IP Library Granted Patent US 11,169,221
Granted Patent B2
US 11,169,221 · App. 16/801,493 · Granted Nov 9, 2021

Target alignment and stray field indicator

Inventor: Jeffrey Eagen (Manchester, NH)
Assignee: Allegro MicroSystems, LLC
G01R33/007G01R33/0023G01R33/025G01R33/07G01R33/09
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Quick Facts
Patent No.
US 11,169,221
App. No.
16/801,493
Granted
Nov 9, 2021
Kind
B2
Abstract

A magnetic field sensor is provided, including a substrate, a first bridge circuit formed on the substrate, the first bridge circuit being arranged to generate a first signal indicative of a motion of a target, and a second bridge circuit formed on the substrate, the second bridge circuit being arranged to generate a second signal indicative of whether the magnetic field sensor is aligned with the target.

Claims (101)

1. A magnetic field sensor, comprising:

a substrate;

a first bridge circuit formed on the substrate, the first bridge circuit being arranged to generate a first signal indicative of a motion of a target; and

a second bridge circuit formed on the substrate, the second bridge circuit being arranged to generate a second signal indicative of whether the magnetic field sensor is aligned with a central axis of the target, the central axis extending along a circumference of the target, and the second bridge circuit being configured such that: (i) the second signal is set to a first level when the magnetic field sensor is aligned with the central axis and (ii) and the second signal is set to a second DC level when the magnetic field sensor is offset from the central axis.

2. The magnetic field sensor of claim 1 , wherein the second signal is further indicative of a presence of a stray magnetic field.

3. The magnetic field sensor of claim 1 , wherein the first bridge circuit includes a full bridge circuit, the second bridge circuit includes a full bridge circuit, and the second signal is further indicative of a presence of a stray magnetic field.

4. The magnetic field sensor of claim 1 , wherein the target includes a gear having an axis of rotation and a width parallel to the axis of rotation, and the second signal indicates whether the magnetic field sensor is offset, from a central axis of the gear, along a width of the gear.

5. The magnetic field sensor of claim 1 , wherein any of the first bridge circuit and the second bridge circuit includes at least one of a Hall effect element, a giant magnetoresistance (GMR) element, a tunnel magnetoresistance (TMR) element, an anisotropic magnetoresistance (AMR) element, or a magnetic tunnel junction (MTJ) element.

6. The magnetic field sensor of claim 1 , wherein:

the substrate has a first axis that intersects a second axis,

the first bridge circuit includes: (i) a first magnetic field sensing element that is coupled in series with a second magnetic field sensing element, and (ii) a third magnetic field sensing element that is coupled in series with a fourth magnetic field sensing element;

the second bridge circuit includes: (i) a fifth magnetic field sensing element that is coupled in series with a sixth magnetic field sensing element, and (ii) a seventh magnetic field sensing element that is coupled in series with an eighth magnetic field sensing element,

the first magnetic field sensing element and the second magnetic field sensing element are formed on opposite sides of the first axis and on the same side of the second axis, the third magnetic field sensing element and the fourth magnetic field sensing element are formed on opposite sides of the first axis and on the same side of the second axis,

the fifth magnetic field sensing element and the sixth magnetic field sensing element are formed on opposite sides of the first axis and the second axis, and

the seventh magnetic field sensing element and the eighth magnetic field sensing element are formed on opposite sides of the first axis and the second axis.

