IP Library Granted Patent US 12,523,748
Granted Patent B2
US 12,523,748 · App. 17/653,881 · Granted Jan 13, 2026

Detector having quantum dot pn junction photodiode

Inventors: Sean Keuleyan (Eugene, OR); Andrew S. Huntington (Banks, OR); Nanditha Dissanayake (Portland, OR); Chao Yi (Eugene, OR); George Williams (Vashon, WA)
Assignee: Allegro MicroSystems, LLC
G01S7/4816G01S7/4814G01S7/484G01S7/4865G01S17/10
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,523,748
App. No.
17/653,881
Granted
Jan 13, 2026
Kind
B2
Abstract

Methods and apparatus for a sensor having a photodetector array having photodetectors comprising a colloidal quantum dot (CQD) structure formed on an integrated circuit. The sensor may comprise a LIDAR time of flight sensor.

Claims (52)

1 . A LIDAR sensor, comprising:

a photodetector array having one or more photodetectors comprising colloidal quantum dots (CQDs), wherein the photodetector array is responsive to light transmitted at a known time and received by the photodetector array after reflection from a target for determining a distance from the target to the sensor, or to light with an interference pattern in time and space produced by coherent mixing of light reflected from a target with light from an optical local oscillator for determining a distance from the target to the sensor based on phase or frequency relationships extracted from the interference pattern; and

an integrated circuit, wherein the photodetector array is formed on the integrated circuit, wherein the photodetector comprises a photodiode including a depletion region between a weakly p-doped layer and a heavily doped n-type transparent conductive oxide.

2 . The sensor according to claim 1 , wherein the sensor includes a laser transmitter configured to transmit the light at a known time.

3 . The sensor according to claim 1 , wherein the sensor includes a laser transmitter configured to vary the frequency of the transmitted light over time such that the laser frequency at any given time is known.

4 . The sensor according to claim 1 , wherein the sensor includes a laser transmitter and an optical local oscillator, where the laser transmitter is configured to transmit light to a remote target with a known phase relationship at the time of transmission to the light of the optical local oscillator, and the laser and optical local oscillator are the same light source.

5 . The sensor according to claim 1 , wherein the sensor includes a laser transmitter and an optical local oscillator, where the laser transmitter is configured to transmit light to a remote target with a known phase relationship at the time of transmission to the light of the optical local oscillator, and the laser and optical local oscillator are different light sources.

6 . The sensor according to claim 2 , further including a signal processing circuit to determine the distance from the sensor to the target.

7 . The sensor according to claim 3 , further including a signal processing circuit to determine the distance from the sensor to the target or the relative velocity between sensor and target.

8 . The sensor according to claim 1 , wherein the sensor includes a laser transmitter and an optical local oscillator, where the laser transmitter is configured to transmit light to a remote target with a known phase relationship at the time of transmission to the light of the optical local oscillator, and further including a signal processing circuit to reconstruct a three-dimensional image of the target from an interferogram produced by coherent mixing of the reflected laser light with light from the optical local oscillator.

9 . The sensor according to claim 1 , wherein the integrated circuit comprises a readout integrated circuit (ROIC).

10 . The sensor according to claim 9 , wherein the ROIC comprises CMOS circuitry.

11 . The sensor according to claim 1 , wherein the photodetector array forms part of a focal plane array (FPA).

12 . The sensor according to claim 1 , wherein the photodetectors comprise photodiodes having an anode, a p-type layer, an n-type layer, and a cathode.

13 . The sensor according to claim 12 , wherein the CQD structure comprises a doped p-type layer, an n-type doped layer, and an electron-selective (hole-blocking) layer.

14 . The sensor according to claim 13 , wherein in the doped p-type layer and the n-type doped layer comprise lead sulfide CQDs.

15 . The sensor according to claim 14 , wherein the electron-selective (hole-blocking layer comprises zinc oxide, C60 fullerenes, or phenyl-C61-butyric acid methyl ester (PCBM).

