IP Library Granted Patent US 11,677,329
Granted Patent B2
US 11,677,329 · App. 17/267,836 · Granted Jun 13, 2023

Control system for medium voltage variable frequency drive

Inventors: Paolo Malapelle (Verona, IT); James A. Buckey (Lower Burrell, PA); Shelby Chun (Mt. Lebanon, PA); Alan Wright (Sarver, PA); Grigoriy Puchkarev (Tarentum, PA)
Assignee: Siemens Aktiengesellschaft
H02M7/49H02M1/0012H02M7/003H02M7/4835H03K19/17712H02M7/53873
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Quick Facts
Patent No.
US 11,677,329
App. No.
17/267,836
Granted
Jun 13, 2023
Kind
B2
Abstract

A drive system ( 300 ) includes a plurality of power cells ( 312 ) supplying power to one or more output phases (A, B, C), each power cell ( 312 ) having multiple switching devices ( 315 a - d ) incorporating semiconductor switches, and a control system ( 400 ) in communication with the plurality of power cells ( 312 ) and controlling operation of the plurality of power cells ( 312 ), wherein the control system ( 400 ) includes a system on chip ( 410 ) with one or more central processing units ( 412, 414 ) and a field programmable gate array ( 416 ) in communication with the one or more central processing units ( 412, 414 ).

Claims (36)

1. A drive system comprising:

a plurality of power cells supplying power to one or more output phases, each power cell comprising multiple switching devices incorporating semiconductor switches, and

a control system in communication with the plurality of power cells and controlling operation of the plurality of power cells,

wherein the control system comprises a system on chip comprising

one or more central processing units, and

a field programmable gate array in communication with the one or more central processing units,

wherein the system on chip comprises first and second central processing units in communication with each other,

wherein the second central processing unit is configured to receive power cell control information and to generate first operating commands, and

wherein the first central processing unit is configured to receive command and status information and to generate at least one instruction based upon the command and status information, the at least one instruction configured to instruct the second central processing unit to generate second operating commands.

2. The drive system of claim 1 ,

wherein the system on chip further comprises a dedicated data bus between the one or more central processing units and the field programmable gate array.

3. The drive system of claim 1 ,

wherein the field programmable gate array is in communication with the plurality of power cells and is configured to

receive the power cell control information from each of the plurality of power cells,

transmit the power cell control information to the second central processing unit, and

receive the first and second operating commands from the second central processing unit for distribution to the plurality of power cells.

4. The drive system of claim 1 ,

wherein the field programmable gate array is configured to distribute the first and/or second operating commands to at least one of an analog-to-digital converter, a power cell bypass system, a power cell, an encoder, an input-output interface, and an internal network.

5. The drive system of claim 1 ,

wherein the field programmable gate array is further configured to communicate with devices external to the system on chip.

6. The drive system of claim 1 ,

wherein one of the central processing units is configured to communicate with at least one of an Ethernet interface, a file system interface, a universal serial bus interface and an analog-to-digital converter interface.

7. The drive system of claim 1 ,

wherein one of the central processing units is operably coupled to a memory, a keypad and a MODBUS I/O module.

8. The drive system of claim 1 ,

wherein the system on chip further comprises a memory, the first and second central processing units configured to communicate with the memory.

9. The drive system of claim 1 ,

wherein the control system further comprises a communications board external to the system on chip, the system on chip and the communications board communicating via a further data bus.

10. The drive system of claim 9 ,

wherein the communications board comprises a further field programmable gate array configured to communicate with devices external to the system on chip.

11. The drive system of claim 1 ,

wherein the system on chip is etched on a silicon wafer.

12. The drive system of claim 1 ,

embodied as medium voltage variable frequency drive comprising an output voltage between about 2.3 kV and about 11 kV.

13. The drive system of claim 1 ,

further comprising a cascaded H-bridge converter system.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2023
From: SIEMENS AKTIENGESELLSCHAFT
To: INNOMOTICS GMBH
Reel/Frame 065612/0733 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2021
From: MALAPELLE, PAOLO; BUCKEY, JAMES A.; CHUN, SHELBY; WRIGHT, ALAN; PUCHKAREV, GRIGORIY
To: SIEMENS INDUSTRY, INC.
Reel/Frame 055233/0974 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2021
From: SIEMENS INDUSTRY, INC.
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 055234/0423 →
Continuity (1)
Related Publication 20210313904A1 · Oct 7, 2021