Copper-bonded memory stacks with copper-bonded interconnection memory systems
A memory system includes a memory stack including a number of memory dies interconnected via copper bonding, a logic die coupled to the memory stack via a copper bonding. The memory system further includes a buffer die extended to provide the copper bonding between the logic die and the memory stack and a silicon carrier layer bonded to the memory stack and the logic die.
1. A memory system comprising:
a memory stack including a plurality of memory dies interconnected via copper bonding;
a logic die coupled to the memory stack via the copper bonding;
a buffer die extended to provide the copper bonding between the logic die and the memory stack;
a silicon carrier layer bonded to the memory stack and the logic die; and
an interposer layer coupled to the logic die and the memory stack.
2. The memory system of claim 1 , wherein the buffer dies is located in a middle position of the memory stack.
3. The memory system of claim 1 , wherein the buffer die is located in a bottom position of the memory stack.
4. The memory system of claim 1 , further comprising a passive bridge die located between the memory stack and the logic die.
5. The memory system of claim 4 , wherein the passive bridge die is conductively coupled to the logic die and the buffer die via copper bonding, and wherein the buffer dies is connected to the memory stack via copper bonding.
6. The memory system of claim 1 , wherein the logic die includes one or more data-processing circuitry.
7. The memory system of claim 1 , wherein the memory stack comprises hybrid-copper bonded (HCB) memory including dynamic random-access memory (DRAM).
8. The memory system of claim 1 , wherein the interposer layer is coupled to the logic die via one or more support dies including through-silicon vias (TSVs) coupled to one another and to the logic die via copper bonding.
9. The memory system of claim 1 , further comprising a heatsink layer bonded to the silicon carrier layer.
10. The memory system of claim 1 , wherein the buffer die overlaps the logic die.
11. A method comprising:
fabricating a memory stack by interconnecting a plurality of memory dies via copper bonding;
coupling a logic die to the memory stack via the copper bonding;
disposing an extended buffer die to provide the copper bonding between the logic die and the memory stack;
bonding a silicon carrier layer to the memory stack and the logic die; and
coupling an interposer layer to the logic die and the memory stack.
12. The method of claim 11 , further comprising disposing the extended buffer die in a bottom position of the memory stack.
13. The method of claim 11 , further comprising disposing the extended buffer die in a middle position of the memory stack.
14. The method of claim 11 , further comprising:
disposing a passive bridge die between the memory stack and the logic die;
conductively coupling the passive bridge die to the logic die and the extended buffer die via copper bonding; and
connecting the extended buffer dies to the memory stack via the copper bonding.
15. The method of claim 11 , further comprising:
coupling the interposer layer to the logic die via one or more support dies including through-silicon vias (TSVs) and
coupling the one or more support dies to one another and to the logic die via copper bonding.
16. The method of claim 11 , further comprising bonding a heatsink layer to the silicon carrier layer.
17. The method of claim 11 , wherein fabricating the memory stack comprises fabricating a hybrid-copper bonded (HCB) memory including dynamic random-access memory (DRAM), and wherein coupling the logic die comprises coupling data-processing circuitry.
18. The method of claim 11 , wherein coupling the interposer layer to the logic die and the memory stack comprises coupling via copper bonding.
19. A system comprising:
a memory comprises a memory stack including a plurality of memory dies interconnected via copper bonding;
a processor coupled to the memory, the processor implemented on a logic die coupled to the memory stack via a copper bonding;
an extended buffer die configured to provide the copper bonding between the logic die and the memory stack, the extended buffer die located in one of a middle position or a bottom position of the memory stack; and
an interposer layer is coupled to the logic die via one or more support dies including through-silicon vias (TSVs) coupled to one another and to the logic die via the copper bonding, wherein the interposer layer is coupled to the memory stack through solder bumps.
20. The system of claim 19 , wherein the solder bumps comprise conductive solder bumps.