IP Library Granted Patent US 11,343,439
Granted Patent B2
US 11,343,439 · App. 16/776,849 · Granted May 24, 2022

High dynamic range imaging pixels with multiple photodiodes

Inventor: Richard Scott Johnson (Boise, ID)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H04N5/2355H01L27/1461H01L27/14643
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Quick Facts
Patent No.
US 11,343,439
App. No.
16/776,849
Granted
May 24, 2022
Kind
B2
Abstract

A high dynamic range imaging pixel may include first and second photodiodes that generate charge in response to incident light. The second photodiode may have a higher sensitivity than the first photodiode. When generated charge in the first photodiode exceeds a given charge level, the charge may overflow through a transistor to a capacitor. The overflow path from the first photodiode to the capacitor may optionally pass through the floating diffusion region. A transistor may be coupled between the first and second photodiodes. A gain select transistor may be coupled between the floating diffusion region and the capacitor. After sampling the overflow charge, the charge from both the first and second photodiodes may be sampled. In one arrangement, overflow charge may be transferred to a capacitor in a subsequent row.

Claims (64)

1. An imaging pixel comprising:

a first photodiode;

a second photodiode;

a first transistor that is coupled between the first photodiode and the second photodiode;

a floating diffusion region;

a second transistor that is coupled between the floating diffusion region and the second photodiode;

a capacitor;

a third transistor that is coupled between the first photodiode and the capacitor; and

a fourth transistor that is coupled between the floating diffusion region and the capacitor.

2. The imaging pixel defined in claim 1 , wherein the first photodiode has a different sensitivity than the second photodiode.

3. The imaging pixel defined in claim 1 , wherein first photodiode has a first sensitivity, the second photodiode has a second sensitivity, and the second sensitivity is greater than the first sensitivity.

4. The imaging pixel defined in claim 3 , wherein the second sensitivity is at least two times greater than the first sensitivity.

5. The imaging pixel defined in claim 1 , wherein the first photodiode is configured to generate first charge in response to incident light, wherein the second photodiode is configured to generate second charge in response to incident light, and wherein a first subset of the first charge is configured to overflow from the first photodiode to the capacitor through the third transistor.

6. The imaging pixel defined in claim 5 , wherein a second subset of the first charge remains in the first photodiode until the end of an integration time and wherein, during a readout period, the first and second transistors are configured to be asserted to transfer the second subset of the first charge and the second charge to the floating diffusion region.

7. The imaging pixel defined in claim 5 , further comprising:

a readout circuit configured to:

sample the first subset of the first charge;

after sampling the first subset of the first charge, sample a first reset level associated with the floating diffusion region;

after sampling the first reset level associated with the floating diffusion region, sample a second reset level associated with the floating diffusion region; and

after sampling the second reset level associated with the floating diffusion region, sample a second subset of the first charge and the second charge.

8. The imaging pixel defined in claim 1 , further comprising:

a reset transistor that is coupled between the capacitor and a bias voltage supply terminal;

a source follower transistor having a gate that is coupled to the floating diffusion region;

a column output line; and

a row select transistor coupled between the column output line and the source follower transistor.

9. An imaging pixel comprising:

a first photodiode having a first sensitivity;

a second photodiode having a second sensitivity that is greater than the first sensitivity;

a first transistor that is coupled between the first photodiode and the second photodiode;

a floating diffusion region;

a second transistor that is coupled between the floating diffusion region and the first photodiode;

a capacitor; and

a conversion gain transistor that is coupled between the floating diffusion region and the capacitor.

10. The imaging pixel defined in claim 9 , wherein the second sensitivity is at least two times greater than the first sensitivity.

11. The imaging pixel defined in claim 9 , further comprising:

a bias voltage supply terminal; and

an anti-blooming transistor that is coupled between the second photodiode and the bias voltage supply terminal.

12. The imaging pixel defined in claim 9 , further comprising:

a reset transistor that is coupled to the capacitor and the conversion gain transistor.

13. The imaging pixel defined in claim 9 , further comprising:

a reset transistor that is coupled between the capacitor and a bias voltage supply terminal;

a source follower transistor having a gate that is coupled to the floating diffusion region;

a column output line; and

a row select transistor coupled between the column output line and the source follower transistor.

14. The imaging pixel defined in claim 9 , wherein the first photodiode is configured to generate first charge in response to incident light, wherein the second photodiode is configured to generate second charge in response to incident light, and wherein a first subset of the first charge is configured to overflow from the first photodiode to the capacitor through the second transistor.

15. The imaging pixel defined in claim 14 , wherein a second subset of the second charge remains in the first photodiode until the end of an integration time and wherein, during a readout period, the first and second transistors are configured to be asserted to transfer the second subset of the first charge and the second charge to the floating diffusion region.

16. The imaging pixel defined in claim 14 , further comprising:

a readout circuit configured to:

sample the first subset of the first charge;

after sampling the first subset of the first charge, sample a first reset level associated with the floating diffusion region;

after sampling the first reset level associated with the floating diffusion region, sample a second reset level associated with the floating diffusion region; and

after sampling the second reset level associated with the floating diffusion region, sample a second subset of the first charge and the second charge.

17. An image sensor comprising an array of imaging pixels that includes a first imaging pixel in a given row, the first imaging pixel comprising:

a first photodiode;

a second photodiode;

a first transistor that is coupled between the first photodiode and the second photodiode;

a floating diffusion region;

a second transistor that is coupled between the floating diffusion region and the second photodiode; and

a third transistor that is coupled between the first photodiode and a capacitor of a second imaging pixel, wherein the second imaging pixel is in a row that is subsequent to the given row.

18. The image sensor defined in claim 17 , wherein the first imaging pixel comprises:

an additional capacitor; and

a fourth transistor that is coupled between the additional capacitor and the floating diffusion region.

19. The image sensor defined in claim 18 , wherein the additional capacitor is coupled to an additional photodiode of a third imaging pixel by a fifth transistor and wherein the third imaging pixel is in a row that is previous to the given row.

20. The image sensor defined in claim 17 , wherein a first sensitivity of the first photodiode is lower than a second sensitivity of the second photodiode.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 052656, FRAME 0842 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064080/0149 →
SECURITY INTEREST Recorded May 13, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 052656/0842 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2020
From: JOHNSON, RICHARD SCOTT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 051671/0576 →