16 . The sensor according to claim 15 , wherein the lead sulfide doped p-type and the n-type doped layers and the zinc oxide layer comprise nanocrystal colloidal quantum dots packed in a film.

17 . The sensor according to claim 1 , wherein the photodetector includes a photodiode having a depletion region between weakly p- and n-doped layers.

18 . The sensor according to claim 1 , wherein the photodetector comprises a photodiode having a metal anode formed from a material that includes TiN, Ni, Al, and/or Au.

19 . The sensor according to claim 1 , wherein the photodetector comprises a photodiode having hole-transport and electron-blocking layers for efficient collection of photogenerated holes and blocking electron injection from an anode.

20 . The sensor according to claim 1 , wherein the CQD structure comprises doping and/or thickness selection for the p-type layer optimized for a wide depletion region for efficient absorption of infrared light and collection of photogenerated holes.

21 . The sensor according to claim 20 , wherein the doping and/or thickness for the n-type layer is optimized for a wide depletion region for efficient absorption of infrared light and collection of photogenerated electrons.

22 . The sensor according to claim 1 , wherein the photodetector comprises a photodiode, wherein a cathode of the photodiode is a conductor transparent at an operating wavelength.

23 . The sensor according to claim 19 , wherein the cathode comprises a transparent conducting oxide, thin metal, nanoparticle film, doped semiconductor, and/or polymer.

24 . The sensor according to claim 23 , wherein the cathode comprises tin doped indium oxide (indium tin oxide, ITO), aluminum doped zinc oxide (AZO), Al, and/or Ag.

25 . A method, comprising:

employing a LIDAR sensor including a photodetector array having one or more photodetectors comprising colloidal quantum dots (CQDs), wherein the photodetector array is responsive to light transmitted at a known time and received by the photodetector array after reflection from a target for determining a distance from the target to the sensor, or to light with an interference pattern in time and space produced by coherent mixing of light reflected from a target with light from an optical local oscillator for determining a distance from the target to the sensor based on phase or frequency relationships extracted from the interference pattern, wherein the photodetector array is formed on an integrated circuit,

wherein the photodetector comprises a photodiode including a depletion region between a weakly p-doped layer and a heavily doped n-type transparent conductive oxide.

26 . The method according to claim 25 , wherein the sensor includes a laser transmitter configured to transmit the light at a known time.

27 . The method according to claim 25 , wherein the sensor includes a laser transmitter configured to vary the frequency of the transmitted light over time such that the laser frequency at any given time is known.

28 . The method according to claim 25 , wherein the sensor includes a laser transmitter and an optical local oscillator, where the laser transmitter is configured to transmit light to a remote target with a known phase relationship at the time of transmission to the light of the optical local oscillator, and the laser and optical local oscillator are the same light source.

29 . The method according to claim 25 , wherein the sensor includes a laser transmitter and an optical local oscillator, where the laser transmitter is configured to transmit light to a remote target with a known phase relationship at the time of transmission to the light of the optical local oscillator, and the laser and optical local oscillator are different light sources.

30 . The method according to claim 26 , further including employing a signal processing circuit to determine the distance from the sensor to the target.

31 . The method according to claim 27 , further including employing a signal processing circuit to determine the distance from the sensor to the target or the relative velocity between sensor and target.

32 . The method according to claim 25 , wherein the sensor includes a laser transmitter and an optical local oscillator, where the laser transmitter is configured to transmit light to a remote target with a known phase relationship at the time of transmission to the light of the optical local oscillator, and further including a signal processing circuit to reconstruct a three-dimensional image of the target from an interferogram produced by coherent mixing of the reflected laser light with light from the optical local oscillator.

33 . The method according to claim 25 , wherein the integrated circuit comprises a readout integrated circuit (ROIC).

34 . The method according to claim 33 , wherein the ROIC comprises CMOS circuitry.

35 . The method according to claim 25 , wherein the photodetector array forms part of a focal plane array (FPA).

