IP Library Granted Patent US 11,224,917
Granted Patent B1
US 11,224,917 · App. 17/392,727 · Granted Jan 18, 2022

Multi-material three-dimensional printer with underlying adjustable binder

Inventor: Philip Eugene Rogren (Half Moon Bay, CA)
Assignee: Sakuu Corporation
B22F10/14B22F10/28B22F10/30B22F12/33B22F12/55B22F12/57B29C64/165B33Y10/00B33Y30/00B33Y50/02
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Quick Facts
Patent No.
US 11,224,917
App. No.
17/392,727
Granted
Jan 18, 2022
Kind
B1
Abstract

A jetted binder printing system includes a carrier substrate configured to travel along a longitudinal direction thereof, an adjustable binder printer configured to deliver an adjustable binder to the carrier substrate, a dispensing module located downstream from the adjustable binder printer on the longitudinal direction of the carrier substrate, the dispensing module including at least one powder container, the dispensing module being configured to dispense powder onto the carrier substrate, and a primary binder printer located downstream from the compaction module along the longitudinal direction of the carrier substrate. The primary binder printer includes a print head configured to print a primary binder on the dispensed powder according to a desired pattern. The primary binder is printed on a surface of the powder that is opposite a surface on which the adjustable binder is printed. The primary binder is printed to match the pattern of the adjustable binder.

Claims (26)

1. A method of manufacturing a three-dimensional object comprising:

dispensing an adjustable binder on a longitudinal surface of a carrier substrate according to a desired pattern;

dispensing a powder on the adjustable binder on the carrier substrate;

compacting the powder to a desired compaction range;

dispensing a primary binder on the compacted powder according to the desired pattern;

selectively fusing the compacted powder according to the desired pattern; and

removing non-fused portions of the compacted powder to form one of a patterned single-layer object.

2. The method of claim 1 , further comprising:

transferring the patterned single-layer object from the carrier substrate to an assembly plate; and

repeating the dispensing the adjustable binder, the dispensing the powder on the adjustable binder, the compacting the powder, the dispensing the primary binder, the selectively fusing the compacted powder and the removing the non-fused portions, to form a patterned multi-layer object.

3. The method of claim 1 , wherein the dispensing the adjustable binder comprises defining a position of the powder.

4. The method of claim 3 , wherein the dispensing the powder comprises adhering the powder to the adjustable binder at the defined position.

5. The method of claim 1 , wherein dispensing the primary binder on the compacted powder comprises dispensing the primary binder on a surface of the compacted powder that is opposite a surface on which the adjustable binder is dispensed.

6. The method of claim 1 , wherein dispensing the primary binder on the compacted powder comprises dispensing the primary binder in coordination with the desired pattern of the adjustable binder.

7. The method of claim 1 , wherein compacting the powder comprises apply a controlled pressure, in a direction substantially orthogonal to the longitudinal direction of the carrier substrate, to increase a compaction of the dispensed powder to the desired compaction range.

8. The method of claim 1 , wherein dispensing the primary binder on the compacted powder comprises fixing a position of the compacted powder.

9. The method of claim 1 , wherein dispensing the primary binder on the compacted powder comprises adhering the compacted powder to the primary binder.

10. The method of claim 1 , further comprising:

causing selective fusion of a material layer including the adjustable binder, the powder and the primary binder according to the desired pattern;

removing non-fused portions of the material layer to form one or more patterned single-layer objects;

transferring one of the or more patterned single-layer objects from the carrier substrate to an assembly plate; and

controlling a desired sequence of the single-layer objects and the desired pattern.

11. The method of claim 1 , wherein dispensing the powder on the adjustable binder on the carrier substrate comprises dispensing a fluidized powder in a desired controlled condition.

12. The method of claim 1 , wherein dispensing the powder on the adjustable binder on the carrier substrate comprises metering a desired amount of powder on the adjustable binder on the carrier substrate.

13. The method of claim 1 , wherein dispensing the powder on the adjustable binder on the carrier substrate comprises spreading the powder on the carrier substrate.

14. The method of claim 1 , wherein compacting the powder to the desired compaction range comprises applying a vibratory energy source to cause settling of the powder.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Apr 12, 2024
From: WILLYO EQUITY, LP
To: SAKUU CORPORATION
Reel/Frame 067091/0415 →
SECURITY INTEREST Recorded Sep 5, 2023
From: SAKUU CORPORATION
To: WILLYO EQUITY, LP
Reel/Frame 064793/0082 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2021
From: ROGREN, PHILIP EUGENE
To: SAKUU CORPORATION
Reel/Frame 057067/0269 →
Continuity (1)
Division 17218756 · Mar 31, 2021