IP Library Patent Application 16787472
Patent Application
App. No. 16/787,472

FLEXIBLE DATALOGGER SYSTEMS

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Quick Facts
Patent No.
US None
App. No.
16/787,472
Filed
Feb 11, 2020
Art Unit
2687
USPC
340/572.7
Abstract

A data logger system is disclosed. Specific implementations include a flexible data logger system. The data logger system may include a flexible substrate and a radio-frequency identification (RFID) communications module coupled to the flexible substrate. The RFID communications module may include an antenna coupled with a RFID chip. The data logger system may also include a microprocessor and a memory module coupled to the flexible substrate, the microprocessor and the memory module electrically coupled with the RFID communications module. The data logger system may also include a temperature sensor coupled to the flexible substrate, the temperature sensor electrically coupled with the microprocessor and memory module, and a power source coupled to the flexible substrate, the power source electrically coupled with the microprocessor, the memory module, the temperature sensor, and the RFID communications module.

Claims (36)

1 . A data logger system, comprising:

a flexible substrate;

a radio-frequency identification (RFID) communications module coupled to the flexible substrate, the RFID communications module comprising an antenna coupled with a RFID chip;

a microprocessor and a memory module coupled to the flexible substrate, the microprocessor and the memory module electrically coupled with the RFID communications module;

a temperature sensor coupled to the flexible substrate, the temperature sensor electrically coupled with the microprocessor and memory module; and

a power source coupled to the flexible substrate, the power source electrically coupled with the microprocessor, the memory module, the temperature sensor, and the RFID communications module.

2 . The system of claim 1 , further comprising a light-emitting diode (LED) coupled to the flexible substrate and electrically coupled with the power source.

3 . The system of claim 1 , wherein the flexible substrate comprises a polymeric material.

4 . The system of claim 1 , wherein the flexible substrate is formed of polyethylene terephthalate (PET).

5 . The system of claim 1 , further comprising a plurality of leads and a plurality of die attach components, wherein the plurality of leads and the plurality of die attach components are formed of electrically conductive ink screen printed onto the flexible substrate.

6 . The system of claim 1 , further comprising a ground plane printed on a side of the flexible substrate.

7 . A data logger system, comprising:

a radio-frequency identification (RFID) communications module comprising an antenna and a RFID chip;

a microprocessor and a memory module coupled with the RFID communications module; and

a sensor coupled with the microprocessor and memory module;

wherein the microprocessor, the memory module, the sensor, and the RFID communications module are electrically coupled to a power source through a plurality of traces; and

wherein the RFID communications module, the microprocessor, the memory module, the sensor, and the plurality of traces are all coupled directly to a flexible substrate.

8 . The system of claim 7 , wherein the sensor is a sensor selected from the group consisting of a temperature sensor, a moisture sensor, a humidity sensor, an accelerometer, a magnetic sensor, a gas sensor, a light sensor, or a xylene gas sensor, and any combination thereof.

9 . The system of claim 7 , further comprising a light-emitting diode (LED) coupled directly to the flexible substrate.

10 . The system of claim 7 , wherein the flexible substrate is formed of polyethylene terephthalate (PET).

11 . The system of claim 7 , further comprising a plurality of leads and a plurality of die attach components, wherein the plurality of leads and the plurality of die attach components are formed of electrically conductive ink screen printed onto the flexible substrate.

12 . The system of claim 7 , further comprising a ground plane printed on a side of the flexible substrate.

13 . A flexible data logger system, comprising:

a radio-frequency identification (RFID) communications module comprising an antenna and a RFID chip;

a microprocessor and a memory module coupled with the RFID communications module; and

a sensor coupled with the microprocessor and memory module;

wherein the microprocessor, the memory module, the sensor, and the RFID communications module are electrically coupled to a power source through a plurality of traces;

wherein the RFID communications module, the microprocessor, the memory module, the sensor, and the plurality of traces are all coupled directly to a flexible substrate; and

wherein the flexible data logger system is configured to be associated with a container to be tracked.

14 . The system of claim 13 , wherein the sensor is configured to provide temperature data associated with the container.

15 . The system of claim 14 , wherein the memory module is configured to store the temperature data.

16 . The system of claim 13 , wherein the flexible data logger system is configured to couple with the container inside the container, outside the container, or under a label coupled to the container.

17 . The system of claim 13 , further comprising a light-emitting diode (LED) configured to activate in response to a signal from the microprocessor.

18 . The system of claim 17 , wherein the signal from the microprocessor is sent in response to a change of a state of one or more bits in the memory module.

19 . The system of claim 13 , wherein the sensor is a temperature sensor configured to be programmable with one or more temperature thresholds.

20 . The system of claim 13 , wherein the flexible substrate is configured to store data related to mechanical and environmental handling of the container through a transportation process.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 052656, FRAME 0842 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064080/0149 →
SECURITY INTEREST Recorded May 13, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 052656/0842 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2020
From: SEITZ, DOUGLAS CAMERON; ESTILLER, ERNEST GIL; MITCHELL, WALKER; COWELL, E. WILLIAM, III
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 051784/0328 →