36 . The method according to claim 25 , wherein the photodetectors comprise photodiodes having an anode, a p-type layer, an n-type layer, and a cathode.

37 . The method according to claim 36 , wherein the CQD structure comprises a doped p-type layer, an n-type doped layer, and an electron-selective (hole-blocking) layer.

38 . The method according to claim 37 , wherein in the doped p-type layer and the n-type doped layer comprise lead sulfide CQDs.

39 . The method according to claim 38 , wherein the electron-selective (hole-blocking) layer comprises zinc oxide, C60 fullerenes, or phenyl-C61-butyric acid methyl ester (PCBM).

40 . The method according to claim 39 , wherein the lead sulfide doped p-type and the n-type doped layers and the zinc oxide layer comprise nanocrystal colloidal quantum dots packed in a film.

41 . The method according to claim 25 , wherein the photodetector includes a photodiode having a depletion region between weakly p- and n-doped layers.

42 . The method according to claim 25 , wherein the photodetector comprises a photodiode having a metal anode formed from a material that includes TiN, Ni, Al, and/or Au.

43 . The method according to claim 25 , wherein the photodetector comprises a photodiode having hole-transport and electron-blocking layers for efficient collection of photogenerated holes and blocking electron injection from an anode.

44 . The method according to claim 25 , wherein the CQD structure comprises doping and/or thickness selection for the p-type layer optimized for a wide depletion region for efficient absorption of infrared light and collection of photogenerated holes.

45 . The method according to claim 44 , wherein the doping and/or thickness for the n-type layer is optimized for a wide depletion region for efficient absorption of infrared light and collection of photogenerated electrons.

46 . The method according to claim 25 , wherein the photodetector comprises a photodiode, wherein a cathode of the photodiode is a conductor transparent at an operating wavelength.

47 . The method according to claim 43 , wherein the cathode comprises a transparent conducting oxide, thin metal, nanoparticle film, doped semiconductor, and/or polymer.

48 . The method according to claim 47 , wherein the cathode comprises tin doped indium oxide (indium tin oxide, ITO), aluminum doped zinc oxide (AZO), Al, and/or Ag.

