Chip-scale optoelectronic transceiver having microsprings on an interposer substrate
A chip-scale transceiver includes an interposer having microspring electrical contacts disposed on the interposer substrate. At least one electronic chip and at least one optoelectronic chip are electrically coupled to the interposer through the microsprings. The electronic chip includes at least one of an amplifier array and a laser driver array. First electrical contact pads arranged to make electrical contact with the first microsprings of the interposer. The optoelectronic chip includes at least one of a laser array and a photodetector array. Second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer are disposed on the optoelectronic chip substrate. The transceiver has an area less than or equal to 0.17 mm 2 per Gbps.
1. A transceiver, comprising:
an interposer comprising:
an interposer substrate; and
first and second microspring electrical contacts disposed on the interposer substrate;
at least one electronic chip comprising:
an electronic chip substrate comprising an array of electronic devices; and
first electrical contact pads disposed on the electronic chip substrate, the first electrical contact pads arranged to make electrical contact with the first microsprings of the interposer; and
at least one optoelectronic chip, comprising:
an optoelectronic chip substrate comprising an array of optoelectronic devices; and
second electrical contact pads disposed on the optoelectronic chip substrate, the second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer.
2. The transceiver of claim 1 , wherein:
the electronic devices comprise at least one of an amplifier array and a laser driver array; and
the optoelectronic devices comprise at least one of a laser array and a photodetector array.
3. The transceiver of claim 1 , wherein the optoelectronic devices comprise an array of vertical cavity surface emitting lasers (VCSELs).
4. The transceiver of claim 1 , wherein the at least one optoelectronic chip comprises:
an optoelectronic receiver chip that includes an array of photodetectors; and
an optoelectronic transmitter chip that includes an array of vertical cavity surface emitting lasers (VCSELs).
5. The transceiver of claim 1 , wherein:
the electronic chip substrate comprises a first material; and
the optoelectronic chip substrate comprises a second material different from the first material.
6. The transceiver of claim 1 , wherein the transceiver is configured to operate a plurality of communication lanes, each communication lane configured to operate at greater than or equal to 25 Gbps.
7. The transceiver of claim 1 , wherein the transceiver operates at less than or equal to about 10 pJ per bit.
8. The transceiver of claim 1 , wherein the transceiver operates at less than or equal to about 1 pJ per bit.
9. The transceiver of claim 1 , wherein the transceiver has an area less than or equal to 0.17 mm 2 per Gbps.
10. The transceiver of claim 1 , further comprising holes through the interposer substrate that are aligned with the optoelectronic devices, the holes configured to receive and align optical fibers such that the optical fibers are optically coupled to the optoelectronic devices.
11. The transceiver of claim 1 , wherein a volume of the transceiver is less than or equal to 10×8×5 mm 3 .
12. The transceiver of claim 1 , wherein the interposer substrate comprises silicon, a singulated portion of a silicon wafer, glass, or FR4.
13. The transceiver of claim 1 , wherein:
the interposer comprises contact pads arranged along at least one edge of the interposer; and
the edge contact pads have a bandwidth density of greater than 1 Tbps per cm.
14. The transceiver of claim 1 , wherein the optoelectronics module further includes microlenses disposed between at least some of the optoelectronics components and the optical fibers.
15. A communication system comprising:
a transceiver, comprising:
an interposer comprising:
an interposer substrate; and
first and second microspring electrical contacts disposed on the interposer substrate;
at least one electronic chip comprising:
an electronic chip substrate comprising an array of electronic devices; and
first electrical contact pads disposed on the electronic chip substrate, the first electrical contact pads arranged to make electrical contact with the first microsprings of the interposer; and
at least one optoelectronic chip, comprising:
an optoelectronic chip substrate comprising an array of optoelectronic devices; and
second electrical contact pads disposed on the optoelectronic chip substrate, the second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer;
a network interface device configured to control operation of the transceiver; and
a mother board comprising:
a first connector configured to electrically connect to the transceiver; and
a second connector configured to electrically connect to the network interface device, the motherboard having electrical traces configured to electrically connect the network interface device to the transceiver.
16. The system of claim 15 , wherein the transceiver is located less than 5 cm from the network interface device.
17. The system of claim 15 , wherein the transceiver operates at less than or equal to about 1 pJ per bit.
18. The system of claim 15 , wherein a volume of the transceiver is less than or equal to 10×8×5 mm 3 .
19. The system of claim 15 , wherein the transceiver has an area less than or equal to 0.17 mm 2 per Gbps.
20. The system of claim 15 , wherein the transceiver is configured to operate a plurality of communication lanes, each communication lane configured to operate at greater than or equal to 25 Gbps.
21. A method of making a transceiver, comprising:
forming multiple interposers on an interposer wafer, each interposer comprising first and second stress-engineered microspring electrical contacts disposed on a surface of the interposer wafer;
forming at least one electronic chip comprising:
fabricating electronic devices in and/or on a surface of an electronic chip substrate; and
fabricating first electrical contact pads on the electronic chip substrate, the first electrical contact pads arranged to make electrical contact with the first microsprings of the interposer;
forming at least one optoelectronic chip, comprising:
fabricating optoelectronic devices in and/or on a surface of an optoelectronic chip substrate; and
fabricating second electrical contact pads on the electronic chip substrate, the second electrical contact pads arranged to make electrical contact with the first microsprings of the interposer.
22. The method of claim 21 , wherein:
the electronic devices comprise at least one of an amplifier array and a laser driver array; and
the optoelectronic devices comprise at least one of a laser array and a photodetector array.
23. The method of claim 21 , wherein forming the at least one optoelectronic chip comprises:
fabricating an optoelectronic receiver chip comprising the array of photodetectors; and
fabricating an optoelectronic transmitter chip comprising the array of lasers.
24. The method of claim 21 , wherein the transceiver has an area less than or equal to 0.17 mm 2 per Gbps.