HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
A casing for semiconductor packages that includes a plurality of press-fit pins is disclosed. Specific implementations include a shaft including a first end and a second end. The first end may include a head. The press-fit pin may include a bonding portion included at the second end. The bonding portion may include a first section extending substantially perpendicular from a longest length of the shaft. The bonding portion may also include an angled section coupled to a bonding foot. The bonding foot may be configured to be ultrasonically welded to a substrate.
1 . A press-fit pin for a semiconductor package, comprising:
a shaft comprising a first end and a second end, the first end comprising a head;
a bonding portion comprised at the second end, the bonding portion comprising a first section extending substantially perpendicular from a longest length of the shaft, the bonding portion further comprising an angled section coupled to a bonding foot;
wherein the bonding foot is configured to be ultrasonically welded to a substrate.
2 . The press-fit pin of claim 1 , wherein the shaft comprises a cylinder.
3 . The press-fit pin of claim 1 , wherein the shaft comprises a rectangular prism.
4 . The press-fit pin of claim 1 , wherein a surface of the bonding foot is substantially planar with the substrate.
5 . The press-fit pin of claim 1 , wherein the press-fit pin is configured to extend from a casing.
6 . The press-fit pin of claim 1 , wherein the press-fit pin is further configured to be molded into a casing.
7 . The press-fit pin of claim 1 , wherein the press-fit pin is configured to electrically couple the substrate to a printed circuit board.
8 . A housing for a semiconductor package, comprising:
a casing; and
a plurality of connectors extending from the casing; and
a plurality of press-fit pins extending from the casing;
wherein the plurality of press-fit pins and the plurality of connectors are molded into the casing; and
wherein the plurality of press-fit pins and at least a portion of each of the plurality of connectors are configured to be ultrasonically welded to a substrate.
9 . The housing of claim 8 , wherein each press-fit pin of the plurality of press-fit pins comprises a shaft comprising a first end and a second end, the first end comprising a head.
10 . The housing of claim 9 , wherein each press-fit pin of the plurality of press-fit pins further comprises a bonding portion comprised at the second end, the bonding portion comprising a first section extending substantially perpendicular from a longest length of the shaft, the bonding portion further comprising an angled section coupled to a bonding foot.
11 . The housing of claim 10 , wherein a surface of the bonding foot is substantially planar with the substrate.
12 . The housing of claim 9 , wherein the shaft comprises a rectangular prism.
13 . The housing of claim 8 , wherein the press-fit pins are only ultrasonically bonded.
14 . The housing of claim 8 , wherein each press-fit pin of the plurality of press-fit pins is configured to electrically couple the substrate to a printed circuit board.
15 . A method of forming a housing for a semiconductor package, comprising:
molding a plurality of press-fit pins into a casing;
placing the casing over a substrate; and
ultrasonically bonding the plurality of press-fit pins to the substrate.
16 . The method of claim 15 , wherein each press-fit pin of the plurality of press-fit pins is configured to electrically couple with a printed circuit board.
17 . The method of claim 15 , wherein the press-fit pins are only ultrasonically bonded.
18 . The method of claim 15 , wherein each press-fit pin of the plurality of press-fit pins comprises a shaft comprising a first end and a second end, the first end comprising a head.
19 . The method of claim 18 , wherein each press-fit pin of the plurality of press-fit pins further comprises a bonding portion comprised at the second end, the bonding portion comprising a first section extending substantially perpendicular from a longest length of the shaft, the bonding portion further comprising an angled section coupled to a bonding foot.
20 . The method of claim 19 , wherein a surface of the bonding foot is substantially planar with the substrate.