Condensation curable composition comprising siloxane-imide crosslinker
A condensation curable silicone adhesive composition comprising a condensation curable organopolysiloxane, siloxane-imide crosslinker, a condensation catalyst and an additive is shown and described herein. The composition is curable at relatively room temperatures and shows good heat stability.
1. A condensation curable composition comprising: (a) a condensation curable organopolysiloxane (b) a silicone-imide crosslinker; (c) a condensation cure catalyst and (d) optionally, an additive, wherein the silicone-imide crosslinker (b) is selected from a compound of the formula (II):
R 1 is chosen from a C5-C20 aryl, a polycyclic aryl group comprising two or more C5-C20 aryl groups, where R 1 can be unsubstituted or substituted with a C1-C6 alkyl, a halogen, a haloalkyl, a hydroxy, and/or a C1-C5 alkoxy groups;
A and B can be same or different and can be chosen from residue of the formula (III) or the formula (IV):
wherein G can be chosen from C1 to C5 alkyl, a C5-C20 aryl, a C7-C16 arylalkyl, or a C7-C16 alkylaryl;
R 2 , R 3 , and R 4 may be same or different and can be chosen from a C1-C3 alkyl or phenyl;
R 5 may be same or different and can be chosen from C1-C30 alkyl, a C1-C30 alkoxy group, a C1-C30 acetoxy group, or a C1-C30 ketoxime group; and
n is an integer between 1 and 30; with the proviso that, where both A and B represent a residue of formula (III), at least two of the groups R 5 are C 1 -C 30 alkoxy groups, C 1 -C 30 acetoxy groups, or C 1 to C 30 ketoxime groups,
wherein D can be chosen from a C1-C5 alkyl, a C5-C20 aryl, a C7 to C16 arylalkyl, or C7 to C16 alkylaryl, and
R 6 can be chosen from C1 to C30 alkyl or ketoxime.
2. The curable silicone of claim 1 , wherein R 1 is selected from benzene, naphthalene, benzophenone, biphenyl, a biphenyl alkane, biphenylether, isopropylidinediphenylphenoxy, biphenyl sulfone, biphenyl sulfide, norbornyl and hexafluoromethylbiphenyl.
3. The curable composition of claim 1 , wherein R 1 is benzene.
4. The curable composition of claim 1 , wherein A and B are each of the formula (III).
5. The curable composition of claim 4 , wherein R 5 is selected from an C1-C30 alkoxy group.
6. The curable composition of claim 1 , wherein A and B are each of the formula (IV).
7. The curable composition of claim 1 , wherein the silicone-imide cross linker (b) is present in an amount of from about 2 weight percent to about 20 weight percent by weight based on the total parts by weight of the curable silicone composition.
8. The curable composition of claim 1 , wherein the silicone-imide cross linker (b) is present in an amount of from about 5 weight percent to about 9.5 weight percent based on the total parts by weight of the curable silicone composition.
9. The curable silicone of claim 1 , wherein the condensation curable organopolysiloxane (a) is selected from a compound of the formula M 1 a D 1 b D 2 c M 2 d T 1 e T 2 f Q wherein:
M 1 =R 7 R 8 R 9 SiO 1/2
D 1 =R 10 R 11 Sio 2/2
D 2 =R 12 R 13 SiO 2/2
M 2 =R 14 R 15 R 16 Sio 1/2
T 1 =R 17 SiO 3/2
T 2 =R 18 SiO 3/2
Q=SiO 4/2
R 7 , R 8 , R 9 , R 14 , R 15 , R 16 , and R 17 are each independently chosen from a hydroxy group, C1-C30 hydrocarbon, or C1-C30 alkoxy group;
R 10 , R 11 , R 12 , R 13 , and R 18 are independently chosen from a C1-C30 hydrocarbon or a C6-C30 aromatic group;
with the proviso that at least one of R 7 , R 8 , R 9 , R 14 , R 15 , R 16 , and R 17 are selected from a hydroxy group or C1-C30 alkoxy group; and at least one of R 12 , R 13 and R 18 is selected from a C6-C30 aromatic group; and
the subscripts a, b, c, and d are positive integers, and e and f are 0 or a positive integer subject to the following limitations: 2<a+b+c+d+e+f<2000, and b+c>0.
