IP Library Granted Patent US 11,495,741
Granted Patent B2
US 11,495,741 · App. 16/917,334 · Granted Nov 8, 2022

Bismuth antimony alloys for use as topological insulators

Inventors: Brian R. York (San Jose, CA); Cherngye Hwang (San Jose, CA); Alan Spool (San Jose, CA); Michael Gribelyuk (San Jose, CA); Quang Le (San Jose, CA)
Assignee: Western Digital Technologies, Inc.
H01L43/10H01L27/222H01L43/04H01L43/06H03B15/006
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Quick Facts
Patent No.
US 11,495,741
App. No.
16/917,334
Granted
Nov 8, 2022
Kind
B2
Abstract

A SOT device includes a bismuth antimony dopant element (BiSbE) alloy layer over a substrate. The BiSbE alloy layer is used as a topological insulator. The BiSbE alloy layer includes bismuth, antimony, AND a dopant element. The dopant element is a non-metallic dopant element, a metallic dopant element, and combinations thereof. Examples of metallic dopant elements include Ni, Co, Fe, CoFe, NiFe, NiCo, NiCu, CoCu, NiAg, CuAg, Cu, Al, Zn, Ag, Ga, In, or combinations thereof. Examples of non-metallic dopant elements include Si, P, Ge, or combinations thereof. The BiSbE alloy layer can include a plurality of BiSb lamellae layers and one or more dopant element lamellae layers. The BiSbE alloy layer has a (012) orientation.

Claims (39)

1. A spin-orbit torque (SOT) device, comprising:

a substrate; and

a bismuth antimony dopant element (BiSbE) alloy layer over the substrate, the BiSbE alloy layer having a (012) orientation, the BiSbE alloy layer comprising,

bismuth;

antimony; and

one or more dopant element lamellae layers at least at a top edge of the BiSbE alloy layer, each of the one or more dopant element lamellae layers comprising a dopant element comprising a material selected from a group consisting of a non-metallic dopant element, a metallic dopant element, and combinations thereof.

2. The SOT device of claim 1 , wherein the dopant element is the metallic dopant element selected from a group consisting Ni, Co, Fe, CoFe, NiFe, NiCo, NiCu, CoCu, NiAg, CuAg, Cu, Al, Zn, Ag, Ga, In, and combinations thereof.

3. The SOT device of claim 1 , wherein the dopant element is the non-metallic dopant element is selected from a group consisting Si, P, Ge, and combinations thereof.

4. The SOT device of claim 1 , wherein the BiSbE alloy layer comprises the dopant element from 0.5 atomic % to 15 atomic %.

5. The SOT device of claim 1 , wherein the BiSbE alloy layer comprises Bi 1-x Sb x E wherein x is 0.05<x<0.22.

6. The SOT device of claim 1 , wherein the BiSbE alloy layer is formed to a thickness from 20 Å to 200 Å.

7. A SOT MRAM device, comprising the SOT device of claim 1 , wherein the BiSbE alloy layer is a spin orbit material electrode proximate to a free perpendicular magnetic anisotropy ferromagnetic layer.

8. A SOT-based energy-assisted magnetic recording (EAMR) write heads, comprising the SOT device of claim 1 , wherein the BiSbE alloy layer is proximate to a spin-torque layer.

9. The SOT device of claim 1 , wherein the BiSbE alloy layer further comprises the one or more dopant element lamellae layers throughout the BiSbE alloy layer.

10. A spin-orbit torque (SOT) device, comprising:

a substrate; and

a bismuth antimony dopant element (BiSbE) alloy layer over the substrate, the BiSbE alloy layer having a (012) orientation, the BiSbE alloy layer comprising,

a plurality of BiSb lamellae layers; and

one or more dopant element lamellae layers, each of the dopant element lamellae layers comprising a material selected from a group a non-metallic dopant element, a metallic dopant element, and combinations thereof, wherein the one or more dopant element lamellae layers are at a bottom edge of the BiSbE alloy layer and throughout the BiSbE alloy layer.

11. The SOT device of claim 10 , wherein each of the dopant element lamellae layers comprises the metallic dopant element selected from a group consisting Ni, Co, Fe, CoFe, NiFe, NiCo, NiCu, CoCu, NiAg, CuAg, Cu, Al, Zn, Ag, Ga, In, and combinations thereof.

12. The SOT device of claim 10 , wherein each of the dopant element lamellae layers comprises the non-metallic dopant element selected from a group consisting Si, P, Ge, and combinations thereof.

13. The SOT device of claim 10 , wherein the BiSbE alloy layer further comprises the one or more dopant element lamellae layers at a top edge of the BiSbE alloy layer.

14. The SOT device of claim 10 , wherein the BiSbE alloy layer further comprises the one or more dopant element lamellae layers modulated in the BiSbE alloy layer.

15. A SOT MRAM device, comprising the SOT device of claim 10 , wherein the BiSbE alloy layer is a spin orbit material electrode proximate to a free perpendicular magnetic anisotropy ferromagnetic layer.

16. A SOT-based energy-assisted magnetic recording (EAMR) write heads, comprising the SOT device of claim 10 , wherein the BiSbE alloy layer is proximate to a spin-torque layer.

17. The SOT device of claim 10 , wherein the BiSbE alloy layer comprises Bi 1-x Sb x E wherein x is 0.05<x<0.22.

18. A magnetoresistive random access memory (MRAM) device, comprising:

a bismuth antimony dopant element (BiSbE) alloy layer, the BiSbE alloy layer having a (012) orientation, the BiSbE alloy layer comprising,

bismuth;

antimony; and

one or more metallic dopant element lamellae layers throughout the BiSbE alloy layer, each of the one or more metallic dopant element lamellae layers comprising a metallic dopant element selected from a group consisting of Ni, Co, Fe, CoFe, NiFe, NiCo, NiCu, CoCu, NiAg, CuAg, Cu, Al, Zn, Ag, Ga, In, and combinations thereof; and

a perpendicular magnetic anisotropy (PMA) ferromagnetic layer.

19. The MRAM device of claim 18 , wherein the BiSbE alloy layer comprises:

a plurality of BiSb lamellae layers comprising the bismuth and the antimony.

20. The MRAM device of claim 19 , wherein the BiSbE alloy layer comprises the one or more metallic dopant element lamellae layers at least at a bottom edge of the BiSbE alloy layer.

21. The MRAM device of claim 18 , wherein the PMA ferromagnetic layer is an annealed PMA ferromagnetic layer.

22. The MRAM device of claim 18 , wherein the BiSbE alloy layer has a roughness (R a ) of 14 Å or less after the PMA ferromagnetic layer is annealed.

23. The MRAM device of claim 18 , wherein the BiSbE alloy layer has a rocking curve of 11 degrees or less.

24. The MRAM device of claim 18 , wherein the BiSbE alloy layer is a topological insulator after the PMA ferromagnetic layer is annealed.

Assignments (5)
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
RELEASE OF SECURITY INTEREST AT REEL 053926 FRAME 0446 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058966/0321 →
SECURITY INTEREST Recorded Sep 29, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 053926/0446 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 24, 2020
From: YORK, BRIAN R.; HWANG, CHERNGYE; SPOOL, ALAN; GRIBELYUK, MICHAEL; LE, QUANG
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 053306/0871 →
Continuity (1)
Related Publication 20210408370A1 · Dec 30, 2021
Cited By (3)
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