7. The magnetic field sensor of claim 1 , wherein:

the substrate includes a first axis defining a first region and a second region of the substrate, wherein

the first bridge circuit includes: (i) a first plurality of magnetic field sensing elements that are coupled in series, the first plurality of magnetic field sensing elements including a first magnetic field sensing element and a second magnetic field sensing element, the first magnetic field sensing element being formed in the first region of the substrate, and the second magnetic field sensing element being formed in the second region of the substrate, and (ii) a second plurality of magnetic field sensing elements that are coupled in series, the second plurality of magnetic field sensing elements including a third magnetic field sensing element and a fourth magnetic field sensing element, the third magnetic field sensing element being formed in the second region of the substrate, and the fourth magnetic field sensing element being formed in the first region of the substrate;

the second bridge circuit includes: (i) a third plurality of magnetic field sensing elements that are coupled in series, the third plurality of magnetic field sensing elements including a fifth magnetic field sensing element formed in the first region of the substrate and a sixth magnetic field sensing element formed in the second region of the substrate; and (ii) a fourth plurality of magnetic field sensing elements that are coupled in series, the fourth plurality of magnetic field sensing elements including a seventh magnetic field sensing element formed in the first region of the substrate and an eighth magnetic field sensing element formed in the second region of the substrate.

8. The magnetic field sensor of claim 7 , further comprising:

a first terminal for connecting the magnetic field sensor to a voltage source; and

a second terminal for connecting the magnetic field sensor to ground,

wherein, the second magnetic field sensing element is coupled to the first terminal via the first magnetic field sensing element, and the first magnetic field sensing element is coupled to the second terminal via the second magnetic field sensing element,

wherein, the fourth magnetic field sensing element is coupled to the first terminal via the third magnetic field sensing element, and the third magnetic field sensing element is coupled to the second terminal via the fourth magnetic field sensing element,

wherein, the sixth magnetic field sensing element is coupled to the first terminal via the fifth magnetic field sensing element, and the fifth magnetic field sensing element is coupled to the second terminal via the sixth magnetic field sensing element, and

wherein, the seventh magnetic field sensing element is coupled to the second terminal via the eighth magnetic field sensing element, and the eighth magnetic field sensing element is coupled to the first terminal via the seventh magnetic field sensing element.

9. A magnetic field sensor comprising:

a substrate having a first axis defining a first region and a second region, the first region and the second region being on opposite sides of the first axis;

a first plurality of magnetic field sensing elements formed on the substrate, the first plurality of magnetic field sensing elements including a first magnetic field sensing element that is coupled in series with a second magnetic field sensing element, the first magnetic field sensing element being formed in the first region of the substrate and the second magnetic field sensing element being formed in the second region of the substrate; and

a second plurality of magnetic field sensing elements formed on the substrate, the second plurality of magnetic field sensing elements including a third magnetic field sensing element that is coupled in series with fourth magnetic field sensing element, the third magnetic field sensing element formed in the first region of the substrate and a fourth magnetic field sensing element formed in the first region of the substrate,

wherein the second plurality of magnetic field sensing elements is arranged to generate a second signal indicative of whether the magnetic field sensor is aligned with a central axis of a target, the central axis extending along a circumference of the target, and the second bridge circuit being configured such that: (i) the second signal is set to a first level when the magnetic field sensor is aligned with the central axis and (ii) and the second signal is set to a second DC level when the magnetic field sensor is offset from the central axis.

10. The magnetic field sensor of claim 9 , wherein:

the substrate has a second axis that is orthogonal to the first axis;

the first magnetic field sensing element and the second magnetic field sensing element are formed on a same side of the second axis;

the third magnetic field sensing element and the fourth magnetic field sensing element are formed on opposite sides of the second axis.

11. The magnetic field sensor of claim 9 , wherein the first plurality of magnetic field sensing elements are arranged to form a half-bridge circuit, the second plurality of magnetic field sensing elements are arranged to form a half-bridge circuit, and the second signal is further indicative of a presence of a stray magnetic field.

12. The magnetic field sensor of claim 9 , wherein any of the first magnetic field sensing element, the second magnetic field sensing element, the third magnetic field sensing element, and the fourth magnetic field sensing element includes at least one of a Hall effect element, a giant magnetoresistance (GMR) element, a tunnel magnetoresistance (TMR) element, an anisotropic magnetoresistance (AMR) element, or a magnetic tunnel junction (MTJ) element.