Assignments (2)
PATENT SECURITY AGREEMENT Recorded Jun 22, 2023
From: ALLEGRO MICROSYSTEMS, LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS THE COLLATERAL AGENT
Reel/Frame 064068/0459 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2022
From: KEULEYAN, SEAN; HUNTINGTON, ANDREW S.; DISSANAYAKE, NANDITHA; YI, CHAO; WILLIAMS, GEORGE; VOXTEL, LLC
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 059526/0713 →
Continuity (1)
Related Publication 20230288540A1 · Sep 14, 2023
References Cited (169)
US 6100586A · Chen · 2000 [cited by examiner]
US 6760145B1 · Taylor et al. · 2004 [cited by applicant]
US 6778728B2 · Taylor et al. · 2004 [cited by applicant]
US 6894823B2 · Taylor et al. · 2005 [cited by applicant]
US 6989921B2 · Bernstein et al. · 2006 [cited by applicant]
US 7015780B2 · Bernstein et al. · 2006 [cited by applicant]
US 7160753B2 · Williams, Jr. · 2007 [cited by applicant]
US 7432537B1 · Huntington · 2008 [cited by applicant]
US 7504053B1 · Alekel · 2009 [cited by applicant]
US 7764719B2 · Munroe et al. · 2010 [cited by applicant]
US 7782911B2 · Munroe et al. · 2010 [cited by applicant]
US 7852549B2 · Alekel et al. · 2010 [cited by applicant]
US 7885298B2 · Munroe · 2011 [cited by applicant]
US 7919018B2 · Williams et al. · 2011 [cited by applicant]
US 7994421B2 · Williams et al. · 2011 [cited by applicant]
US 8207484B1 · Williams · 2012 [cited by applicant]
US 8319307B1 · Williams · 2012 [cited by applicant]
US 8570372B2 · Russell · 2013 [cited by applicant]
US 8597544B2 · Alekel · 2013 [cited by applicant]
US 8630036B2 · Munroe · 2014 [cited by applicant]
US 8630320B2 · Munroe et al. · 2014 [cited by applicant]
US 8730564B2 · Alekel · 2014 [cited by applicant]
US 8743453B2 · Alekel et al. · 2014 [cited by applicant]
US 8760499B2 · Russell · 2014 [cited by applicant]
US 8766682B2 · Williams · 2014 [cited by applicant]
US 8853639B2 · Williams, Jr. · 2014 [cited by applicant]
US 9121762B2 · Williams et al. · 2015 [cited by applicant]
US 9197233B2 · Gaalema et al. · 2015 [cited by applicant]
US 9269845B2 · Williams et al. · 2016 [cited by applicant]
US 9368933B1 · Nijjar et al. · 2016 [cited by applicant]
US 9373736B2 · Sargent et al. · 2016 [cited by applicant]
US 9397469B1 · Nijjar et al. · 2016 [cited by applicant]
US 9447299B2 · Schut et al. · 2016 [cited by applicant]
US 9451554B1 · Singh et al. · 2016 [cited by applicant]
US 9466745B2 · Williams et al. · 2016 [cited by applicant]
US 9553216B2 · Williams et al. · 2017 [cited by applicant]
US 9570502B2 · Sargent et al. · 2017 [cited by applicant]
US 9591238B2 · Lee et al. · 2017 [cited by applicant]
US 9693035B2 · Williams et al. · 2017 [cited by applicant]
US 9759602B2 · Williams · 2017 [cited by applicant]
US 9804264B2 · Villeneuve et al. · 2017 [cited by applicant]
US 9810775B1 · Welford et al. · 2017 [cited by applicant]
US 9810777B2 · Williams et al. · 2017 [cited by applicant]
US 9810786B1 · Welford et al. · 2017 [cited by applicant]
US 9812838B2 · Villeneuve et al. · 2017 [cited by applicant]
US 9823353B2 · Eichenholz et al. · 2017 [cited by applicant]
US 9835490B2 · Williams et al. · 2017 [cited by applicant]
US 9841495B2 · Campbell et al. · 2017 [cited by applicant]
US 9843157B2 · Williams · 2017 [cited by applicant]
US 9847441B2 · Huntington · 2017 [cited by applicant]
US 9857468B1 · Eichenholz et al. · 2018 [cited by applicant]
US 9869754B1 · Campbell et al. · 2018 [cited by applicant]
US 9874635B1 · Eichenholz et al. · 2018 [cited by applicant]
US 9897687B1 · Campbell et al. · 2018 [cited by applicant]
