is greater than 1. Each microcell may be covered by a microlens that also has an aspect ratio that is greater than 1. The microlens may have curvature in a first direction (parallel to the width of the microcell/microlens) and less curvature in a second direction that is orthogonal to the first direction (parallel to the length of the microcell/microlens). Forming non-square, rectangular microcells and microlenses in this fashion may allow for larger microcells that still have satisfactory microlens performance.
1. A semiconductor device comprising:
an array of microcells, wherein a first microcell in the array of microcells comprises:
a single-photon avalanche diode that has an aspect ratio that is greater than 5:1; and
a microlens that covers the single-photon avalanche diode.
2. The semiconductor device defined in claim 1 , wherein the single-photon avalanche diode has a width and a length that is longer than the width, wherein the microlens has a first dimension parallel to the width and a second dimension parallel to the length, and wherein the microlens has an upper surface that is curved along the first dimension.
3. The semiconductor device defined in claim 2 , wherein the upper surface of the microlens has less curvature along the second dimension than along the first dimension.
4. The semiconductor device defined in claim 2 , wherein the width is between 5 microns and 30 microns and wherein the length is between 15 microns and 220 microns.
5. The semiconductor device defined in claim 1 , wherein the first microcell further comprises:
quenching circuitry coupled to the single-photon avalanche diode.
6. The semiconductor device defined in claim 1 , wherein the single-photon avalanche diode is the only single-photon avalanche diode covered by the microlens.
7. A method of forming a semiconductor device comprising:
forming an array of non-square, rectangular single-photon avalanche diodes in a semiconductor substrate, wherein each single-photon avalanche diode has an aspect ratio that is greater than 5:1;
patterning microlens material over the single-photon avalanche diodes; and
reflowing the microlens material to form a plurality of non-square, rectangular microlenses, wherein each non-square, rectangular microlens covers one respective non-square, rectangular single-photon avalanche diode without covering any additional single-photon avalanche diodes.
8. The method defined in claim 7 , wherein patterning the microlens material over the single-photon avalanche diodes comprises:
depositing a layer of material over the single-photon avalanche diodes that has a uniform thickness; and
patterning the layer of material.
9. The method defined in claim 8 , wherein depositing the layer of material over the single-photon avalanche diodes comprises spinning on the layer of material.
10. The method defined in claim 7 , wherein the microlens material comprises acrylic.