IP Library Granted Patent US 11,971,501
Granted Patent B2
US 11,971,501 · App. 17/374,120 · Granted Apr 30, 2024

Sensor module

Inventors: Kazuhiro Kosugi (Kanagawa, JP); Yafeng Shao (Beijing, CN); Wenjin Niu (Kanagawa, JP); Yun Zhu (Beijing, CN)
Assignee: Lenovo (Singapore) Pte. Ltd.
G01S7/027
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Quick Facts
Patent No.
US 11,971,501
App. No.
17/374,120
Granted
Apr 30, 2024
Kind
B2
Abstract

A sensor module includes a sensor module main body having a rectangular board provided with a radio radar sensor function, and a metallic case having a rectangular parallelepiped box shape in which an opening part opened at one face in a thickness direction is formed and a cut-out opening for drawing out a cable connecting the sensor module main body is formed on a side face, the opening part being closed by the board inserted through the opening part with a component disposed on a front face of the board facing toward a bottom part on the inner side, and the cable is inserted into at least a part of the cut-out opening, and the cut-out opening is formed to be symmetrical with respect to a plane passing through the center of the metallic case and perpendicular to a plane of the cut-out opening.

Claims (32)

1. A sensor module comprising:

a sensor module main body that comprises a rectangular board having a radio radar sensor function; and

a metallic case having a rectangular parallelepiped box shape, wherein the metallic case comprises:

an opening part, formed at a first face of the metallic case, in a thickness direction and

a cut-out opening, formed at a second face of the metallic case which is perpendicular to the first face, for drawing out a cable connecting the sensor module main body,

wherein the opening part is closed by the rectangular board inserted through the opening part with a component disposed on a front face of the rectangular board facing toward a bottom part on an inner side,

the cable is inserted into at least a part of the cut-out opening, and

the cut-out opening is formed to be symmetrical with respect to a plane passing through a center of the metallic case and perpendicular to a plane of the cut-out opening.

2. The sensor module according to claim 1 , wherein an insulation region is formed over an entire circumference of a peripheral edge portion of the rectangular board.

3. A sensor module comprising:

a sensor module main body that comprises a rectangular board having a radio radar sensor function; and

a metallic case having a rectangular parallelepiped box shape, wherein the metallic case comprises:

an opening part, formed at a first face of the metallic case, in a thickness direction and

a cut-out opening, formed at a second face of the metallic case which is perpendicular to the first face, for drawing out a cable connecting the sensor module main body,

wherein the opening part is closed by the rectangular board inserted through the opening part with a component disposed on a front face of the rectangular board facing inward,

an insulation region is formed over an entire circumference of a peripheral edge portion of the rectangular board.

4. The sensor module according to claim 1 , wherein the cut-out opening is formed to be cut out at the second face in a short direction from the opening part side, not to include both end parts of the metallic case in a long direction, and to include the center in the long direction.

5. The sensor module according to claim 1 , wherein a plurality of cut-out openings are formed to be cut out at the second face in a short direction from the opening part side and not to include both end parts and the center of the metallic case in a long direction.

6. The sensor module according to claim 1 , wherein

the sensor module main body comprises spacers abutting against the bottom part of the metallic case and electrically conducting the rectangular board and the metallic case, on a front face at both end parts in a long direction of the sensor module main body,

an amount of elastic deformation of the spacer in a short direction is larger than an amount of elastic deformation in the long direction, and

the sensor module main body has a resistor component for adjusting a radio frequency disposed inside of the spacer in the long direction.

7. An information processing apparatus, comprising:

a display chassis; and

a sensor module disposed at a top end of the display chassis, wherein the sensor module comprises:

a sensor module main body that comprises a rectangular board having a radio radar sensor function, and

a metallic case having a rectangular parallelepiped box shape, wherein the metallic case comprises:

an opening part, formed at a first face of the metallic case, in a thickness direction and

a cut-out opening, formed at a second face of the metallic case which is perpendicular to the first face, for drawing out a cable connecting the sensor module main body,

wherein the opening part is closed by the rectangular board inserted through the opening part with a component disposed on a front face of the rectangular board facing toward a bottom part on an inner side,

the cable is inserted into at least a part of the cut-out opening, and

the cut-out opening is formed to be symmetrical with respect to a plane passing through a center of the metallic case and perpendicular to a plane of the cut-out opening.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2025
From: LENOVO (SINGAPORE) PTE LTD.
To: LENOVO PC INTERNATIONAL LIMITED
Reel/Frame 070269/0077 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2025
From: LENOVO PC INTERNATIONAL LIMITED
To: LENOVO SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 070269/0092 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2021
From: KOSUGI, KAZUHIRO; SHAO, YAFENG; NIU, WENJIN; ZHU, YUN
To: LENOVO (SINGAPORE) PTE. LTD.
Reel/Frame 056984/0350 →
Priority Claims (1)
CN 202010712007.1 · Jul 22, 2020 · national
Continuity (1)
Related Publication 20220026554A1 · Jan 27, 2022