Bone conduction speaker
The present disclosure relates to a magnetic circuit assembly of a bone conduction speaker. The magnetic circuit assembly may generate a first magnetic field. The magnetic circuit assembly may include a first magnetic element, and the first magnetic element may generate a second magnetic field. The magnetic circuit may further include a first magnetic guide element and at least one second magnetic element. The at least one second magnetic element may be configured to surround the first magnetic element and a magnetic gap may be configured between the second magnetic element and the first magnetic element. A magnetic field strength of the first magnetic field within the magnetic gap may exceed a magnetic field strength of the second magnetic field within the magnetic gap.
1. A magnetic circuit assembly of a bone conduction speaker, comprising:
a first magnetic element generating a first magnetic field;
a first magnetic guide element;
a second magnetic guide element, at least a portion of the second magnetic guide element being configured to surround the first magnetic element and a magnetic gap being configured between the second magnetic guide element and the first magnetic element;
at least one second magnetic element connected with an upper surface of the first magnetic guide element, wherein the at least one second magnetic element generates a second magnetic field, the second magnetic field increases a magnetic field strength of the first magnetic field within the magnetic gap, and a thickness of the at least one second magnetic element is less than or equal to a thickness of the first magnetic element;
at least one third magnetic element configured to surround the at least one second magnetic element; and
at least one fourth magnetic element, wherein the forth magnetic element is connected with the second magnetic guide element and the at least one third magnetic element.
2. The magnetic circuit assembly of claim 1 , wherein an included angle between a magnetization direction of the at least one second magnetic element and a magnetization direction of the first magnetic element is in a range from 150 degrees to 180 degrees.
3. The magnetic circuit assembly of claim 1 , wherein a ratio of the thickness of the first magnetic element to a sum of the thickness of the first magnetic element, the thickness of the at least one second magnetic element, and a thickness of the first magnetic guide element ranges from 0.4 to 0.6.
4. The magnetic circuit assembly of claim 1 , wherein an included angle between a magnetization direction of the at least one third magnetic element and a magnetization direction of the first magnetic element is in a range from 45 degrees to 135 degrees.
5. The magnetic circuit assembly of claim 4 , wherein the included angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is not less than 90 degrees.
6. The magnetic circuit assembly of claim 1 , wherein an included angle between a magnetization direction of the at least one fourth magnetic element and a magnetization direction of the first magnetic element is not less than 90 degrees.
7. The magnetic circuit assembly of claim 1 , further comprising:
at least one fifth magnetic element located below the magnetic gap, wherein the at least one fifth magnetic element is connected with the first magnetic element and the second magnetic guide element.
8. A magnetic circuit assembly of a bone conduction speaker, wherein the magnetic assembly generates a first magnetic field, the magnetic circuit assembly includes:
a first magnetic element generating a second magnetic field;
a first magnetic guide element;
a second magnetic guide element, wherein the second magnetic guide element includes a baseplate and a side wall, the baseplate of the second magnetic guide element is connected with the first magnetic element;
at least one second magnetic element, wherein the at least one second magnetic element is connected with the side wall of the second magnetic guide element, a magnetic gap being configured between the at least one second magnetic element and the first magnetic element; and
at least one third magnetic element, wherein the at least one third magnetic element is connected with the baseplate and the side wall of the second magnetic guide element, a magnetic field strength of the first magnetic field within the magnetic gap exceeds a magnetic field strength of the second magnetic field within the magnetic gap.
9. The magnetic circuit assembly of claim 8 , wherein an included angle between a magnetization direction of the at least one second magnetic element and a magnetization direction of the first magnetic element is not less than 90 degrees.
10. The magnetic circuit assembly of claim 8 , wherein the included angle between a magnetization direction of the at least one third magnetic element and a magnetization direction of the first magnetic element is not less than 90 degrees.
11. The magnetic circuit assembly of claim 8 , further comprising:
at least one fourth magnetic element, wherein the at least one fourth magnetic element is connected with an upper surface of the at least one second magnetic element and the side wall of the second magnetic guide element.
12. The magnetic circuit assembly of claim 11 , wherein an included angle between a magnetization direction of the at least one fourth magnetic element and a magnetization direction of the first magnetic element is not less than 90 degrees.
13. The magnetic circuit assembly of claim 8 , further comprising:
at least one fifth magnetic element connected with an upper surface of the first magnetic guide element.
14. The magnetic circuit assembly of claim 13 , wherein an included angle between a magnetization direction of the at least one fifth magnetic element and a magnetization direction of the first magnetic element is in a range from 150 degrees to 180 degrees.
15. The magnetic circuit assembly of claim 13 , wherein a ratio of a thickness of the first magnetic element to a sum of the thickness of the first magnetic element, a thickness of the at least one fifth magnetic element, and a thickness of the first magnetic guide element ranges from 0.4 to 0.6.
16. The magnetic circuit assembly of claim 13 , wherein a thickness of the at least one fifth magnetic element is less than or equal to a thickness of the first magnetic element.
17. The magnetic circuit assembly of claim 13 , further comprising:
a third magnetic guide element connected with an upper surface of the fifth magnetic element, wherein the third magnetic guide element is configured to suppress leakage of a field strength of the first magnetic field.
18. The magnetic circuit assembly of claim 8 , further comprising:
at least one conductive element connected with at least one of the first magnetic element, the first magnetic guide element, or the second magnetic guide element.