Electronic apparatus and cooling module
An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.
1. An electronic apparatus comprising:
a chassis;
first and second heating elements in the chassis; and
a cooling module in the chassis, the cooling module absorbing heat generated from the first and second heating elements,
the cooling module comprising:
a first vapor chamber connected to the first heating element and including two first metal plates defining a first closed space therebetween to contain a first working fluid in the first closed space; and
a second vapor chamber connected to the second heating element and including two second metal plates defining a second closed space therebetween to contain a second working fluid in the second closed space;
the first and second vapor chambers being side-by-side to each other with a step therebetween,
the first vapor chamber having a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward to a surface of the second vapor chamber,
the bridge being outside of the first and second closed spaces.
2. The electronic apparatus according to claim 1 , wherein:
the bridge overlaps the second closed space of the second vapor chamber.
3. The electronic apparatus according to claim 1 , wherein
the first heating element is connected to a first face of the first vapor chamber,
the second heating element is connected to a first face of the second vapor chamber,
the bridge is bonded to a second face of the second vapor chamber, and
the cooling module further comprises:
a first heat pipe including a first metal pipe that is bonded to a second face of the first vapor chamber and passing through a position overlapping the first heating element in a thickness direction of the first vapor chamber, the first heat pipe containing a first working fluid in a first closed space inside the first metal pipe;
a second heat pipe including a second metal pipe that is bonded to the second face of the second vapor chamber and passing through a position overlapping the second heating element in a thickness direction of the second vapor chamber, the second heat pipe containing a second working fluid in a second closed space inside the metal pipe;
a first blower fan;
a second blower fan;
a first cooling fin bonded to an end of the first heat pipe and facing a first exhaust port of the first blower fan; and
a second cooling fin bonded to an end of the second heat pipe and facing a second exhaust port of the second blower fan.
4. The electronic apparatus according to claim 1 , wherein
the first heating element includes a CPU, and
the second heating element includes a GPU.
5. The electronic apparatus according to claim 4 , further comprising:
a motherboard in the chassis and having a mounting face on which the CPU is mounted; and
a sub-board in the chassis, and on which the GPU is mounted,
wherein
the sub-board is stacked above the mounting face of the motherboard on which the CPU is mounted.
6. A cooling module configured to absorb heat from a plurality of heating elements in a chassis of an electronic apparatus, comprising:
a first vapor chamber including two first metal plates defining a first closed space therebetween to contain a first working fluid in the first closed space; and
a second vapor chamber including two second metal plates defining a second closed space therebetween to contain a second working fluid in the second closed space,
the first and second vapor chambers being side-by-side to each other with a step therebetween,
the first vapor chamber having a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending to a surface of the second vapor chamber,
the bridge being outside of the first and second closed spaces.
7. The cooling module according to claim 6 , wherein:
the bridge overlaps with the second closed space of the second vapor chamber.
8. The cooling module according to claim 6 , wherein:
the first vapor chamber has a first face that is a first heat-absorbing face for the heating elements,
the second vapor chamber has a first face that is a second heat-absorbing face for the heating elements,
the bridge is bonded to a second face of the second vapor chamber, and
the cooling module further comprises:
a first heat pipe including a first metal pipe that is bonded to a second face of the first vapor chamber, the first heat pipe containing a second working fluid in a second closed space inside the first metal pipe;
a second heat pipe including a second metal pipe that is bonded to the second face of the second vapor chamber, the second heat pipe containing a second working fluid in a second closed space inside the second metal pipe;
a first blower fan;
a second blower fan;
a first cooling fin bonded to an end of the first heat pipe and facing a first exhaust port of the first blower fan; and
a second cooling fin bonded to an end of the second heat pipe and facing a second exhaust port of the second blower fan.