13. The magnetic field sensor of claim 9 , further comprising:

a first terminal for connecting the magnetic field sensor to a voltage source; and

a second terminal for connecting the magnetic field sensor to ground,

wherein, the second magnetic field sensing element [B] is coupled to the first terminal [vcc] via the first magnetic field sensing element [A], and the first magnetic field sensing element [A] is coupled to the second terminal [gnd] via the second magnetic field sensing element [B],

wherein, the fourth magnetic field sensing element [G] is coupled to the first terminal [VCC] via the third magnetic field sensing element [E], and the third magnetic field sensing element [E] is coupled to the second terminal [gnd] via the fourth magnetic field sensing element [E].

14. The magnetic field sensor of claim 9 , wherein:

the first plurality of magnetic field sensing elements is configured to generate a first signal indicating a speed of rotation of the target, and

the second plurality of magnetic field sensing elements is configured to generate a second signal indicating whether the magnetic field sensor is aligned with the target.

15. The magnetic field sensor of claim 14 , wherein the target includes a gear having an axis of rotation and a width parallel to the axis of rotation, the second signal indicates whether the magnetic field sensor is offset along the width of the gear.

16. A magnetic field sensor comprising:

a substrate having a first axis and a second axis that intersects the first axis;

a first plurality of magnetic field sensing elements formed on the substrate, the first plurality of magnetic field sensing elements including a first magnetic field sensing element that is coupled in series with a second magnetic field sensing element, the first magnetic field sensing element and the second magnetic field sensing element being formed on opposite sides of the first axis and the second axis;

a second plurality of magnetic field sensing elements formed on the substrate, the second plurality of magnetic field sensing elements including a third magnetic field sensing element that is coupled in series with a fourth magnetic field sensing element, the third magnetic field sensing element and the fourth magnetic field sensing element being formed on opposite sides of the first axis and the second axis, the second plurality of magnetic field sensing elements being electrically coupled to the first plurality of magnetic field sensing elements to form a first bridge circuit,

wherein the second plurality of magnetic field sensing elements is arranged to generate a second signal indicative of whether the magnetic field sensor is aligned with a central axis of a target, the central axis extending along a circumference of the target, and the second bridge circuit being configured such that: (i) the second signal is set to a first level when the magnetic field sensor is aligned with the central axis and (ii) and the second signal is set to a second DC level when the magnetic field sensor is offset from the central axis.

17. The magnetic field sensor of claim 16 , further comprising a processing circuitry configured to:

receive a first internal signal that is generated using the first bridge circuit; and

generate a first output signal based on the first internal signal, the first output signal indicating whether the magnetic field sensor is aligned with the target.

18. The magnetic field sensor of claim 17 , wherein the target includes a gear, and the second signal indicates whether the magnetic field sensor is offset along a width of the gear.

19. The magnetic field sensor of claim 16 , wherein any of the first magnetic field sensing element, the second magnetic field sensing element, the third magnetic field sensing element, and the fourth magnetic field sensing element includes one of a giant magnetoresistance (GMR) element or a tunnel magnetoresistance (TMR) element.

20. The magnetic field sensor of claim 16 , further comprising:

a third plurality of magnetic field sensing elements formed on the substrate, the third plurality of magnetic field sensing elements including a fifth magnetic field sensing element that is coupled in series with a sixth magnetic field sensing element, the fifth magnetic field sensing element and the sixth magnetic field sensing element being formed on the same side of the second axis and opposite sides of the first axis; and

a fourth plurality of magnetic field sensing elements formed on the substrate, the fourth plurality of magnetic field sensing elements being electrically coupled to the third plurality of magnetic field sensing elements to form a second bridge circuit, the fourth plurality of magnetic field sensing elements including a seventh magnetic field sensing element that is coupled in series with an eighth magnetic field sensing element, the seventh magnetic field sensing element and the eighth magnetic field sensing element being formed on a same side of the second axis and on opposite sides of the first axis.