US 9905992B1 · Welford et al. · 2018 [cited by applicant]
US 9923331B2 · Williams · 2018 [cited by applicant]
US 9941433B2 · Williams et al. · 2018 [cited by applicant]
US 9958545B2 · Eichenholz et al. · 2018 [cited by applicant]
US 9989629B1 · LaChapelle · 2018 [cited by applicant]
US 9995622B2 · Williams · 2018 [cited by applicant]
US 10003168B1 · Villeneuve · 2018 [cited by applicant]
US 10007001B1 · LaChapelle et al. · 2018 [cited by applicant]
US 10012732B2 · Eichenholz et al. · 2018 [cited by applicant]
US 10061019B1 · Campbell et al. · 2018 [cited by applicant]
US 10088559B1 · Weed et al. · 2018 [cited by applicant]
US 10094925B1 · LaChapelle · 2018 [cited by applicant]
US 10114111B2 · Russell et al. · 2018 [cited by applicant]
US 10121813B2 · Eichenholz et al. · 2018 [cited by applicant]
US 10139478B2 · Gaalema et al. · 2018 [cited by applicant]
US 10169678B1 · Sachdeva et al. · 2019 [cited by applicant]
US 10169680B1 · Sachdeva et al. · 2019 [cited by applicant]
US 10175345B2 · Rhee et al. · 2019 [cited by applicant]
US 10175697B1 · Sachdeva et al. · 2019 [cited by applicant]
US 10191155B2 · Curatu · 2019 [cited by applicant]
US 10209359B2 · Russell et al. · 2019 [cited by applicant]
US 10211592B1 · Villeneuve et al. · 2019 [cited by applicant]
US 10211593B1 · Lingvay et al. · 2019 [cited by applicant]
US 10217889B2 · Dhulla et al. · 2019 [cited by applicant]
US 10218144B2 · Munroe et al. · 2019 [cited by applicant]
US 10241198B2 · LaChapelle et al. · 2019 [cited by applicant]
US 10254388B2 · LaChapelle et al. · 2019 [cited by applicant]
US 10254762B2 · McWhirter et al. · 2019 [cited by applicant]
US 10267898B2 · Campbell et al. · 2019 [cited by applicant]
US 10267899B2 · Weed et al. · 2019 [cited by applicant]
US 10267918B2 · LaChapelle et al. · 2019 [cited by applicant]
US 10275689B1 · Sachdeva et al. · 2019 [cited by applicant]
US 10290753B2 · Guyot-Sionnest et al. · 2019 [cited by applicant]
US 10295668B2 · LaChapelle et al. · 2019 [cited by applicant]
US 10310058B1 · Campbell et al. · 2019 [cited by applicant]
US 10324170B1 · Engberg, Jr. et al. · 2019 [cited by applicant]
US 10324185B2 · McWhirter et al. · 2019 [cited by applicant]
US 10338199B1 · McWhirter et al. · 2019 [cited by applicant]
US 10338223B1 · Englard et al. · 2019 [cited by applicant]
US 10340651B1 · Drummer et al. · 2019 [cited by applicant]
US 10345437B1 · Russell et al. · 2019 [cited by applicant]
US 10345447B1 · Hicks · 2019 [cited by applicant]
US 10348051B1 · Shah et al. · 2019 [cited by applicant]
US 10386489B2 · Albelo et al. · 2019 [cited by applicant]
US 10394243B1 · Ramezani et al. · 2019 [cited by applicant]
US 10401480B1 · Gaalema et al. · 2019 [cited by applicant]
US 10401481B2 · Campbell et al. · 2019 [cited by applicant]
US 10418776B2 · Welford et al. · 2019 [cited by applicant]
US 10445599B1 · Hicks · 2019 [cited by applicant]
US 10451716B2 · Hughes et al. · 2019 [cited by applicant]
US 10473788B2 · Englard et al. · 2019 [cited by applicant]
US 10481605B1 · Maila et al. · 2019 [cited by applicant]
US 10488496B2 · Campbell et al. · 2019 [cited by applicant]
US 10491885B1 · Hicks · 2019 [cited by applicant]
US 10502831B2 · Eichenholz · 2019 [cited by applicant]
US 10503172B2 · Englard et al. · 2019 [cited by applicant]
US 10509127B2 · Englard et al. · 2019 [cited by applicant]
US 10514462B2 · Englard et al. · 2019 [cited by applicant]
US 10520602B2 · Villeneuve et al. · 2019 [cited by applicant]
US 10523884B2 · Lee et al. · 2019 [cited by applicant]
US 10535191B2 · Sachdeva et al. · 2020 [cited by applicant]