10. The curable silicone composition of claim 1 , wherein the condensation curable organopolysiloxane (a) is selected from a compound of the formula M 1 a D 1 b D 2 c M 2 d wherein:
M 1 =R 7 R 8 R 9 SiO 1/2
D 1 =R 10 R 11 Sio 2/2
D 2 =R 12 R 13 Sio 2/2
M 2 =R 14 R 15 R 16 Sio 1/2
where R 7 , R 8 , R 9 , R 14 , R 15 , and R 16 are each independently chosen from a hydroxy group, C1-C30 hydrocarbon or C1-C30 alkoxy group;
R 10 , R 11 , R 12 , and R 13 are independently chosen from a C1-C30 hydrocarbon or a C6-C30 aromatic group;
with the proviso that at least one of R 7 , R 8 , R 9 , R 14 , R 15 and R 16 are selected from a hydroxy group or C1-C30 alkoxy group; and at least one of R 10 , R 11 , R 12 and R 13 is selected from a C6-C30 aromatic group; and
the subscripts a, b, c, d, are positive integers subject to the following limitations: 2<a+b+c+d<2000, b+c>0.
11. The curable composition of claim 9 , wherein R 7 and R 14 are each a hydroxy group.
12. The curable composition of claim 1 , comprising the condensation curable organopolysiloxane (a) in an amount of from about 60 weight % to about 95 weight % based on the total parts by weight of the curable silicone composition.
13. The curable silicone composition of claim 1 , wherein the catalyst (c) is selected from (i) a metal or organometal catalyst comprising a metal selected from Ca, Ce, Bi, Fe, Mo, Mn, Pb, Ti, V, Zn, Sn, and Y, or (ii) a non-tin catalyst comprising a combination of a carboxylic acid component, an amino containing silane or a mixture of amino-containing silanes, and optionally an amino containing siloxane component.
14. The curable silicone composition of claim 13 , wherein the organometal catalyst is dibutyltin dilaurate.
15. The curable composition of claim 1 , comprising the catalyst (c) in an amount of from about 0.01 weight percent to about 5 weight percent based on the total parts by weight of the curable silicone composition.
16. The curable silicone composition of claim 1 , wherein the additive (d) is selected from a filler, a pigment, a lubricant, a viscosity modifier, an antioxidant, a photostabilizer, a heat stabilizer, a flame retardant, an inhibitor, an adhesion promoter, or a combination of two or more thereof.
17. The curable composition of claim 16 , wherein the additive (d) is a filler selected from SiO 2 , TiO2, MgO, ZnO, CaCO 3 , CeO 2 , Fe 2 O 3 , SiC, Clay Material, Graphene Oxide, Boron Oxide, BN, Carbon Nano Tube, Zirconium Oxide, Fly Ash, Zr(OEt) 4 , Ti(OEt) 4 , a powder form of any Polyimide, Polybenzimidazole, Polyamideimide, Poly BPA Sulfone, Siloxane-Polyimide, Siloxane-Benzimidazole, Siloxane-Polysulfones, a combination of two or more thereof.
18. The curable composition of claim 17 , wherein the filler is Fe 2 O 3 .
19. The curable composition of claim 17 , comprising the filler in an amount of from about 0 weight percent to about 50 weight percent based on the total weight of the curable composition.
20. The curable composition of claim 17 , comprising the filler in an amount of from about 10 weight percent to about 40 weight percent based on the total weight of the curable silicone composition.
21. A cured silicone-imide material formed from the composition of claim 1 .
22. The cured silicone-imide material of claim 21 having a thermal degradation of 400° C. to 600° C. as measured by thermogravimetric analysis at a heating rate of 10° C./min till 1000° C.
23. The cured material of claim 21 , wherein the cured silicone-imide material is employed on or as part of an article in an aerospace device, an electronic device, an electronic component, an automobile, insulation, a coating, or solvent resistant membranes.
24. An article comprising a substrate, wherein the silicone-imide composition of claim 1 is coated or adhered on a surface of the substrate.
25. The article of claim 24 , wherein the substrate comprises a material selected from a plastic material, a ceramic, a glass, a rubber material, a filled metal, a metal alloy, a metallized plastic, a coated or painted metal, or a combination of two or more thereof.
26. The article of claim 25 , wherein the substrate material is selected from an acrylic polymer, a polyester, a polyamide, a polyimide, an acrylonitrile-styrene copolymer, a styrene-acrylonitrile-butadiene terpolymer, polyvinyl chloride, polyethylene, polycarbonate, a copolycarbonate, or a combination of two or more thereof.