21. The magnetic field sensor of claim 20 , further comprising a processing circuitry configured to:

receive first internal signal that is generated using the first bridge circuit;

receive a second internal signal that is generated using the second bridge circuit;

generate a first output signal based on the first internal signal, the first output signal indicating an offset of the magnetic field sensor relative to the target; and

generate a second output signal based on the second internal signal, the second output signal indicating a speed of rotation of the target.

22. The magnetic field sensor of claim 16 , further comprising a processing circuitry configured to:

receive a first internal signal that is generated using the first bridge circuit; and

generate a first output signal based on the first internal signal, the first output signal indicating whether a stray magnetic field is incident on the magnetic field sensor.

23. A magnetic field sensor, comprising:

a substrate;

a first bridge circuit formed on the substrate, the first bridge circuit being arranged to generate a first signal indicative of a motion of a target; and

a means for generating a second signal indicative of whether the magnetic field sensor is aligned with a central axis of the target, the central axis along a circumference of the target, wherein: (i) the second signal is set to a first level when the magnetic field sensor is aligned with th central axis and (ii) and the second signal is set to a second DC level when the magnetic field sensor is offset from the central axis.

24. A magnetic field sensor comprising:

a substrate having a first axis defining a first region and a second region, the first region and the second region being on opposite sides of the first axis;

a first plurality of magnetic field sensing elements formed on the substrate, the first plurality of magnetic field sensing elements including a first magnetic field sensing element that is coupled in series with a second magnetic field sensing element, the first magnetic field sensing element being formed in the first region of the substrate and the second magnetic field sensing element being formed in the second region of the substrate;

a second plurality of magnetic field sensing elements formed on the substrate, the second plurality of magnetic field sensing elements including a third magnetic field sensing element that is coupled in series with fourth magnetic field sensing element, the third magnetic field sensing element formed in the first region of the substrate and a fourth magnetic field sensing element formed in the first region of the substrate;

a third plurality of magnetic field sensing elements formed on the substrate, the third plurality of magnetic field sensing elements including a fifth magnetic field sensing element that is coupled in series with a sixth magnetic field sensing element, the fifth magnetic field sensing element and the sixth magnetic field sensing element being formed on the same side of the second axis and opposite sides of the first axis; and

a fourth plurality of magnetic field sensing elements formed on the substrate, the fourth plurality of magnetic field sensing elements being electrically coupled to the third plurality of magnetic field sensing elements to form a second bridge circuit, the fourth plurality of magnetic field sensing elements including a seventh magnetic field sensing element that is coupled in series with an eighth magnetic field sensing element, the seventh magnetic field sensing element and the eighth magnetic field sensing element being formed on a same side of the second axis and on opposite sides of the first axis.

25. The magnetic field sensor of claim 24 , further comprising a processing circuitry configured to:

receive first internal signal that is generated using the first bridge circuit;

receive a second internal signal that is generated using the second bridge circuit;

generate a first output signal based on the first internal signal, the first output signal indicating an offset of the magnetic field sensor relative to a target; and

generate a second output signal based on the second internal signal, the second output signal indicating a speed of rotation of the target.

26. A magnetic field sensor comprising:

a substrate having a first axis defining a first region and a second region, the first region and the second region being on opposite sides of the first axis;

a first plurality of magnetic field sensing elements formed on the substrate, the first plurality of magnetic field sensing elements including a first magnetic field sensing element that is coupled in series with a second magnetic field sensing element, the first magnetic field sensing element being formed in the first region of the substrate and the second magnetic field sensing element being formed in the second region of the substrate; and

a second plurality of magnetic field sensing elements formed on the substrate, the second plurality of magnetic field sensing elements including a third magnetic field sensing element that is coupled in series with fourth magnetic field sensing element, the third magnetic field sensing element formed in the first region of the substrate and a fourth magnetic field sensing element formed in the first region of the substrate

a first terminal for connecting the magnetic field sensor to a voltage source; and

a second terminal for connecting the magnetic field sensor to ground,

wherein, the second magnetic field sensing element is coupled to the first terminal via the first magnetic field sensing element, and the first magnetic field sensing element is coupled to the second terminal via the second magnetic field sensing element,

wherein, the fourth magnetic field sensing element is coupled to the first terminal via the third magnetic field sensing element, and the third magnetic field sensing element is coupled to the second terminal via the fourth magnetic field sensing element.

