Cooling module and electronic apparatus

1. An electronic apparatus comprising:

a chassis;

first and second heating elements provided inside the chassis; and

a cooling module configured to absorb heat generated by the first and second heating elements,

the cooling module comprising:

a vapor chamber in which a sealed space is formed in a portion sandwiched between first and second metal plates and working fluid is sealed in the sealed space, the second metal plate comprising an outer shape larger than that of the first metal plate;

a metal frame formed in a portion of the second metal plate, the portion of the second metal plate protruding from the outer shape of the first metal plate; and

a heat conduction plate supported by the metal frame, the heat conduction plate containing graphene, wherein

the vapor chamber absorbs the heat generated by the first heating element, and

the heat conduction plate absorbs the heat generated by the second heating element.

2. The electronic apparatus according to claim 1 , wherein the metal frame is formed in a frame shape or in a grid shape by forming cutout holes in the protruding portion of the second metal plate.

3. The electronic apparatus according to claim 1 , wherein

the sealed space is formed on a first surface of the second metal plate,

the first heating element is connected via a heat receiving member to a second surface of the second metal plate in the portion forming the sealed space,

the heat conduction plate is fixed to a surface of the metal frame corresponding to the second surface of the second metal plate, and

the second heating element radiates heat toward a back surface of an attaching surface of the heat conduction plate with respect to the metal frame.

4. The electronic apparatus according to claim 3 , wherein the heat conduction plate extends from the metal frame to the portion of the second metal plate forming the sealed space to overlap the sealed space in a vertical direction.

5. The electronic apparatus according to claim 1 , wherein

the cooling module further comprises:

a cooling fin thermally connected to the second metal plate; and

a blower fan that blows air to the cooling fin.

6. An electronic apparatus comprising:

a chassis;

first and second heating elements provided inside the chassis; and

a cooling module that absorbs heat generated by the first and second heating elements,

the cooling module comprising:

a metal plate;

a first heat conduction plate fixed to a first surface of the metal plate, the first heat conduction plate containing graphene and comprising a portion protruding from an outer shape of the metal plate;

a second heat conduction plate fixed to the first surface or a second surface of the metal plate, the second heat conduction plate containing graphene;

a metal sheet fixed to the portion of the first heat conduction plate protruding from the outer shape of the metal plate in an attaching surface of the first heat conduction plate with respect to the metal plate;

a cooling fin joined to the metal sheet; and

a blower fan that blows air to the cooling fin, wherein

the first heat conduction plate absorbs the heat generated by the first heating element, and

the second heat conduction plate absorbs the heat generated by the second heating element.

7. The electronic apparatus according to claim 6 , wherein a portion of the metal plate to which the second heat conduction plate is fixed is formed in a frame shape or in a grid shape by forming cutout holes.

8. The electronic apparatus according to claim 6 , wherein

the second heat conduction plate is fixed to the second surface of the metal plate, and

the first heat conduction plate and the second heat conduction plate overlap with each other in a vertical direction with the metal plate interposed therebetween.