US 10539665B1 · Danziger et al. · 2020 [cited by applicant]
US 10545240B2 · Campbell et al. · 2020 [cited by applicant]
US 10551485B1 · Maheshwari et al. · 2020 [cited by applicant]
US 10551501B1 · LaChapelle · 2020 [cited by applicant]
US 10557939B2 · Campbell et al. · 2020 [cited by applicant]
US 10557940B2 · Eichenholz et al. · 2020 [cited by applicant]
US 10571567B2 · Campbell et al. · 2020 [cited by applicant]
US 10571570B1 · Paulsen et al. · 2020 [cited by applicant]
US 10578720B2 · Hughes et al. · 2020 [cited by applicant]
US 10591600B2 · Villeneuve et al. · 2020 [cited by applicant]
US 10591601B2 · Hicks et al. · 2020 [cited by applicant]
US 10606270B2 · Englard et al. · 2020 [cited by applicant]
US 10627495B2 · Gaalema et al. · 2020 [cited by applicant]
US 10627512B1 · Hicks · 2020 [cited by applicant]
US 10627516B2 · Eichenholz · 2020 [cited by applicant]
US 10627521B2 · Englard et al. · 2020 [cited by applicant]
US 10636285B2 · Haas et al. · 2020 [cited by applicant]
US 10641874B2 · Campbell et al. · 2020 [cited by applicant]
US 10663564B2 · LaChapelle · 2020 [cited by applicant]
US 10663585B2 · McWhirter · 2020 [cited by applicant]
US 10677897B2 · LaChapelle et al. · 2020 [cited by applicant]
US 10677900B2 · Russell et al. · 2020 [cited by applicant]
US 10684360B2 · Campbell · 2020 [cited by applicant]
US RE48454E · Schut et al. · 2021 [cited by applicant]
US 20090224218A1 · Williams et al. · 2009 [cited by applicant]
US 20160355258A1 · Williams et al. · 2016 [cited by applicant]
US 20180069367A1 · Villeneuve et al. · 2018 [cited by applicant]
US 20180091747A1 · Rhee · 2018 [cited by examiner]
US 20180284239A1 · LaChapelle et al. · 2018 [cited by applicant]
US 20180284240A1 · LaChapelle et al. · 2018 [cited by applicant]
US 20180284275A1 · LaChapelle · 2018 [cited by applicant]
US 20180284280A1 · Eichenholz et al. · 2018 [cited by applicant]
US 20190310368A1 · LaChapelle · 2019 [cited by applicant]
US 20200357939A1 · Law et al. · 2020 [cited by applicant]
US 20200389606A1 · Petilli · 2020 [cited by examiner]
US 20220231244A1 · Klem · 2022 [cited by examiner]
TW 201422772 · 2014 [cited by applicant]
WO WO2018111220A1 · 2018 [cited by examiner]
U.S. Appl. No. 17/197,314, filed Mar. 10, 2021, Taylor et al. [cited by applicant]
U.S. Appl. No. 17/197,328, filed Mar. 30, 2021, Taylor et al. [cited by applicant]
U.S. Appl. No. 17/230,253, filed Apr. 14, 2021, Judkins, III et al. [cited by applicant]
U.S. Appl. No. 17/230,276, filed Apr. 14, 2021, Cadugan. [cited by applicant]
U.S. Appl. No. 17/230,277, filed Apr. 14, 2021, Judkins, III et al. [cited by applicant]
U.S. Appl. No. 17/352,829, filed Jun. 21, 2021, Huntington et al. [cited by applicant]
U.S. Appl. No. 17/352,937, filed Jun. 21, 2021, Cadugan et al. [cited by applicant]
U.S. Appl. No. 17/376,607, filed Jul. 15, 2021, Stewart et al. [cited by applicant]
U.S. Appl. No. 17/400,300, filed Aug. 12, 2021, Myers et al. [cited by applicant]
U.S. Appl. No. 17/402,065, filed Aug. 13, 2021, Lee et al. [cited by applicant]
U.S. Appl. No. 17/566,763, filed Dec. 31, 2021, Huntington et al. [cited by applicant]
U.S. Appl. No. 17/648,702, filed Jan. 24, 2022, Lee et al. [cited by applicant]
U.S. Appl. No. 17/651,250, filed Feb. 16, 2022, Marshall. [cited by applicant]
U.S. Appl. No. 17/656,977, filed Mar. 29, 2022, Myers et al. [cited by applicant]
U.S. Appl. No. 17/656,978, filed Mar. 29, 2022, Myers et al. [cited by applicant]
U.S. Appl. No. 17/656,981, filed Mar. 29, 2022, Myers et al. [cited by applicant]