27. A magnetic field sensor, comprising:

a substrate;

a first terminal for connecting the magnetic field sensor to a voltage source;

a second terminal for connecting the magnetic field sensor to ground,

a first bridge circuit formed on the substrate, the first bridge circuit being arranged to generate a first signal indicative of a motion of a target; and

a second bridge circuit formed on the substrate, the second bridge circuit being arranged to generate a second signal indicative of whether the magnetic field sensor is aligned with the target,

wherein the substrate includes a first axis defining a first region and a second region of the substrate, such that: the first bridge circuit includes: (i) a first plurality of magnetic field sensing elements that are coupled in series, the first plurality of magnetic field sensing elements including a first magnetic field sensing element and a second magnetic field sensing element, the first magnetic field sensing element being formed in the first region of the substrate, and the second magnetic field sensing element being formed in the second region of the substrate, and (ii) a second plurality of magnetic field sensing elements that are coupled in series, the second plurality of magnetic field sensing elements including a third magnetic field sensing element and a fourth magnetic field sensing element, the third magnetic field sensing element being formed in the second region of the substrate, and the fourth magnetic field sensing element being formed in the first region of the substrate; and the second bridge circuit includes: (i) a third plurality of magnetic field sensing elements that are coupled in series, the third plurality of magnetic field sensing elements including a fifth magnetic field sensing element formed in the first region of the substrate and a sixth magnetic field sensing element formed in the second region of the substrate; and (ii) a fourth plurality of magnetic field sensing elements that are coupled in series, the fourth plurality of magnetic field sensing elements including a seventh magnetic field sensing element formed in the first region of the substrate and an eighth magnetic field sensing element formed in the second region of the substrate,

wherein, the second magnetic field sensing element is coupled to the first terminal via the first magnetic field sensing element, and the first magnetic field sensing element is coupled to the second terminal via the second magnetic field sensing element,

wherein, the fourth magnetic field sensing element is coupled to the first terminal via the third magnetic field sensing element, and the third magnetic field sensing element is coupled to the second terminal via the fourth magnetic field sensing element,

wherein, the sixth magnetic field sensing element is coupled to the first terminal via the fifth magnetic field sensing element, and the fifth magnetic field sensing element is coupled to the second terminal via the sixth magnetic field sensing element, and

wherein, the seventh magnetic field sensing element is coupled to the second terminal via the eighth magnetic field sensing element, and the eighth magnetic field sensing element is coupled to the first terminal via the seventh magnetic field sensing element.

Assignments (6)
RELEASE OF SECURITY INTEREST IN PATENTS AT REEL 053957/FRAME 0874 Recorded Nov 1, 2023
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 065420/0572 →
RELEASE OF SECURITY INTEREST IN PATENTS (R/F 053957/0620) Recorded Jun 22, 2023
From: MIZUHO BANK, LTD., AS COLLATERAL AGENT
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 064068/0360 →
PATENT SECURITY AGREEMENT Recorded Jun 22, 2023
From: ALLEGRO MICROSYSTEMS, LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS THE COLLATERAL AGENT
Reel/Frame 064068/0459 →
PATENT SECURITY AGREEMENT Recorded Oct 1, 2020
From: ALLEGRO MICROSYSTEMS, LLC
To: MIZUHO BANK LTD., AS COLLATERAL AGENT
Reel/Frame 053957/0620 →
PATENT SECURITY AGREEMENT Recorded Oct 1, 2020
From: ALLEGRO MICROSYSTEMS, LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 053957/0874 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2020
From: EAGEN, JEFFREY
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 051937/0147 →
Continuity (1)
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